Microchip Technology SST39VF1602C-70-4I-B3KE
- Part Number:
- SST39VF1602C-70-4I-B3KE
- Manufacturer:
- Microchip Technology
- Ventron No:
- 3232278-SST39VF1602C-70-4I-B3KE
- Description:
- IC FLASH 16MBIT 70NS 48TFBGA
- Datasheet:
- SST39VF1602C-70-4I-B3KE
Microchip Technology SST39VF1602C-70-4I-B3KE technical specifications, attributes, parameters and parts with similar specifications to Microchip Technology SST39VF1602C-70-4I-B3KE.
- Factory Lead Time6 Weeks
- Mounting TypeSurface Mount
- Package / Case48-TFBGA
- Surface MountYES
- Number of Pins48
- Operating Temperature-40°C~85°C TA
- PackagingTray
- Published2000
- SeriesSST39 MPF™
- JESD-609 Codee1
- Pbfree Codeyes
- Part StatusActive
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of Terminations48
- ECCN Code3A991.B.1.A
- Terminal FinishTin/Silver/Copper (Sn/Ag/Cu)
- Additional FeatureTOP BOOT BLOCK
- HTS Code8542.32.00.51
- TechnologyCMOS
- Voltage - Supply2.7V~3.6V
- Terminal PositionBOTTOM
- Peak Reflow Temperature (Cel)260
- Number of Functions1
- Supply Voltage3V
- Terminal Pitch0.8mm
- Reflow Temperature-Max (s)40
- Base Part NumberSST39VF1602C
- Pin Count48
- Operating Supply Voltage3.3V
- Supply Voltage-Max (Vsup)3.6V
- Supply Voltage-Min (Vsup)2.7V
- Memory Size16Mb 1M x 16
- Nominal Supply Current18mA
- Memory TypeNon-Volatile
- Access Time70ns
- Memory FormatFLASH
- Memory InterfaceParallel
- Data Bus Width16b
- Organization1MX16
- Memory Width16
- Write Cycle Time - Word, Page10μs
- Address Bus Width20b
- Density16 Mb
- Standby Current-Max0.00002A
- Sync/AsyncAsynchronous
- Word Size16b
- Programming Voltage2.7V
- Data PollingYES
- Toggle BitYES
- Command User InterfaceYES
- Number of Sectors/Size12131
- Sector Size8K4K16K32K
- Ready/BusyYES
- Boot BlockTOP
- Common Flash InterfaceYES
- Height Seated (Max)1.2mm
- Length8mm
- Radiation HardeningNo
- RoHS StatusROHS3 Compliant
- Lead FreeLead Free
SST39VF1602C-70-4I-B3KE Overview
The memory chip has a total of 48 pins and requires a supply voltage of 2.7V to 3.6V. The terminal pitch, or distance between pins, is 0.8mm. The maximum supply voltage is 3.6V. This memory chip is non-volatile, meaning it retains its data even when powered off. It uses a parallel memory interface and has an address bus width of 20 bits. The "Ready/Busy" feature indicates that the chip is ready for use. The "Boot Block" is located at the top of the chip, possibly indicating its primary function. The maximum seated height is 1.2mm, making it a relatively compact memory chip. Overall, this chip has specific specifications that make it suitable for certain applications.
SST39VF1602C-70-4I-B3KE Features
Package / Case: 48-TFBGA
48 Pins
Operating Supply Voltage:3.3V
Additional Feature:TOP BOOT BLOCK
SST39VF1602C-70-4I-B3KE Applications
There are a lot of Microchip Technology SST39VF1602C-70-4I-B3KE Memory applications.
supercomputers
main computer memory
cell phones
Camcorders
eSRAM
servers
printers
hard disk drive (HDD)
networks
personal digital assistants
The memory chip has a total of 48 pins and requires a supply voltage of 2.7V to 3.6V. The terminal pitch, or distance between pins, is 0.8mm. The maximum supply voltage is 3.6V. This memory chip is non-volatile, meaning it retains its data even when powered off. It uses a parallel memory interface and has an address bus width of 20 bits. The "Ready/Busy" feature indicates that the chip is ready for use. The "Boot Block" is located at the top of the chip, possibly indicating its primary function. The maximum seated height is 1.2mm, making it a relatively compact memory chip. Overall, this chip has specific specifications that make it suitable for certain applications.
SST39VF1602C-70-4I-B3KE Features
Package / Case: 48-TFBGA
48 Pins
Operating Supply Voltage:3.3V
Additional Feature:TOP BOOT BLOCK
SST39VF1602C-70-4I-B3KE Applications
There are a lot of Microchip Technology SST39VF1602C-70-4I-B3KE Memory applications.
