AVX Corporation SR202A751JAA

Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.

Series, in the context of electronic components, refers to the arrangement of components in a circuit. When components are connected in series, they form a single path for current to flow through. The total resistance of a series circuit is the sum of the individual resistances of each component. Series connections are often used to control the flow of current in a circuit, as the total resistance can be adjusted by changing the number or type of components in the series.

Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.

Temperature Coefficient (TC) measures the relative change in a component's value due to temperature variations. It is expressed as a percentage change per degree Celsius (°C). A positive TC indicates an increase in value with increasing temperature, while a negative TC indicates a decrease. TC is crucial for ensuring stable circuit performance over a range of temperatures. It helps designers compensate for temperature-induced changes and maintain desired component characteristics.

Capacitance is the ability of a component to store electrical charge. It is measured in farads (F). A capacitor is a passive electronic component that consists of two conductors separated by an insulator. When a voltage is applied across the capacitor, charge builds up on the conductors. The amount of charge that can be stored depends on the capacitance of the capacitor. Capacitors are used in a variety of electronic circuits, including filters, timing circuits, and energy storage devices.

Dielectric is a non-conducting material that can store electrical energy when subjected to an electric field. It is used in capacitors to increase their capacitance and energy storage capacity. The dielectric constant of a material is a measure of its ability to store electrical energy, with higher values indicating greater storage capacity. Common dielectric materials include ceramics, plastics, and electrolytes.

Lead spacing refers to the distance between the centers of two adjacent leads on an electronic component. It is typically measured in millimeters (mm) or inches (in). Lead spacing is an important parameter to consider when designing printed circuit boards (PCBs), as it determines the size and layout of the board. Proper lead spacing ensures that the component can be properly mounted and soldered onto the PCB, and that there is sufficient clearance between the leads to prevent short circuits.

Thickness, in the context of electronic components, refers to the vertical distance between two opposing surfaces of a component. It is typically measured in millimeters (mm) or inches (in). Thickness is a crucial parameter that affects the component's physical dimensions, weight, and performance characteristics. It influences factors such as heat dissipation, electrical insulation, and mechanical stability. Thinner components generally offer better heat dissipation and space efficiency, while thicker components may provide enhanced durability and structural integrity.