Cypress Semiconductor Corp S29GL512S11DHIV10
- Part Number:
- S29GL512S11DHIV10
- Manufacturer:
- Cypress Semiconductor Corp
- Ventron No:
- 3229929-S29GL512S11DHIV10
- Description:
- IC FLASH 512MBIT 110NS 64BGA
- ECAD Model:
-
- Datasheet:
- S29GL512S11DHIV10
Cypress Semiconductor Corp S29GL512S11DHIV10 technical specifications, attributes, parameters and parts with similar specifications to Cypress Semiconductor Corp S29GL512S11DHIV10.
- Factory Lead Time13 Weeks
- MountSurface Mount
- Mounting TypeSurface Mount
- Package / Case64-LBGA
- Number of Pins64
- Operating Temperature-40°C~85°C TA
- PackagingTray
- Published2003
- SeriesGL-S
- JESD-609 Codee1
- Part StatusActive
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of Terminations64
- Terminal FinishTin/Silver/Copper (Sn/Ag/Cu)
- HTS Code8542.32.00.51
- TechnologyFLASH - NOR
- Voltage - Supply1.65V~3.6V
- Terminal PositionBOTTOM
- Peak Reflow Temperature (Cel)260
- Number of Functions1
- Supply Voltage3V
- Terminal Pitch1mm
- Reflow Temperature-Max (s)40
- Supply Voltage-Max (Vsup)3.6V
- Power Supplies3/3.3V
- Supply Voltage-Min (Vsup)2.7V
- Memory Size512Mb 32M x 16
- Nominal Supply Current60mA
- Memory TypeNon-Volatile
- Access Time110ns
- Memory FormatFLASH
- Memory InterfaceParallel
- Data Bus Width16b
- Memory Width8
- Write Cycle Time - Word, Page60ns
- Address Bus Width25b
- Density512 Mb
- Standby Current-Max0.0001A
- Sync/AsyncAsynchronous
- Word Size16b
- Programming Voltage2.7V
- Data PollingYES
- Toggle BitYES
- Command User InterfaceYES
- Number of Sectors/Size512
- Sector Size64K
- Page Size32B
- Ready/BusyYES
- Boot BlockBOTTOM/TOP
- Common Flash InterfaceYES
- Height Seated (Max)1.4mm
- Length9mm
- Radiation HardeningNo
- REACH SVHCNo SVHC
- RoHS StatusROHS3 Compliant
S29GL512S11DHIV10 Overview
The Memory chip produced by Cypress Semiconductor Corp belongs to the Memory category and has a density of 512 Mb. It has a Surface Mount mounting type and can operate in temperatures ranging from -40°C to 85°C. The chip has 64 terminations, with the terminal position located at the bottom. It uses FLASH as its memory format and supports data polling and a Ready/Busy function. The Boot Block is located at the bottom or top, and the chip is also ROHS3 Compliant.
S29GL512S11DHIV10 Features
Package / Case: 64-LBGA
64 Pins
S29GL512S11DHIV10 Applications
There are a lot of Cypress Semiconductor Corp S29GL512S11DHIV10 Memory applications.
networks
DVD disk buffer
supercomputers
nonvolatile BIOS memory
telecommunications
personal digital assistants
eSRAM
mainframes
cell phones
hard disk drive (HDD)
The Memory chip produced by Cypress Semiconductor Corp belongs to the Memory category and has a density of 512 Mb. It has a Surface Mount mounting type and can operate in temperatures ranging from -40°C to 85°C. The chip has 64 terminations, with the terminal position located at the bottom. It uses FLASH as its memory format and supports data polling and a Ready/Busy function. The Boot Block is located at the bottom or top, and the chip is also ROHS3 Compliant.
S29GL512S11DHIV10 Features
Package / Case: 64-LBGA
64 Pins
S29GL512S11DHIV10 Applications
There are a lot of Cypress Semiconductor Corp S29GL512S11DHIV10 Memory applications.
