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SII Semiconductor Corporation S-24C128CI-T8T1U3

Part Number:

S-24C128CI-T8T1U3

Manufacturer:

SII Semiconductor Corporation

Ventron No:

3719083-S-24C128CI-T8T1U3

Description:

IC EEPROM 128KBIT 400KHZ 8TSSOP

Datasheet:

S-24C128CI-T8T1U3

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Delivery:

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Part Overview

Description
The S-24C128C is a 2-wire, low current consumption, and wide range operation serial EPROM. It has a capacity of 128K-bit and an organization of 16384 words x 8-bit. Page write and sequential read are available.

Features
Operating voltage range:
Read: 1.6 V to 5.5 V
Write: 1.7 V to 5.5 V
Page write: 64 bytes/page
Sequential read
Operation frequency: 400 kHz (Voc = 1.6 V to 5.5 V)
Write time: 5.0 ms max.
Noise suppression: Schmitt trigger and noise filter on input pins (SCL, SDA)
Write protect function during low power supply voltage
Endurance: 10° cycles/word (Ta = 25°C)
Data retention: 100 years (Ta 25°C)
Memory capacity: 128 K-bit
Write protect: 100% FFh
Initial shipment data: 100% FFh
Lead-free (Sn 100%), halogen-free

Applications
Consumer electronics
Office equipment
Communications devices

Specifications

SII Semiconductor Corporation S-24C128CI-T8T1U3 technical specifications, attributes, parameters and parts with similar specifications to SII Semiconductor Corporation S-24C128CI-T8T1U3.

  • Factory Lead Time
    18 Weeks
  • Mounting Type

    Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include: * Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side. * Surface-mount: Component is placed on the surface of the PCB and soldered in place. * Press-fit: Component is pressed into place on the PCB without soldering. * Socket: Component is inserted into a socket on the PCB, allowing for easy replacement. The mounting type is determined by factors such as the component's size, shape, and power requirements.

    Surface Mount
  • Package / Case

    Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.

    8-TSSOP (0.173, 4.40mm Width)
  • Surface Mount
    YES
  • Operating Temperature

    Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.

    -40°C~85°C TA
  • Packaging
    Tape & Reel (TR)
  • JESD-609 Code
    e3
  • Part Status

    Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.

    Active
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.

    1 (Unlimited)
  • Number of Terminations
    8
  • ECCN Code
    EAR99
  • Terminal Finish
    Tin (Sn)
  • Additional Feature
    100 YEAR DATA RETENTION
  • HTS Code
    8542.32.00.51
  • Technology

    Technology, in the context of electronic components, refers to the specific manufacturing process and materials used to create the component. It encompasses the semiconductor fabrication techniques, such as the type of transistor used (e.g., MOSFET, BJT), the gate oxide thickness, and the interconnect materials. Technology also includes the packaging type, such as surface mount or through-hole, and the leadframe or substrate material. The technology used impacts the component's performance characteristics, such as speed, power consumption, and reliability.

    CMOS
  • Voltage - Supply
    1.6V~5.5V
  • Terminal Position
    DUAL
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Number of Functions
    1
  • Supply Voltage

    Supply Voltage is the voltage required to power an electronic component. It is typically measured in volts (V) and is specified in the component's datasheet. The supply voltage must be within the specified range for the component to function properly. If the supply voltage is too low, the component may not function at all. If the supply voltage is too high, the component may be damaged.

    5V
  • Terminal Pitch
    0.65mm
  • Time@Peak Reflow Temperature-Max (s)
    NOT SPECIFIED
  • Pin Count
    8
  • JESD-30 Code
    R-PDSO-G8
  • Qualification Status
    Not Qualified
  • Supply Voltage-Max (Vsup)
    5.5V
  • Supply Voltage-Min (Vsup)
    1.6V
  • Memory Size
    128Kb 16K x 8
  • Memory Type

    Memory Type refers to the type of memory technology used in an electronic device. It indicates the specific design and architecture of the memory, such as DRAM (Dynamic Random Access Memory), SRAM (Static Random Access Memory), ROM (Read-Only Memory), EEPROM (Electrically Erasable Programmable Read-Only Memory), or Flash memory. Each memory type has unique characteristics, including speed, capacity, volatility, and cost, which determine its suitability for different applications.

    Non-Volatile
  • Operating Mode
    SYNCHRONOUS
  • Clock Frequency

    Clock Frequency, measured in Hertz (Hz), is the rate at which an electronic component, such as a microprocessor or oscillator, generates electrical pulses. It determines the speed at which the component can process data and execute instructions. A higher clock frequency generally indicates faster performance, but also higher power consumption and heat generation. Clock Frequency is a crucial parameter for timing-sensitive applications, such as digital signal processing and real-time systems.

    400kHz
  • Access Time

    Access time is the time it takes for a memory device to retrieve data from a specific location. It is typically measured in nanoseconds (ns) and is a critical factor in determining the performance of a computer system. The lower the access time, the faster the memory device can retrieve data and the faster the computer can perform tasks.

    900ns
  • Memory Format

    Memory Format refers to the arrangement and organization of data within a memory device. It specifies the number of bits, bytes, or words stored in each memory location and how they are accessed.

    EEPROM
  • Memory Interface
    I2C
  • Organization
    16KX8
  • Memory Width
    8
  • Write Cycle Time - Word, Page
    5ms
  • Memory Density
    131072 bit
  • Parallel/Serial
    SERIAL
  • Serial Bus Type
    I2C
  • Write Cycle Time-Max (tWC)
    5ms
  • Height Seated (Max)
    1.1mm
  • Length

    Length, in the context of electronic components, refers to the physical dimension of a component along its longest axis. It is typically measured in millimeters (mm) or inches (in). Length is a crucial parameter for determining the physical size and space requirements of a component on a printed circuit board (PCB) or other assembly. It also affects the component's electrical characteristics, such as inductance and capacitance, which can be influenced by the length of conductors or traces within the component.

    4.4mm
  • Width
    3mm
  • RoHS Status
    RoHS Compliant

Certification

  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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