S25FL256SAGMFVR00

Cypress Semiconductor Corp S25FL256SAGMFVR00

Part Number:
S25FL256SAGMFVR00
Manufacturer:
Cypress Semiconductor Corp
Ventron No:
3232997-S25FL256SAGMFVR00
Description:
IC FLASH 256MBIT 133MHZ 16SOIC
ECAD Model:
Datasheet:
S25FL256SAGMFVR00

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Specifications
Cypress Semiconductor Corp S25FL256SAGMFVR00 technical specifications, attributes, parameters and parts with similar specifications to Cypress Semiconductor Corp S25FL256SAGMFVR00.
  • Factory Lead Time
    13 Weeks
  • Mounting Type
    Surface Mount
  • Package / Case
    16-SOIC (0.295, 7.50mm Width)
  • Surface Mount
    YES
  • Operating Temperature
    -40°C~105°C TA
  • Packaging
    Tray
  • Published
    2007
  • Series
    FL-S
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    16
  • ECCN Code
    3A991.B.1.A
  • Additional Feature
    IT ALSO CONFIGURED AS 256M X 1
  • HTS Code
    8542.32.00.51
  • Technology
    FLASH - NOR
  • Voltage - Supply
    2.7V~3.6V
  • Terminal Position
    DUAL
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Number of Functions
    1
  • Supply Voltage
    3V
  • Terminal Pitch
    1.27mm
  • Reflow Temperature-Max (s)
    NOT SPECIFIED
  • JESD-30 Code
    R-PDSO-G16
  • Qualification Status
    Not Qualified
  • Supply Voltage-Max (Vsup)
    3.6V
  • Power Supplies
    3/3.3V
  • Supply Voltage-Min (Vsup)
    2.7V
  • Interface
    SPI, Serial
  • Memory Size
    256Mb 32M x 8
  • Memory Type
    Non-Volatile
  • Operating Mode
    SYNCHRONOUS
  • Clock Frequency
    133MHz
  • Supply Current-Max
    0.1mA
  • Memory Format
    FLASH
  • Memory Interface
    SPI - Quad I/O
  • Organization
    64MX4
  • Memory Width
    4
  • Standby Current-Max
    0.0003A
  • Memory Density
    268435456 bit
  • Programming Voltage
    3V
  • Serial Bus Type
    SPI
  • Endurance
    100000 Write/Erase Cycles
  • Write Cycle Time-Max (tWC)
    500ms
  • Data Retention Time-Min
    20
  • Write Protection
    HARDWARE/SOFTWARE
  • Alternate Memory Width
    2
  • Boot Block
    BOTTOM
  • Height Seated (Max)
    2.65mm
  • Length
    10.3mm
  • Width
    7.5mm
  • RoHS Status
    ROHS3 Compliant
Description
S25FL256SAGMFVR00 Overview
Cypress Semiconductor Corp. offers the FL-S series of Memory chips, which are known for their high performance and reliability. This particular chip has a Memory Size of 256Mb 32M x 8 and belongs to the Non-Volatile Memory category. It operates at a Supply Voltage of 3V and has a Supply Current-Max of 0.1mA. The chip is organized in a 64MX4 configuration and uses the Serial Bus Type SPI for data transfer. The Write Cycle Time-Max (tWC) is 500ms and the Height Seated (Max) is 2.65mm.

S25FL256SAGMFVR00 Features
Package / Case: 16-SOIC (0.295, 7.50mm Width)
Additional Feature:IT ALSO CONFIGURED AS 256M X 1

S25FL256SAGMFVR00 Applications
There are a lot of Cypress Semiconductor Corp S25FL256SAGMFVR00 Memory applications.

