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Home > Products > Integrated Circuits (ICs) > Clock/Timing - Clock Buffers, Drivers > SY100E111LJC
SY100E111LJC
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Microchip Technology SY100E111LJC

Part Number:

SY100E111LJC

Manufacturer:

Microchip Technology

Ventron No:

2974867-SY100E111LJC

Description:

IC CLK BUFFER 1:9 28PLCC

ECAD Model:

Datasheet:

SY100E111LJC

Payment:

Payment

Delivery:

Delivery

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Reference Price ( In US Dollars )

Pricing

Qty

Unit Price

Ext Price

  • 1

    $12.8758

    $12.88

  • 190

    $5.1380

    $976.22

  • 494

    $4.9663

    $2453.35

  • 988

    $4.8812

    $4822.63

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    Same Day Delivery

Part Overview

Description
The SY10/100E111A/L are low skew 1to9 differential drivers designed for clock distribution. They accept one signal input, which can be either differential or singleended, and fan it out to 9 identical differential outputs. The E111A/L are specifically designed, modeled, and produced with low skew as the key goal. Optimal design and layout minimize gatetogate skew within a device, and empirical modeling determines process control limits that ensure consistent t distributions from lot to lot.

Features
5V and 3.3V power supply options
200ps parttopart skew
50ps outputtooutput skew
Differential design
VBB output
Voltage and temperature compensated outputs
75KΩ input pulldown resistors
Fully compatible with Motorola MC100LVE111
Available in 28pin PLCC package

Applications
Clock distribution in highperformance systems
Backplane and boardlevel clock distribution
PECL clock distribution
GTL clock distribution

Specifications

Microchip Technology SY100E111LJC technical specifications, attributes, parameters and parts with similar specifications to Microchip Technology SY100E111LJC.

  • Mounting Type

    Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include: * Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side. * Surface-mount: Component is placed on the surface of the PCB and soldered in place. * Press-fit: Component is pressed into place on the PCB without soldering. * Socket: Component is inserted into a socket on the PCB, allowing for easy replacement. The mounting type is determined by factors such as the component's size, shape, and power requirements.

    Surface Mount
  • Package / Case

    Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.

    28-LCC (J-Lead)
  • Supplier Device Package
    28-PLCC (11.48x11.48)
  • Operating Temperature

    Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.

    0°C~85°C
  • Packaging
    Tube
  • Published
    2006
  • Series

    Series, in the context of electronic components, refers to the arrangement of components in a circuit. When components are connected in series, they form a single path for current to flow through. The total resistance of a series circuit is the sum of the individual resistances of each component. Series connections are often used to control the flow of current in a circuit, as the total resistance can be adjusted by changing the number or type of components in the series.

    100E, Precision Edge®
  • Part Status

    Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.

    Discontinued
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.

    1 (Unlimited)
  • Voltage - Supply
    3V~5.5V
  • Base Part Number
    SY100E111
  • Output
    PECL
  • Number of Circuits

    Number of Circuits refers to the number of independent signal paths within an electronic component. It indicates how many separate circuits or channels the component can handle simultaneously. For example, an operational amplifier with a Number of Circuits of 2 can amplify two separate input signals independently. This parameter is crucial for determining the component's functionality and its suitability for specific applications.

    1
  • Input
    PECL
  • Ratio - Input:Output
    1:9
  • Differential - Input:Output
    Yes/Yes
  • RoHS Status
    Non-RoHS Compliant

Certification

  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS
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