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SST39VF801C-70-4C-B3KE-T

Microchip Technology SST39VF801C-70-4C-B3KE-T

Part Number:
SST39VF801C-70-4C-B3KE-T
Manufacturer:
Microchip Technology
Ventron No:
3231553-SST39VF801C-70-4C-B3KE-T
Description:
IC FLASH 8MBIT 70NS 48TFBGA
ECAD Model:
Datasheet:
SST39VF801C-70-4C-B3KE-T

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Specifications
Microchip Technology SST39VF801C-70-4C-B3KE-T technical specifications, attributes, parameters and parts with similar specifications to Microchip Technology SST39VF801C-70-4C-B3KE-T.
  • Factory Lead Time
    7 Weeks
  • Mounting Type
    Surface Mount
  • Package / Case
    48-TFBGA
  • Surface Mount
    YES
  • Number of Pins
    48
  • Operating Temperature
    0°C~70°C TA
  • Packaging
    Tape & Reel (TR)
  • Published
    2011
  • Series
    SST39 MPF™
  • JESD-609 Code
    e1
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    48
  • Terminal Finish
    Tin/Silver/Copper (Sn/Ag/Cu)
  • Technology
    CMOS
  • Voltage - Supply
    2.7V~3.6V
  • Terminal Position
    BOTTOM
  • Terminal Pitch
    0.8mm
  • Base Part Number
    SST39VF801C
  • Operating Supply Voltage
    3.3V
  • Memory Size
    8Mb 512K x 16
  • Nominal Supply Current
    18mA
  • Memory Type
    Non-Volatile
  • Access Time
    70ns
  • Memory Format
    FLASH
  • Memory Interface
    Parallel
  • Data Bus Width
    16b
  • Organization
    512KX16
  • Memory Width
    16
  • Write Cycle Time - Word, Page
    10μs
  • Address Bus Width
    19b
  • Density
    8 Mb
  • Standby Current-Max
    0.00002A
  • Sync/Async
    Asynchronous
  • Word Size
    16b
  • Data Polling
    YES
  • Toggle Bit
    YES
  • Command User Interface
    YES
  • Number of Sectors/Size
    256
  • Sector Size
    2K
  • Ready/Busy
    YES
  • Boot Block
    BOTTOM
  • Common Flash Interface
    YES
  • Radiation Hardening
    No
  • RoHS Status
    ROHS3 Compliant
Description
SST39VF801C-70-4C-B3KE-T Overview
This particular component is manufactured by Microchip Technology and falls under the category of Memory chips. It is designed to be mounted on the surface of a circuit board. The operating temperature range for this part is 0°C to 70°C, and it has a terminal finish of Tin/Silver/Copper (Sn/Ag/Cu). The technology used in this chip is CMOS, and it requires a voltage supply of 2.7V to 3.6V. The terminals are positioned at the bottom of the chip. The memory size is 8 megabits, with a capacity of 512 kilobytes and a data width of 16 bits. This is a non-volatile memory, meaning it retains data even when power is turned off. The access time for this chip is 70 nanoseconds.

SST39VF801C-70-4C-B3KE-T Features
Package / Case: 48-TFBGA
48 Pins
Operating Supply Voltage:3.3V

SST39VF801C-70-4C-B3KE-T Applications
There are a lot of Microchip Technology SST39VF801C-70-4C-B3KE-T Memory applications.