supercomputers
main computer memory
cell phones
Camcorders
eSRAM
servers
printers
hard disk drive (HDD)
networks
personal digital assistants
SST39VF1602C-70-4I-B3KE More Descriptions
SST39VF Series 16 Mbit 1 M x 16 3.3 V Parallel Flash Memory SMT - TFBGA-48
Parallel Flash, 2.7 - 3.6 V, 16 Mbit, x16, 70 ns, -40°C to 85°C, TFBGA-48, RoHSMicrochip SCT
Flash Parallel 3.3V 16Mbit 1M x 16bit 70ns 48-Pin TFBGA
2.7V to 3.6V 16Mbit Multi-Purpose Flash
Flash Memory, 16M (1Mx16) 70ns Industrial Temp | Microchip Technology Inc. SST39VF1602C-70-4I-B3KE
TFBGA-48 Pre-ordered MCUs ROHS
IC FLASH 16MBIT PARALLEL 48TFBGA
NOR Flash 16M (1Mx16) 70ns Industrial Temp
2.7V To 3.6V 16Mbit Multi-Purpose Flash 48 Tfbga 6X8X1.2Mm Tray Rohs Compliant: Yes |Microchip SST39VF1602C-70-4I-B3KE
FLASH MEMORY, 16MBIT, -40 TO 85DEG C;
Parallel Flash, 2.7 - 3.6 V, 16 Mbit, x16, 70 ns, -40°C to 85°C, TFBGA-48, RoHSMicrochip SCT
Flash Parallel 3.3V 16Mbit 1M x 16bit 70ns 48-Pin TFBGA
2.7V to 3.6V 16Mbit Multi-Purpose Flash
Flash Memory, 16M (1Mx16) 70ns Industrial Temp | Microchip Technology Inc. SST39VF1602C-70-4I-B3KE
TFBGA-48 Pre-ordered MCUs ROHS
IC FLASH 16MBIT PARALLEL 48TFBGA
NOR Flash 16M (1Mx16) 70ns Industrial Temp
2.7V To 3.6V 16Mbit Multi-Purpose Flash 48 Tfbga 6X8X1.2Mm Tray Rohs Compliant: Yes |Microchip SST39VF1602C-70-4I-B3KE
FLASH MEMORY, 16MBIT, -40 TO 85DEG C;
The three parts on the right have similar specifications to SST39VF1602C-70-4I-B3KE.
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ImagePart NumberManufacturerFactory Lead TimeMounting TypePackage / CaseSurface MountNumber of PinsOperating TemperaturePackagingPublishedSeriesJESD-609 CodePbfree CodePart StatusMoisture Sensitivity Level (MSL)Number of TerminationsECCN CodeTerminal FinishAdditional FeatureHTS CodeTechnologyVoltage - SupplyTerminal PositionPeak Reflow Temperature (Cel)Number of FunctionsSupply VoltageTerminal PitchReflow Temperature-Max (s)Base Part NumberPin CountOperating Supply VoltageSupply Voltage-Max (Vsup)Supply Voltage-Min (Vsup)Memory SizeNominal Supply CurrentMemory TypeAccess TimeMemory FormatMemory InterfaceData Bus WidthOrganizationMemory WidthWrite Cycle Time - Word, PageAddress Bus WidthDensityStandby Current-MaxSync/AsyncWord SizeProgramming VoltageData PollingToggle BitCommand User InterfaceNumber of Sectors/SizeSector SizeReady/BusyBoot BlockCommon Flash InterfaceHeight Seated (Max)LengthRadiation HardeningRoHS StatusLead FreeJESD-30 CodeOperating ModeMemory DensityWidthTime@Peak Reflow Temperature-Max (s)View Compare
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SST39VF1602C-70-4I-B3KE6 WeeksSurface Mount48-TFBGAYES48-40°C~85°C TATray2000SST39 MPF™e1yesActive3 (168 Hours)483A991.B.1.ATin/Silver/Copper (Sn/Ag/Cu)TOP BOOT BLOCK8542.32.00.51CMOS2.7V~3.6VBOTTOM26013V0.8mm40SST39VF1602C483.3V3.6V2.7V16Mb 1M x 1618mANon-Volatile70nsFLASHParallel16b1MX161610μs20b16 Mb0.00002AAsynchronous16b2.7VYESYESYES121318K4K16K32KYESTOPYES1.2mm8mmNoROHS3 CompliantLead Free------
-
7 WeeksSurface Mount32-LCC (J-Lead)YES--40°C~85°C TATape & Reel (TR)2011SST39 MPF™--Active3 (168 Hours)32----FLASH - NOR2.7V~3.6VQUAD-13V1.27mm----3.6V2.7V2Mb 256K x 8-Non-Volatile70nsFLASHParallel-256KX8820μs-----2.7V--------3.556mm13.97mm-ROHS3 Compliant-R-PQCC-J32ASYNCHRONOUS2097152 bit11.43mm-
-
7 WeeksSurface Mount32-TFSOP (0.488, 12.40mm Width)YES--40°C~85°C TATape & Reel (TR)2011SST39 MPF™--Active3 (168 Hours)32----FLASH - NOR2.7V~3.6VDUALNOT SPECIFIED13V0.5mm----3.6V2.7V2Mb 256K x 8-Non-Volatile70nsFLASHParallel-256KX8820μs-----2.7V--------1.2mm12.4mm-ROHS3 Compliant-R-PDSO-G32ASYNCHRONOUS2097152 bit8mmNOT SPECIFIED
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-Surface Mount48-TFBGAYES--40°C~85°C TATape & Reel (TR)-Automotive, AEC-Q100--Active3 (168 Hours)48----CMOS2.7V~3.6VBOTTOM-13V0.8mm----3.6V2.7V32Mb 2M x 16-Non-Volatile70nsFLASHParallel-2MX161610μs-----2.7V--------1.2mm8mm-ROHS3 Compliant-R-PBGA-B48ASYNCHRONOUS33554432 bit6mm-
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