S29GL128S90FHI010

Cypress Semiconductor Corp S29GL128S90FHI010

Part Number:
S29GL128S90FHI010
Manufacturer:
Cypress Semiconductor Corp
Ventron No:
3233165-S29GL128S90FHI010
Description:
IC FLASH 128MBIT 90NS 64BGA
ECAD Model:
Datasheet:
S29GL128S90FHI010

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Specifications
Cypress Semiconductor Corp S29GL128S90FHI010 technical specifications, attributes, parameters and parts with similar specifications to Cypress Semiconductor Corp S29GL128S90FHI010.
  • Factory Lead Time
    13 Weeks
  • Mount
    Surface Mount
  • Mounting Type
    Surface Mount
  • Package / Case
    64-LBGA
  • Number of Pins
    64
  • Operating Temperature
    -40°C~85°C TA
  • Packaging
    Tray
  • Published
    2015
  • Series
    GL-S
  • JESD-609 Code
    e1
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    64
  • ECCN Code
    3A991.B.1.A
  • Terminal Finish
    Tin/Silver/Copper (Sn/Ag/Cu)
  • HTS Code
    8542.32.00.51
  • Technology
    FLASH - NOR
  • Voltage - Supply
    2.7V~3.6V
  • Terminal Position
    BOTTOM
  • Peak Reflow Temperature (Cel)
    260
  • Number of Functions
    1
  • Supply Voltage
    3V
  • Terminal Pitch
    1mm
  • Reflow Temperature-Max (s)
    30
  • Supply Voltage-Max (Vsup)
    3.6V
  • Power Supplies
    3/3.3V
  • Supply Voltage-Min (Vsup)
    2.7V
  • Memory Size
    128Mb 8M x 16
  • Nominal Supply Current
    60mA
  • Memory Type
    Non-Volatile
  • Access Time
    90ns
  • Memory Format
    FLASH
  • Memory Interface
    Parallel
  • Organization
    8MX16
  • Memory Width
    16
  • Write Cycle Time - Word, Page
    60ns
  • Address Bus Width
    23b
  • Density
    128 Mb
  • Standby Current-Max
    0.0001A
  • Sync/Async
    Asynchronous
  • Word Size
    16b
  • Programming Voltage
    2.7V
  • Data Polling
    YES
  • Toggle Bit
    YES
  • Command User Interface
    YES
  • Number of Sectors/Size
    128
  • Sector Size
    64K
  • Page Size
    32B
  • Ready/Busy
    YES
  • Common Flash Interface
    YES
  • Height Seated (Max)
    1.4mm
  • Length
    13mm
  • Radiation Hardening
    No
  • RoHS Status
    ROHS3 Compliant
Description
S29GL128S90FHI010 Overview
Cypress Semiconductor Corp is a well-known brand in the semiconductor industry, specializing in the production of high-quality memory chips. As a Memory chip, it falls under the Memory category, which is a crucial component in electronic devices, responsible for storing and retrieving data. The Mounting Type of this particular chip is Surface Mount, which refers to the process of attaching the chip directly onto the surface of a printed circuit board (PCB). This method is widely used in modern electronics due to its space-saving and cost-effective nature. One of the key features of this Cypress Semiconductor Corp chip is its Terminal Finish, which is Tin/Silver/Copper (Sn/Ag/Cu). This refers to the type of material used to coat the terminals of the chip, providing protection against corrosion and ensuring efficient electrical conductivity. Additionally, the chip has a Reflow Temperature-Max (s) of 30, which is the maximum temperature at which the chip can be exposed during the reflow soldering process without causing damage. When it comes to power supply, the Supply Voltage-Max (Vsup) of this chip is 3.6V, which is the maximum voltage that can be safely applied to the chip without risking damage. The Memory Interface of this chip is Parallel, meaning that it can transfer data simultaneously on multiple data lines, resulting in faster data transfer speeds. The Memory Width of this chip is 16, indicating the number of data lines it can support. Another important parameter to consider is the Write Cycle Time - Word, Page, which is 60ns for this chip. This refers to the time it takes for the chip to complete a write cycle, which is the process of storing data onto the chip. A shorter write cycle time means faster data storage and retrieval, making this chip ideal for high-performance applications. In terms of addressing, this Cypress Semiconductor Corp chip has an Address Bus Width of 23b, meaning it can support up to 23 bits of address lines. This allows for a larger memory capacity and more efficient data access. Additionally, the chip requires a Programming Voltage of 2.7V, which is the voltage needed to program the chip with specific data. Lastly, the Height Seated (Max) of this chip is 1.4mm, which is the maximum height of the chip when it is mounted on a PCB. This is an important consideration for designers as it affects the overall size and layout of the electronic device. In conclusion, the Cypress Semiconductor Corp Memory chip offers a range of parameters that make it a reliable and efficient choice for various electronic applications.