DVD disk buffer
nonvolatile BIOS memory
telecommunications
cell phones
networking
graphics card
hard disk drive (HDD)
supercomputers
Cache memory
eSRAM
SST39VF801C-70-4C-B3KE-T More Descriptions
Parallel Flash, 2.7 - 3.6 V, 8 Mbit, x16, 70 ns, -40°C to 85°C, TFBGA-48, RoHSMicrochip SCT
Flash Parallel 3.3V 8Mbit 512K x 16bit 70ns 48-Pin TFBGA T/R
3.0V to 3.6V 8Mbit Multi-Purpose Flash
3.0V To 3.6V 8Mbit Multi-Purpose Flash 48 Tfbga 6X8X1.2Mm T/R Rohs Compliant: Yes |Microchip SST39VF801C-70-4C-B3KE-T
IC FLASH 8MBIT PARALLEL 48TFBGA
FLASH MEMORY, 8MBIT, 0 TO 70DEG C;
Product Comparison
The three parts on the right have similar specifications to SST39VF801C-70-4C-B3KE-T.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Mounting Type
    Package / Case
    Surface Mount
    Number of Pins
    Operating Temperature
    Packaging
    Published
    Series
    JESD-609 Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    Terminal Finish
    Technology
    Voltage - Supply
    Terminal Position
    Terminal Pitch
    Base Part Number
    Operating Supply Voltage
    Memory Size
    Nominal Supply Current
    Memory Type
    Access Time
    Memory Format
    Memory Interface
    Data Bus Width
    Organization
    Memory Width
    Write Cycle Time - Word, Page
    Address Bus Width
    Density
    Standby Current-Max
    Sync/Async
    Word Size
    Data Polling
    Toggle Bit
    Command User Interface
    Number of Sectors/Size
    Sector Size
    Ready/Busy
    Boot Block
    Common Flash Interface
    Radiation Hardening
    RoHS Status
    Number of Functions
    Supply Voltage
    JESD-30 Code
    Supply Voltage-Max (Vsup)
    Supply Voltage-Min (Vsup)
    Operating Mode
    Memory Density
    Programming Voltage
    Length
    Height Seated (Max)
    Width
    Peak Reflow Temperature (Cel)
    Time@Peak Reflow Temperature-Max (s)
    View Compare
  • SST39VF801C-70-4C-B3KE-T
    SST39VF801C-70-4C-B3KE-T
    Microchip Technology
    7 Weeks
    Surface Mount
    48-TFBGA
    YES
    48
    0°C~70°C TA
    Tape & Reel (TR)
    2011
    SST39 MPF™
    e1
    Active
    3 (168 Hours)
    48
    Tin/Silver/Copper (Sn/Ag/Cu)
    CMOS
    2.7V~3.6V
    BOTTOM
    0.8mm
    SST39VF801C
    3.3V
    8Mb 512K x 16
    18mA
    Non-Volatile
    70ns
    FLASH
    Parallel
    16b
    512KX16
    16
    10μs
    19b
    8 Mb
    0.00002A
    Asynchronous
    16b
    YES
    YES
    YES
    256
    2K
    YES
    BOTTOM
    YES
    No
    ROHS3 Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • SST39LF020-55-4C-NHE-T
    SST39LF020-55-4C-NHE-T
    Microchip Technology
    12 Weeks
    Surface Mount
    32-LCC (J-Lead)
    YES
    -
    0°C~70°C TA
    Tape & Reel (TR)
    -
    SST39 MPF™
    -
    Active
    3 (168 Hours)
    32
    -
    FLASH - NOR
    3V~3.6V
    QUAD
    1.27mm
    -
    -
    2Mb 256K x 8
    -
    Non-Volatile
    55ns
    FLASH
    Parallel
    -
    256KX8
    8
    20μs
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    ROHS3 Compliant
    1
    3.3V
    R-PQCC-J32
    3.6V
    3V
    ASYNCHRONOUS
    2097152 bit
    3V
    13.97mm
    3.556mm
    11.43mm
    -
    -
    SST39VF801C-70-4C-B3KE-T vs SST39LF020-55-4C-NHE-T
  • SST39VF020-70-4I-WHE-T
    SST39VF020-70-4I-WHE-T
    Microchip Technology
    7 Weeks
    Surface Mount
    32-TFSOP (0.488, 12.40mm Width)
    YES
    -
    -40°C~85°C TA
    Tape & Reel (TR)
    2011
    SST39 MPF™
    -
    Active
    3 (168 Hours)
    32
    -
    FLASH - NOR
    2.7V~3.6V
    DUAL
    0.5mm
    -
    -
    2Mb 256K x 8
    -
    Non-Volatile
    70ns
    FLASH
    Parallel
    -
    256KX8
    8
    20μs
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    ROHS3 Compliant
    1
    3V
    R-PDSO-G32
    3.6V
    2.7V
    ASYNCHRONOUS
    2097152 bit
    2.7V
    12.4mm
    1.2mm
    8mm
    NOT SPECIFIED
    NOT SPECIFIED
    SST39VF801C-70-4C-B3KE-T vs SST39VF020-70-4I-WHE-T
  • SST39LF020-55-4C-WHE-T
    SST39LF020-55-4C-WHE-T
    Microchip Technology
    11 Weeks
    Surface Mount
    32-TFSOP (0.488, 12.40mm Width)
    YES
    -
    0°C~70°C TA
    Tape & Reel (TR)
    2011
    SST39 MPF™
    -
    Active
    3 (168 Hours)
    32
    -
    FLASH - NOR
    3V~3.6V
    DUAL
    0.5mm
    -
    -
    2Mb 256K x 8
    -
    Non-Volatile
    55ns
    FLASH
    Parallel
    -
    256KX8
    8
    20μs
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    ROHS3 Compliant
    1
    3.3V
    R-PDSO-G32
    3.6V
    3V
    ASYNCHRONOUS
    2097152 bit
    3V
    12.4mm
    1.2mm
    8mm
    -
    -
    SST39VF801C-70-4C-B3KE-T vs SST39LF020-55-4C-WHE-T
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS
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