SN74ABT541BDBR
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Texas Instruments SN74ABT541BDBR

Part Number:
SN74ABT541BDBR
Manufacturer:
Texas Instruments
Ventron No:
3200446-SN74ABT541BDBR
Description:
IC BUFF/DVR TRI-ST 8BIT 20SSOP
ECAD Model:
Datasheet:
sn74abt541b
Payment:
Payment
Delivery:
Delivery

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Reference Price ( In US Dollars )

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Unit Price

Ext Price

  • 1

    $2.3245

    $2.32

  • 10

    $2.2704

    $22.70

  • 30

    $2.2349

    $67.05

  • 100

    $2.1994

    $219.94

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Part Overview
Description
The SN54ABT541 and SN74ABT541B octal buffers and line drivers are ideal for driving bus lines or buffering memory address registers. The devices feature inputs and outputs on opposite sides of the package to facilitate printed circuit board layout.

Features
State-of-the-art EPIC-IIB™ BICMOS design significantly reduces power dissipation
Latch-up performance exceeds 500 mA per JEDEC standard JESD-17
Typical VOLP (Output Ground Bounce) < 1 V at Vcc = 5 V, TA = 25°C
High-impedance state during power up and power down
High-drive outputs (-32-mA IOH, 64-mA IOL)
Package options include plastic small-outline (DW), shrink small-outline (DB), and thin shrink small-outline (PW) packages, ceramic chip carriers (FK), ceramic flat (W) package, and plastic (N) and ceramic (J) DIPs

Applications
Driving bus lines
Buffering memory address registers
Specifications
Texas Instruments SN74ABT541BDBR technical specifications, attributes, parameters and parts with similar specifications to Texas Instruments SN74ABT541BDBR.
  • Factory Lead Time
    6 Weeks
  • Lifecycle Status
    ACTIVE (Last Updated: 1 week ago)
  • Contact Plating
    Gold
  • Mount
    Surface Mount
  • Mounting Type

    Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include: * Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side. * Surface-mount: Component is placed on the surface of the PCB and soldered in place. * Press-fit: Component is pressed into place on the PCB without soldering. * Socket: Component is inserted into a socket on the PCB, allowing for easy replacement. The mounting type is determined by factors such as the component's size, shape, and power requirements.

    Surface Mount
  • Package / Case

    Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.

    20-SSOP (0.209, 5.30mm Width)
  • Number of Pins

    Number of Pins: Indicates the number of electrical connections available on the component. These pins are used to connect the component to other components or circuits on a printed circuit board (PCB). The number of pins determines the functionality and connectivity options of the component. It is important to ensure that the component has the correct number of pins for the intended application.

    20
  • Operating Temperature

    Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.

    -40°C~85°C TA
  • Packaging
    Cut Tape (CT)
  • Series

    Series, in the context of electronic components, refers to the arrangement of components in a circuit. When components are connected in series, they form a single path for current to flow through. The total resistance of a series circuit is the sum of the individual resistances of each component. Series connections are often used to control the flow of current in a circuit, as the total resistance can be adjusted by changing the number or type of components in the series.

    74ABT
  • JESD-609 Code
    e4
  • Pbfree Code
    yes
  • Part Status

    Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.

    Active
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.

    1 (Unlimited)
  • Number of Terminations
    20
  • ECCN Code
    EAR99
  • Additional Feature
    WITH DUAL OUTPUT ENABLE
  • Subcategory
    Bus Driver/Transceiver
  • Packing Method
    TR
  • Technology

    Technology, in the context of electronic components, refers to the specific manufacturing process and materials used to create the component. It encompasses the semiconductor fabrication techniques, such as the type of transistor used (e.g., MOSFET, BJT), the gate oxide thickness, and the interconnect materials. Technology also includes the packaging type, such as surface mount or through-hole, and the leadframe or substrate material. The technology used impacts the component's performance characteristics, such as speed, power consumption, and reliability.

    BICMOS
  • Voltage - Supply
    4.5V~5.5V
  • Terminal Position
    DUAL
  • Terminal Form
    GULL WING
  • Peak Reflow Temperature (Cel)
    260
  • Number of Functions
    1
  • Supply Voltage

    Supply Voltage is the voltage required to power an electronic component. It is typically measured in volts (V) and is specified in the component's datasheet. The supply voltage must be within the specified range for the component to function properly. If the supply voltage is too low, the component may not function at all. If the supply voltage is too high, the component may be damaged.