cell phones
main computer memory
telecommunications
workstations,
Cache memory
networking
servers
networks
embedded logic
printers
S25FL256SAGMFVR00 More Descriptions
NOR Flash Serial-SPI 3V 256Mbit 256M x 1bit 8ns 16-Pin SOIC Tray
IC 256M(32Mx8) FLASH MEMORY, 133 MHz, 2.7V-3.6V, 100mA, SO-16
256Mbit SPI SOIC-16 NOR FLASH ROHS
IC FLASH 256MBIT SPI/QUAD 16SOIC
FLASH MEMORY, 256MBIT, -40 TO 105DEG C; Flash Memory Type:Serial NOR; Memory Size:256Mbit; Flash Memory Configuration:32M x 8bit; IC Interface Type:SPI; Memory Case Style:WSOIC; No. of Pins:16Pins; Clock Frequency:133MHz; Access Time:-; Supply Voltage Min:2.7V; Supply Voltage Max:3.6V; Operating Temperature Min:-40°C; Operating Temperature Max:105°C; Product Range:3V Serial NOR Flash Memories; MSL:MSL 3 - 168 hours; SVHC:No SVHC (15-Jan-2019)
Product Comparison
The three parts on the right have similar specifications to S25FL256SAGMFVR00.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Mounting Type
    Package / Case
    Surface Mount
    Operating Temperature
    Packaging
    Published
    Series
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    ECCN Code
    Additional Feature
    HTS Code
    Technology
    Voltage - Supply
    Terminal Position
    Peak Reflow Temperature (Cel)
    Number of Functions
    Supply Voltage
    Terminal Pitch
    Reflow Temperature-Max (s)
    JESD-30 Code
    Qualification Status
    Supply Voltage-Max (Vsup)
    Power Supplies
    Supply Voltage-Min (Vsup)
    Interface
    Memory Size
    Memory Type
    Operating Mode
    Clock Frequency
    Supply Current-Max
    Memory Format
    Memory Interface
    Organization
    Memory Width
    Standby Current-Max
    Memory Density
    Programming Voltage
    Serial Bus Type
    Endurance
    Write Cycle Time-Max (tWC)
    Data Retention Time-Min
    Write Protection
    Alternate Memory Width
    Boot Block
    Height Seated (Max)
    Length
    Width
    RoHS Status
    Number of Pins
    Data Bus Width
    Write Cycle Time - Word, Page
    Address Bus Width
    Density
    Page Size
    Radiation Hardening
    REACH SVHC
    Mount
    Nominal Supply Current
    Access Time
    Sync/Async
    Word Size
    Supplier Device Package
    View Compare
  • S25FL256SAGMFVR00
    S25FL256SAGMFVR00
    13 Weeks
    Surface Mount
    16-SOIC (0.295, 7.50mm Width)
    YES
    -40°C~105°C TA
    Tray
    2007
    FL-S
    Active
    3 (168 Hours)
    16
    3A991.B.1.A
    IT ALSO CONFIGURED AS 256M X 1
    8542.32.00.51
    FLASH - NOR
    2.7V~3.6V
    DUAL
    NOT SPECIFIED
    1
    3V
    1.27mm
    NOT SPECIFIED
    R-PDSO-G16
    Not Qualified
    3.6V
    3/3.3V
    2.7V
    SPI, Serial
    256Mb 32M x 8
    Non-Volatile
    SYNCHRONOUS
    133MHz
    0.1mA
    FLASH
    SPI - Quad I/O
    64MX4
    4
    0.0003A
    268435456 bit
    3V
    SPI
    100000 Write/Erase Cycles
    500ms
    20
    HARDWARE/SOFTWARE
    2
    BOTTOM
    2.65mm
    10.3mm
    7.5mm
    ROHS3 Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • S25FL032P0XBHI020
    10 Weeks
    Surface Mount
    24-TBGA
    YES
    -40°C~85°C TA
    Tray
    2013
    FL-P
    Obsolete
    3 (168 Hours)
    24
    3A991.B.1.A
    -
    8542.32.00.51
    FLASH - NOR
    2.7V~3.6V
    BOTTOM
    -
    1
    3V
    1mm
    -
    -
    -
    3.6V
    3/3.3V
    2.7V
    SPI, Serial
    32Mb 4M x 8
    Non-Volatile
    -
    104MHz
    0.038mA
    FLASH
    SPI - Quad I/O
    4KX16
    16
    0.00001A
    -
    3V
    SPI
    100000 Write/Erase Cycles
    -
    20
    HARDWARE/SOFTWARE
    -
    -
    1.2mm
    8mm
    -
    ROHS3 Compliant
    24
    8b
    5μs, 3ms
    1b
    32 Mb
    256B
    No
    No SVHC
    -
    -
    -
    -
    -
    -
  • S25FL032P0XNFV010
    11 Weeks
    Surface Mount
    8-UDFN Exposed Pad
    -
    -40°C~105°C TA
    Tray
    2007
    FL-P
    Obsolete
    3 (168 Hours)
    8
    3A991.B.1.A
    -
    -
    FLASH - NOR
    2.7V~3.6V
    DUAL
    -
    1
    3V
    1.27mm
    -
    -
    -
    3.6V
    3/3.3V
    2.7V
    SPI, Serial
    32Mb 4M x 8
    Non-Volatile
    -
    104MHz
    -
    FLASH
    SPI - Quad I/O
    4KX16
    16
    0.00001A
    -
    3V
    SPI
    100000 Write/Erase Cycles
    -
    20
    HARDWARE/SOFTWARE
    -
    -
    -
    -
    -
    ROHS3 Compliant
    8
    -
    5μs, 3ms
    1b
    32 Mb
    256B
    No
    -
    Surface Mount
    38mA
    8 ns
    Synchronous
    8b
    -
  • S25FL032P0XMFI011M
    -
    Surface Mount
    8-SOIC (0.209, 5.30mm Width)
    -
    -40°C~85°C TA
    Tray
    -
    FL-P
    Obsolete
    1 (Unlimited)
    -
    -
    -
    -
    FLASH - NOR
    2.7V~3.6V
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    32Mb 4M x 8
    Non-Volatile
    -
    104MHz
    -
    FLASH
    SPI - Quad I/O
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    ROHS3 Compliant
    8
    -
    5μs, 3ms
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    8-SOIC
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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