NXP USA Inc. SSTU32864EC,518

Name: SSTU32864EC,518
Brand: NXP USA Inc.
SKU: 3224535-SSTU32864EC,518
Availability: InStock
Rating: 5 (1 reviews)

Part Number:: SSTU32864EC,518

Manufacturer:: NXP USA Inc.

Ventron No:: 3224535-SSTU32864EC,518

Description:: IC BUFFER 1.8V 25BIT SOT536-1

ECAD Model:

Datasheet:: SSTU32864EC,518

Specifications

NXP USA Inc. SSTU32864EC,518 technical specifications, attributes, parameters and parts with similar specifications to NXP USA Inc. SSTU32864EC,518.

Mounting Type
Surface Mount
Package / Case
96-LFBGA
Surface Mount
YES
Operating Temperature
0°C~70°C
Packaging
Tape & Reel (TR)
Published
2004
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
96
Additional Feature
14 BIT 1:2 CONFIGURATION ALSO POSSIBLE
HTS Code
8542.39.00.01
Terminal Position
BOTTOM
Terminal Form
BALL
Number of Functions
1
Supply Voltage
1.7V~1.9V
Terminal Pitch
0.8mm
Reach Compliance Code
unknown
Base Part Number
74SSTU32864
Pin Count
96
JESD-30 Code
R-PBGA-B96
Qualification Status
Not Qualified
Number of Bits
25, 14
Logic Type
1:1, 1:2 Configurable Registered Buffer
Output Polarity
TRUE
Trigger Type
POSITIVE EDGE
Propagation Delay (tpd)
2 ns
fmax-Min
450 MHz
Source Url Status Check Date
2013-06-14 00:00:00
Height Seated (Max)
1.5mm
Length
13.5mm
Width
5.5mm
RoHS Status
ROHS3 Compliant

Description

SSTU32864EC,518 Overview
The product is packaged in a 96-LFBGA case and is supplied in Tape & Reel packaging. It was published in 2004 and has a Moisture Sensitivity Level (MSL) of 3, which means it can be exposed to ambient air for up to 168 hours before it needs to be mounted. The Reach Compliance Code is unknown, indicating that its compliance with European Union regulations regarding the registration, evaluation, authorization, and restriction of chemicals is not specified. The JESD-30 Code is R-PBGA-B96, which is a standard code used to specify the package type. The product has a total of 25 bits and 14 logic types, with a configuration of 1:1 or 1:2 Configurable Registered Buffer. The maximum frequency at which it can operate, fmax-Min, is 450 MHz. The maximum height of the product when seated is 1.5mm.

SSTU32864EC,518 Features

SSTU32864EC,518 Applications
There are a lot of NXP USA Inc. SSTU32864EC,518 Specialty Logic ICs applications.

Carrier phase observations
Switching system
Long-distance fiber optic network applications
Precision geodetic measurement
Metro access rings
Pocket PC
Digital systems
Gigabit Ethernet
Wireless teaching
Broadcast application

SSTU32864EC,518 More Descriptions

SSTU SERIES POSITIVE EDGE TRIGGERED D FLIP-FLOP TRUE OUTPUT PBGA96
IC BUFFER 1.8V 25BIT SOT536-1
INTERFACE PRODUCTS

Product Comparison

The three parts on the right have similar specifications to SSTU32864EC,518.

Image

Part Number

Manufacturer

Mounting Type

Package / Case

Surface Mount

Operating Temperature

Packaging

Published

Part Status

Moisture Sensitivity Level (MSL)

Number of Terminations

Additional Feature

HTS Code

Terminal Position

Terminal Form

Number of Functions

Supply Voltage

Terminal Pitch

Reach Compliance Code

Base Part Number

Pin Count

JESD-30 Code

Qualification Status

Number of Bits

Logic Type

Output Polarity

Trigger Type

Propagation Delay (tpd)

fmax-Min

Source Url Status Check Date

Height Seated (Max)

Length

Width

RoHS Status

Mount

Number of Pins

JESD-609 Code

Pbfree Code

ECCN Code

Terminal Finish

Max Operating Temperature

Min Operating Temperature

Subcategory

Peak Reflow Temperature (Cel)

Frequency

Reflow Temperature-Max (s)

Number of Outputs

Number of Elements

Polarity

Temperature Grade

Max Supply Voltage

Min Supply Voltage

Propagation Delay

Logic Function

Output Characteristics

Logic IC Type

High Level Output Current

Low Level Output Current

Clock Edge Trigger Type

Thickness

Lead Free

Technology

Power Supplies

View Compare
SSTU32864EC,518

NXP USA Inc.

Surface Mount

96-LFBGA

YES

0°C~70°C

Tape & Reel (TR)

2004

Obsolete

3 (168 Hours)

96

14 BIT 1:2 CONFIGURATION ALSO POSSIBLE

8542.39.00.01

BOTTOM

BALL

1

1.7V~1.9V

0.8mm

unknown

74SSTU32864

96

R-PBGA-B96

Not Qualified

25, 14

1:1, 1:2 Configurable Registered Buffer

TRUE

POSITIVE EDGE

2 ns

450 MHz

2013-06-14 00:00:00

1.5mm

13.5mm

5.5mm

ROHS3 Compliant

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-
SSTUAF32869AHLFT

IDT, Integrated Device Technology Inc

-

TFBGA

-

-

Tape & Reel (TR)

2006

Discontinued

3

150

-

-

BOTTOM

BALL

1

1.8V

0.65mm

-

-

150

-

Not Qualified

14

-

-

-

-

-

-

-

13mm

8mm

RoHS Compliant

Surface Mount

150

e1

yes

EAR99

Tin/Silver/Copper (Sn/Ag/Cu)

70°C

0°C

Other Logic ICs

260

340MHz

NOT SPECIFIED

28

1

Non-Inverting

COMMERCIAL

1.9V

1.7V

3 ns

Buffer

OPEN-DRAIN

D FLIP-FLOP

-12mA

12mA

Positive Edge

1.2mm

Lead Free

-

-

SSTU32864EC,518 vs SSTUAF32869AHLFT
SSTUA32864EC/G,518

NXP USA Inc.

Surface Mount

96-LFBGA

YES

0°C~70°C

Tape & Reel (TR)

2007

Obsolete

2 (1 Year)

96

-

8542.39.00.01

BOTTOM

BALL

1

1.7V~2V

0.8mm

-

74SSTUA32864

96

R-PBGA-B96

Not Qualified

25, 14

1:1, 1:2 Configurable Registered Buffer

TRUE

POSITIVE EDGE

1.8 ns

450 MHz

-

1.5mm

13.5mm

5.5mm

ROHS3 Compliant

-

-

-

-

-

-

-

-

-

260

-

40

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

SSTU32864EC,518 vs SSTUA32864EC/G,518
SSTUA32864EC/G,557

NXP USA Inc.

Surface Mount

96-LFBGA

YES

0°C~70°C

Tray

2007

Obsolete

3 (168 Hours)

96

-

8542.39.00.01

BOTTOM

BALL

1

1.7V~2V

0.8mm

-

74SSTUA32864

96

R-PBGA-B96

Not Qualified

25, 14

1:1, 1:2 Configurable Registered Buffer

TRUE

POSITIVE EDGE

1.8 ns

450 MHz

-

1.5mm

13.5mm

5.5mm

ROHS3 Compliant

-

-

e1

-

-

TIN SILVER COPPER

-

-

Other Logic ICs

260

-

30

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

CMOS

1.8V

SSTU32864EC,518 vs SSTUA32864EC/G,557