S29GL128S90FHI010 Features
Package / Case: 64-LBGA
64 Pins

S29GL128S90FHI010 Applications
There are a lot of Cypress Semiconductor Corp S29GL128S90FHI010 Memory applications.

embedded logic
graphics card
personal computers
main computer memory
servers
telecommunications
networking
nonvolatile BIOS memory
cell phones
hard disk drive (HDD)
S29GL128S90FHI010 More Descriptions
NOR Flash Parallel 3V/3.3V 128Mbit 8M x 16bit 90ns 64-Pin FBGA Tray
Nor/Tray |Cypress Infineon Technologies S29GL128S90FHI010
IC FLASH 128MBIT PARALLEL 64FBGA
Product Comparison
The three parts on the right have similar specifications to S29GL128S90FHI010.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Mount
    Mounting Type
    Package / Case
    Number of Pins
    Operating Temperature
    Packaging
    Published
    Series
    JESD-609 Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    ECCN Code
    Terminal Finish
    HTS Code
    Technology
    Voltage - Supply
    Terminal Position
    Peak Reflow Temperature (Cel)
    Number of Functions
    Supply Voltage
    Terminal Pitch
    Reflow Temperature-Max (s)
    Supply Voltage-Max (Vsup)
    Power Supplies
    Supply Voltage-Min (Vsup)
    Memory Size
    Nominal Supply Current
    Memory Type
    Access Time
    Memory Format
    Memory Interface
    Organization
    Memory Width
    Write Cycle Time - Word, Page
    Address Bus Width
    Density
    Standby Current-Max
    Sync/Async
    Word Size
    Programming Voltage
    Data Polling
    Toggle Bit
    Command User Interface
    Number of Sectors/Size
    Sector Size
    Page Size
    Ready/Busy
    Common Flash Interface
    Height Seated (Max)
    Length
    Radiation Hardening
    RoHS Status
    Surface Mount
    Time@Peak Reflow Temperature-Max (s)
    Supply Current-Max
    Access Time (Max)
    Alternate Memory Width
    Width
    Contact Plating
    Supplier Device Package
    Max Operating Temperature
    Min Operating Temperature
    Interface
    Max Supply Voltage
    Min Supply Voltage
    View Compare
  • S29GL128S90FHI010
    S29GL128S90FHI010
    13 Weeks
    Surface Mount
    Surface Mount
    64-LBGA
    64
    -40°C~85°C TA
    Tray
    2015
    GL-S
    e1
    Active
    3 (168 Hours)
    64
    3A991.B.1.A
    Tin/Silver/Copper (Sn/Ag/Cu)
    8542.32.00.51
    FLASH - NOR
    2.7V~3.6V
    BOTTOM
    260
    1
    3V
    1mm
    30
    3.6V
    3/3.3V
    2.7V
    128Mb 8M x 16
    60mA
    Non-Volatile
    90ns
    FLASH
    Parallel
    8MX16
    16
    60ns
    23b
    128 Mb
    0.0001A
    Asynchronous
    16b
    2.7V
    YES
    YES
    YES
    128
    64K
    32B
    YES
    YES
    1.4mm
    13mm
    No
    ROHS3 Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • S29GL01GP13FAIV10
    -
    -
    Surface Mount
    64-LBGA
    64
    -40°C~85°C TA
    Tray
    2015
    GL-P
    e0
    Obsolete
    3 (168 Hours)
    64
    3A991.B.1.A
    TIN LEAD
    8542.32.00.51
    FLASH - NOR
    1.65V~3.6V
    BOTTOM
    240
    1
    3V
    1mm
    -
    3.6V
    1.8/3.33/3.3V
    2.7V
    1Gb 128M x 8
    -
    Non-Volatile
    -
    FLASH
    Parallel
    1GX1
    1
    130ns
    -
    1 Gb
    0.000005A
    -
    -
    3V
    YES
    YES
    YES
    1K
    128K
    8/16words
    YES
    YES
    1.4mm
    13mm
    No
    ROHS3 Compliant
    YES
    30
    0.11mA
    130 ns
    8
    11mm
    -
    -
    -
    -
    -
    -
    -
  • S29GL01GP11TFIR10D
    -
    Surface Mount
    Surface Mount
    56-TFSOP (0.724, 18.40mm Width)
    56
    -40°C~85°C TA
    Tray
    2016
    GL-P
    -
    Obsolete
    3 (168 Hours)
    -
    -
    -
    -
    FLASH - NOR
    3V~3.6V
    -
    -
    -
    -
    -
    -
    -
    -
    -
    1Gb 128M x 8
    -
    Non-Volatile
    110ns
    FLASH
    Parallel
    -
    -
    110ns
    -
    1 Gb
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    No
    ROHS3 Compliant
    -
    -
    -
    -
    -
    -
    Tin
    56-TSOP
    85°C
    -40°C
    Parallel
    3.6V
    3V
  • S29GL01GP13TFIH20D
    -
    -
    Surface Mount
    56-TFSOP (0.724, 18.40mm Width)
    -
    -40°C~85°C TA
    Tray
    2016
    GL-P
    -
    Obsolete
    3 (168 Hours)
    -
    -
    -
    -
    FLASH - NOR
    3V~3.6V
    -
    -
    -
    -
    -
    -
    -
    -
    -
    1Gb 128M x 8
    -
    Non-Volatile
    130ns
    FLASH
    Parallel
    -
    -
    130ns
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    ROHS3 Compliant
    -
    -
    -
    -
    -
    -
    -
    56-TSOP
    -
    -
    -
    -
    -
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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