    5V
  • Terminal Pitch
    0.65mm
  • Base Part Number
    74ABT541
  • Pin Count
    20
  • Number of Outputs

    Number of Outputs refers to the number of independent output signals or channels that an electronic component can provide. It indicates the capability of the component to drive multiple external devices or circuits simultaneously. A higher number of outputs allows for greater flexibility and connectivity in electronic systems.

    8
  • Output Type

    Output type refers to the type of signal or power that an electronic component can produce. It can be analog or digital, AC or DC, and can vary in voltage, current, or power levels. The output type is determined by the component's design and is crucial for matching it with other components in a circuit. Understanding the output type ensures proper signal processing, power delivery, and overall system functionality.

    3-State
  • Operating Supply Voltage
    5V
  • Number of Elements
    1
  • Polarity

    Polarity refers to the direction of current flow through an electronic component. It is typically indicated by a plus (+) or minus (-) sign on the component's body. Components with polarity must be connected correctly in a circuit to function properly. For example, a diode will only allow current to flow in one direction, from the positive terminal to the negative terminal. If a diode is connected backwards, it will not conduct current.

    Non-Inverting
  • Power Supplies
    5V
  • Number of Channels

    Number of Channels refers to the number of independent signal paths within an electronic component. It indicates how many separate signals can be processed or transmitted simultaneously. For example, an audio amplifier with two channels can amplify two separate audio signals, while a multi-channel data converter can convert multiple analog signals into digital data. The number of channels is a crucial parameter for determining the component's functionality and application.

    8
  • Load Capacitance

    Load Capacitance (CL) is a parameter that specifies the maximum capacitance that can be connected to the output of an electronic component without affecting its performance. It is typically measured in picofarads (pF) or nanofarads (nF). A high load capacitance can cause the output voltage to drop or the output current to increase, which can lead to instability or damage to the component.

    50pF
  • Number of Ports

    Number of Ports refers to the number of electrical connections or terminals available on an electronic component. It indicates the number of external devices or signals that can be connected to the component. For example, a transistor may have three ports (emitter, base, and collector), while a resistor has two ports (terminals). The number of ports determines the functionality and connectivity options of the component within a circuit.

    2
  • Number of Bits
    8
  • Propagation Delay
    5.9 ns
  • Quiescent Current

    Quiescent current is the amount of current drawn by an electronic component when it is not actively performing its intended function. It is typically measured in milliamps (mA) or microamps (µA). Quiescent current is important because it can affect the overall power consumption of a circuit, especially in battery-powered devices. Components with high quiescent current can drain batteries more quickly than those with low quiescent current.

    30mA
  • Turn On Delay Time
    5.9 ns
  • Family
    ABT
  • Logic Function
    AND, Buffer, Inverting
  • Current - Output High, Low
    32mA 64mA
  • Logic Type

    Logic Type refers to the type of logic implemented by an electronic component, such as a logic gate or flip-flop.

    Buffer, Non-Inverting
  • Max I(ol)
    0.064 A
  • Control Type
    ENABLE LOW
  • Count Direction
    UNIDIRECTIONAL
  • Height

    Height, in the context of electronic components, refers to the vertical dimension of the component. It is typically measured in millimeters (mm) or inches (in). Height is an important parameter to consider when designing and assembling electronic circuits, as it affects the overall size and form factor of the device. Components with a smaller height are often preferred for applications where space is limited, such as in portable devices or embedded systems.

    2mm
  • Length

    Length, in the context of electronic components, refers to the physical dimension of a component along its longest axis. It is typically measured in millimeters (mm) or inches (in). Length is a crucial parameter for determining the physical size and space requirements of a component on a printed circuit board (PCB) or other assembly. It also affects the component's electrical characteristics, such as inductance and capacitance, which can be influenced by the length of conductors or traces within the component.

    7.2mm
  • Width
    5.3mm
  • Thickness

    Thickness, in the context of electronic components, refers to the vertical distance between two opposing surfaces of a component. It is typically measured in millimeters (mm) or inches (in). Thickness is a crucial parameter that affects the component's physical dimensions, weight, and performance characteristics. It influences factors such as heat dissipation, electrical insulation, and mechanical stability. Thinner components generally offer better heat dissipation and space efficiency, while thicker components may provide enhanced durability and structural integrity.

    1.95mm
  • Radiation Hardening
    No
  • RoHS Status
    ROHS3 Compliant
  • Lead Free
    Lead Free
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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