S25FL256SDPBHVC10

Cypress Semiconductor Corp S25FL256SDPBHVC10

Part Number:
S25FL256SDPBHVC10
Manufacturer:
Cypress Semiconductor Corp
Ventron No:
3229090-S25FL256SDPBHVC10
Description:
IC 256M FLASH MEMORY
ECAD Model:
Datasheet:
S25FL256SDPBHVC10

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Specifications
Cypress Semiconductor Corp S25FL256SDPBHVC10 technical specifications, attributes, parameters and parts with similar specifications to Cypress Semiconductor Corp S25FL256SDPBHVC10.
  • Factory Lead Time
    13 Weeks
  • Mounting Type
    Surface Mount
  • Package / Case
    24-TBGA
  • Surface Mount
    YES
  • Operating Temperature
    -40°C~105°C TA
  • Packaging
    Tray
  • Published
    2013
  • Series
    FL-S
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    24
  • Additional Feature
    ALSO CONFIGURABLE AS 256M X 1
  • HTS Code
    8542.32.00.51
  • Technology
    FLASH - NOR
  • Voltage - Supply
    2.7V~3.6V
  • Terminal Position
    BOTTOM
  • Number of Functions
    1
  • Supply Voltage
    3V
  • Terminal Pitch
    1mm
  • JESD-30 Code
    R-PBGA-B24
  • Qualification Status
    Not Qualified
  • Supply Voltage-Max (Vsup)
    3.6V
  • Power Supplies
    3/3.3V
  • Supply Voltage-Min (Vsup)
    2.7V
  • Memory Size
    256Mb 32M x 8
  • Memory Type
    Non-Volatile
  • Operating Mode
    SYNCHRONOUS
  • Clock Frequency
    66MHz
  • Supply Current-Max
    0.1mA
  • Memory Format
    FLASH
  • Memory Interface
    SPI - Quad I/O
  • Organization
    32MX8
  • Memory Width
    8
  • Standby Current-Max
    0.0003A
  • Memory Density
    268435456 bit
  • Parallel/Serial
    SERIAL
  • Programming Voltage
    3V
  • Serial Bus Type
    SPI
  • Endurance
    100000 Write/Erase Cycles
  • Write Cycle Time-Max (tWC)
    500ms
  • Data Retention Time-Min
    20
  • Write Protection
    HARDWARE/SOFTWARE
  • Alternate Memory Width
    2
  • Boot Block
    BOTTOM
  • Height Seated (Max)
    1.2mm
  • Length
    8mm
  • Width
    6mm
  • RoHS Status
    ROHS3 Compliant
Description
S25FL256SDPBHVC10 Overview
The manufacturer of this component is Cypress Semiconductor Corp. It is a type of memory chip that falls under the category of Memory. The packaging or casing for this chip is a 24-TBGA, and it can be mounted onto a surface. Its Moisture Sensitivity Level (MSL) is rated at 3, which means it can withstand exposure to moisture for up to 168 hours. The technology used for this chip is FLASH - NOR. It requires a power supply of 3/3.3V. The memory width is 8, and it has a memory density of 268435456 bits. The minimum data retention time for this chip is 20, and it also has an alternate memory width of 2. This chip is compliant with the RoHS3 standard, meaning it is environmentally friendly and does not contain hazardous materials.

S25FL256SDPBHVC10 Features
Package / Case: 24-TBGA
Additional Feature:ALSO CONFIGURABLE AS 256M X 1

S25FL256SDPBHVC10 Applications
There are a lot of Cypress Semiconductor Corp S25FL256SDPBHVC10 Memory applications.