networks
DVD disk buffer
supercomputers
nonvolatile BIOS memory
telecommunications
personal digital assistants
eSRAM
mainframes
cell phones
hard disk drive (HDD)
S29GL512S11DHIV10 More Descriptions
NOR Flash Parallel 3V/3.3V 512M-bit 32M x 16 110ns 64-Pin Fortified BGA Tray
GL-S Series 512 Mb (32 M x 16) 3.6 Surface Mount Flash Memory - FBGA-64
MEMORY, FLASH, 512MB, 3V, 64FBGA; Flash Memory Type: Parallel NOR; Memory Size: 512Mbit; Flash Memory Configuration: 32M x 16bit; IC Interface Type: Parallel; Memory Case Style: FBGA; No. of Pins: 64Pins; Clock Frequency: -; Ac
Flash Memory, 512 Mbit, 110 Ns, 64-Bga; Flash Memory Type:Parallel Nor; Memory Configuration:32M X 16Bit; Interfaces:Parallel; Ic Case/Package:Fbga; No. Of Pins:64Pins; Clock Frequency Max:-; Access Time:110Ns Rohs Compliant: Yes |Cypress Infineon Technologies S29GL512S11DHIV10
GL-S Series 512 Mb (32 M x 16) 3.6 Surface Mount Flash Memory - FBGA-64
MEMORY, FLASH, 512MB, 3V, 64FBGA; Flash Memory Type: Parallel NOR; Memory Size: 512Mbit; Flash Memory Configuration: 32M x 16bit; IC Interface Type: Parallel; Memory Case Style: FBGA; No. of Pins: 64Pins; Clock Frequency: -; Ac
Flash Memory, 512 Mbit, 110 Ns, 64-Bga; Flash Memory Type:Parallel Nor; Memory Configuration:32M X 16Bit; Interfaces:Parallel; Ic Case/Package:Fbga; No. Of Pins:64Pins; Clock Frequency Max:-; Access Time:110Ns Rohs Compliant: Yes |Cypress Infineon Technologies S29GL512S11DHIV10
The three parts on the right have similar specifications to S29GL512S11DHIV10.
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ImagePart NumberManufacturerFactory Lead TimeMountMounting TypePackage / CaseNumber of PinsOperating TemperaturePackagingPublishedSeriesJESD-609 CodePart StatusMoisture Sensitivity Level (MSL)Number of TerminationsTerminal FinishHTS CodeTechnologyVoltage - SupplyTerminal PositionPeak Reflow Temperature (Cel)Number of FunctionsSupply VoltageTerminal PitchReflow Temperature-Max (s)Supply Voltage-Max (Vsup)Power SuppliesSupply Voltage-Min (Vsup)Memory SizeNominal Supply CurrentMemory TypeAccess TimeMemory FormatMemory InterfaceData Bus WidthMemory WidthWrite Cycle Time - Word, PageAddress Bus WidthDensityStandby Current-MaxSync/AsyncWord SizeProgramming VoltageData PollingToggle BitCommand User InterfaceNumber of Sectors/SizeSector SizePage SizeReady/BusyBoot BlockCommon Flash InterfaceHeight Seated (Max)LengthRadiation HardeningREACH SVHCRoHS StatusECCN CodeSupplier Device PackageView Compare
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S29GL512S11DHIV1013 WeeksSurface MountSurface Mount64-LBGA64-40°C~85°C TATray2003GL-Se1Active3 (168 Hours)64Tin/Silver/Copper (Sn/Ag/Cu)8542.32.00.51FLASH - NOR1.65V~3.6VBOTTOM26013V1mm403.6V3/3.3V2.7V512Mb 32M x 1660mANon-Volatile110nsFLASHParallel16b860ns25b512 Mb0.0001AAsynchronous16b2.7VYESYESYES51264K32BYESBOTTOM/TOPYES1.4mm9mmNoNo SVHCROHS3 Compliant--- -
13 WeeksSurface MountSurface Mount64-LBGA64-40°C~85°C TATray2015GL-Se1Active3 (168 Hours)64Tin/Silver/Copper (Sn/Ag/Cu)8542.32.00.51FLASH - NOR2.7V~3.6VBOTTOM26013V1mm403.6V3/3.3V2.7V1Gb 64M x 1660mANon-Volatile100nsFLASHParallel-1660ns26b1 Gb0.0001AAsynchronous16b3VYESYESYES1K64K32BYES-YES1.4mm13mmNo-ROHS3 Compliant3A991.B.1.A-
-
--Surface Mount64-LBGA--40°C~85°C TATape & Reel (TR)2015GL-P-Obsolete3 (168 Hours)---FLASH - NOR3V~3.6V---------1Gb 128M x 8-Non-Volatile110nsFLASHParallel--110ns-------------------ROHS3 Compliant-64-Fortified BGA (13x11)
-
--Surface Mount56-TFSOP (0.724, 18.40mm Width)--40°C~85°C TATray2016GL-P-Obsolete3 (168 Hours)---FLASH - NOR3V~3.6V---------1Gb 128M x 8-Non-Volatile130nsFLASHParallel--130ns-------------------ROHS3 Compliant-56-TSOP
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