SY10EL15ZG
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Microchip Technology SY10EL15ZG

Part Number:
SY10EL15ZG
Manufacturer:
Microchip Technology
Ventron No:
2975157-SY10EL15ZG
Description:
IC CLK BUFFER 2:4 16SOIC
ECAD Model:
Datasheet:
SY10EL15ZG
Payment:
Payment
Delivery:
Delivery

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Part Overview
Description
Low skew 1:4 clock distribution chips
Designed for low skew clock distribution applications
Can be driven by differential or singleended ECL or PECL input signals
Multiplexed clock input for distributing a lower speed scan or test clock
Synchronous enable/disable to avoid runt clock pulses
Internal flipflop clocked on the falling edge of the input clock

Features
50ps outputtooutput skew
Synchronous enable/disable
Multiplexed clock input
75KΩ internal input pulldown resistors
Available in 16pin SOIC package

Applications
Clock distribution in highspeed systems
Scan and test clock distribution
Clock buffering and fanout
Specifications
Microchip Technology SY10EL15ZG technical specifications, attributes, parameters and parts with similar specifications to Microchip Technology SY10EL15ZG.
  • Factory Lead Time
    8 Weeks
  • Mount
    Surface Mount
  • Mounting Type

    Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include: * Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side. * Surface-mount: Component is placed on the surface of the PCB and soldered in place. * Press-fit: Component is pressed into place on the PCB without soldering. * Socket: Component is inserted into a socket on the PCB, allowing for easy replacement. The mounting type is determined by factors such as the component's size, shape, and power requirements.

    Surface Mount
  • Package / Case

    Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.

    16-SOIC (0.154, 3.90mm Width)
  • Number of Pins

    Number of Pins: Indicates the number of electrical connections available on the component. These pins are used to connect the component to other components or circuits on a printed circuit board (PCB). The number of pins determines the functionality and connectivity options of the component. It is important to ensure that the component has the correct number of pins for the intended application.

    16
  • Supplier Device Package
    16-SOIC
  • Operating Temperature

    Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.

    -40°C~85°C
  • Packaging
    Tube
  • Published
    2000
  • Series

    Series, in the context of electronic components, refers to the arrangement of components in a circuit. When components are connected in series, they form a single path for current to flow through. The total resistance of a series circuit is the sum of the individual resistances of each component. Series connections are often used to control the flow of current in a circuit, as the total resistance can be adjusted by changing the number or type of components in the series.

    100EL, Precision Edge®
  • Part Status

    Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.

    Obsolete
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.

    1 (Unlimited)
  • Max Operating Temperature
    85°C
  • Min Operating Temperature
    -40°C
  • Voltage - Supply
    4.75V~5.5V
  • Base Part Number
    SY10EL15
  • Output
    ECL, PECL
  • Number of Outputs

    Number of Outputs refers to the number of independent output signals or channels that an electronic component can provide. It indicates the capability of the component to drive multiple external devices or circuits simultaneously. A higher number of outputs allows for greater flexibility and connectivity in electronic systems.

    4
  • Number of Circuits

    Number of Circuits refers to the number of independent signal paths within an electronic component. It indicates how many separate circuits or channels the component can handle simultaneously. For example, an operational amplifier with a Number of Circuits of 2 can amplify two separate input signals independently. This parameter is crucial for determining the component's functionality and its suitability for specific applications.

    1
  • Max Supply Voltage
    -5.7V
  • Min Supply Voltage
    -4.2V
  • Propagation Delay
    750 ps
  • Input
    ECL, PECL
  • Ratio - Input:Output
    2:4
  • Differential - Input:Output
    Yes/Yes
  • Radiation Hardening
    No
  • RoHS Status
    ROHS3 Compliant
  • Lead Free
    Lead Free
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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