nonvolatile BIOS memory
servers
hard disk drive (HDD)
networking
personal computers
eDRAM
multimedia computers
mainframes
DVD disk buffer
telecommunications
S25FL256SDPBHVC10 More Descriptions
NOR Flash 256Mbit 64M X 4Bit/128M X 2Bit/256M X 1Bit Serial-SPI 24-Pin BGA Tray
Nor/Tray |Cypress Infineon Technologies S25FL256SDPBHVC10
IC FLASH 256MBIT SPI/QUAD 24BGA
Product Comparison
The three parts on the right have similar specifications to S25FL256SDPBHVC10.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Mounting Type
    Package / Case
    Surface Mount
    Operating Temperature
    Packaging
    Published
    Series
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    Additional Feature
    HTS Code
    Technology
    Voltage - Supply
    Terminal Position
    Number of Functions
    Supply Voltage
    Terminal Pitch
    JESD-30 Code
    Qualification Status
    Supply Voltage-Max (Vsup)
    Power Supplies
    Supply Voltage-Min (Vsup)
    Memory Size
    Memory Type
    Operating Mode
    Clock Frequency
    Supply Current-Max
    Memory Format
    Memory Interface
    Organization
    Memory Width
    Standby Current-Max
    Memory Density
    Parallel/Serial
    Programming Voltage
    Serial Bus Type
    Endurance
    Write Cycle Time-Max (tWC)
    Data Retention Time-Min
    Write Protection
    Alternate Memory Width
    Boot Block
    Height Seated (Max)
    Length
    Width
    RoHS Status
    Mount
    Number of Pins
    ECCN Code
    Interface
    Nominal Supply Current
    Access Time
    Data Bus Width
    Write Cycle Time - Word, Page
    Address Bus Width
    Density
    Sync/Async
    Word Size
    Page Size
    Radiation Hardening
    REACH SVHC
    Supplier Device Package
    View Compare
  • S25FL256SDPBHVC10
    S25FL256SDPBHVC10
    13 Weeks
    Surface Mount
    24-TBGA
    YES
    -40°C~105°C TA
    Tray
    2013
    FL-S
    Active
    3 (168 Hours)
    24
    ALSO CONFIGURABLE AS 256M X 1
    8542.32.00.51
    FLASH - NOR
    2.7V~3.6V
    BOTTOM
    1
    3V
    1mm
    R-PBGA-B24
    Not Qualified
    3.6V
    3/3.3V
    2.7V
    256Mb 32M x 8
    Non-Volatile
    SYNCHRONOUS
    66MHz
    0.1mA
    FLASH
    SPI - Quad I/O
    32MX8
    8
    0.0003A
    268435456 bit
    SERIAL
    3V
    SPI
    100000 Write/Erase Cycles
    500ms
    20
    HARDWARE/SOFTWARE
    2
    BOTTOM
    1.2mm
    8mm
    6mm
    ROHS3 Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • S25FL032P0XNFI000
    11 Weeks
    Surface Mount
    8-WDFN Exposed Pad
    -
    -40°C~85°C TA
    Tray
    2015
    FL-P
    Obsolete
    3 (168 Hours)
    8
    -
    -
    FLASH - NOR
    2.7V~3.6V
    DUAL
    1
    3V
    1.27mm
    -
    -
    3.6V
    3/3.3V
    2.7V
    32Mb 4M x 8
    Non-Volatile
    -
    104MHz
    -
    FLASH
    SPI - Quad I/O
    4KX16
    16
    0.00001A
    -
    -
    3V
    SPI
    100000 Write/Erase Cycles
    -
    20
    HARDWARE/SOFTWARE
    -
    -
    0.55mm
    6mm
    -
    ROHS3 Compliant
    Surface Mount
    8
    3A991.B.1.A
    SPI, Serial
    38mA
    8 ns
    8b
    5μs, 3ms
    1b
    32 Mb
    Synchronous
    8b
    256B
    No
    -
    -
  • S25FL032P0XBHI020
    10 Weeks
    Surface Mount
    24-TBGA
    YES
    -40°C~85°C TA
    Tray
    2013
    FL-P
    Obsolete
    3 (168 Hours)
    24
    -
    8542.32.00.51
    FLASH - NOR
    2.7V~3.6V
    BOTTOM
    1
    3V
    1mm
    -
    -
    3.6V
    3/3.3V
    2.7V
    32Mb 4M x 8
    Non-Volatile
    -
    104MHz
    0.038mA
    FLASH
    SPI - Quad I/O
    4KX16
    16
    0.00001A
    -
    -
    3V
    SPI
    100000 Write/Erase Cycles
    -
    20
    HARDWARE/SOFTWARE
    -
    -
    1.2mm
    8mm
    -
    ROHS3 Compliant
    -
    24
    3A991.B.1.A
    SPI, Serial
    -
    -
    8b
    5μs, 3ms
    1b
    32 Mb
    -
    -
    256B
    No
    No SVHC
    -
  • S25FL032P0XMFV013M
    11 Weeks
    Surface Mount
    8-SOIC (0.209, 5.30mm Width)
    -
    -40°C~105°C TA
    Tray
    -
    FL-P
    Obsolete
    1 (Unlimited)
    -
    -
    -
    FLASH - NOR
    2.7V~3.6V
    -
    -
    -
    -
    -
    -
    -
    -
    -
    32Mb 4M x 8
    Non-Volatile
    -
    104MHz
    -
    FLASH
    SPI - Quad I/O
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    ROHS3 Compliant
    -
    8
    -
    -
    -
    -
    -
    5μs, 3ms
    -
    -
    -
    -
    -
    -
    -
    8-SOIC
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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