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Texas Instruments RF430FRL152HCRGER

Part Number:

RF430FRL152HCRGER

Manufacturer:

Texas Instruments

Ventron No:

4409979-RF430FRL152HCRGER

Description:

NFC ISO15693 Sensor Transponder With SPI/I2C Interface and 14-Bit Sigma-Delta ADC

Datasheet:

RF430FRL152HCRGER

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Delivery:

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Specifications

Texas Instruments RF430FRL152HCRGER technical specifications, attributes, parameters and parts with similar specifications to Texas Instruments RF430FRL152HCRGER.

  • Lifecycle Status
    ACTIVE (Last Updated: 1 week ago)
  • Factory Lead Time
    6 Weeks
  • Contact Plating
    Gold
  • Mount
    Surface Mount
  • Mounting Type

    Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include: * Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side. * Surface-mount: Component is placed on the surface of the PCB and soldered in place. * Press-fit: Component is pressed into place on the PCB without soldering. * Socket: Component is inserted into a socket on the PCB, allowing for easy replacement. The mounting type is determined by factors such as the component's size, shape, and power requirements.

    Surface Mount
  • Package / Case

    Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.

    24-VFQFN Exposed Pad
  • Number of Pins

    Number of Pins: Indicates the number of electrical connections available on the component. These pins are used to connect the component to other components or circuits on a printed circuit board (PCB). The number of pins determines the functionality and connectivity options of the component. It is important to ensure that the component has the correct number of pins for the intended application.

    24
  • Operating Temperature

    Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.

    0°C~70°C
  • Packaging
    Tape & Reel (TR)
  • JESD-609 Code
    e4
  • Pbfree Code
    yes
  • Part Status

    Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.

    Active
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.

    2 (1 Year)
  • Number of Terminations
    24
  • ECCN Code
    EAR99
  • Additional Feature
    IT REQUIRES 1.45V TO 1.65V LOW SUPPLY VOLTAGE
  • HTS Code
    8542.31.00.01
  • Technology

    Technology, in the context of electronic components, refers to the specific manufacturing process and materials used to create the component. It encompasses the semiconductor fabrication techniques, such as the type of transistor used (e.g., MOSFET, BJT), the gate oxide thickness, and the interconnect materials. Technology also includes the packaging type, such as surface mount or through-hole, and the leadframe or substrate material. The technology used impacts the component's performance characteristics, such as speed, power consumption, and reliability.

    CMOS
  • Voltage - Supply
    1.45V~1.65V
  • Terminal Position
    QUAD
  • Terminal Form
    NO LEAD
  • Peak Reflow Temperature (Cel)
    260
  • Terminal Pitch
    0.5mm
  • Frequency

    Frequency, in the context of electronic components, refers to the rate at which an alternating current or voltage changes direction per second. It is measured in Hertz (Hz), which represents one cycle per second. Frequency is a crucial parameter for various electronic components, such as capacitors, inductors, and resonators. It determines the component's ability to store or release energy, filter signals, and resonate at specific frequencies. Understanding the frequency characteristics of electronic components is essential for designing and optimizing electronic circuits.

    13.56MHz
  • Time@Peak Reflow Temperature-Max (s)
    NOT SPECIFIED
  • Base Part Number
    430FRL152
  • Interface

    In electronics, an interface refers to the connection point or boundary between two or more electronic systems or devices. It defines the physical, electrical, and logical characteristics that enable communication and data exchange between them. An interface specifies the protocols, pinouts, voltage levels, data formats, and other parameters necessary for the systems to interact seamlessly. It ensures compatibility and interoperability between different components or devices, allowing them to exchange information and perform their intended functions.

    I2C, SPI
  • Density
    0 b
  • Standards
    ISO 15693, ISO 18000-3, NFC
  • Bus Compatibility
    I2C; SPI
  • Height

    Height, in the context of electronic components, refers to the vertical dimension of the component. It is typically measured in millimeters (mm) or inches (in). Height is an important parameter to consider when designing and assembling electronic circuits, as it affects the overall size and form factor of the device. Components with a smaller height are often preferred for applications where space is limited, such as in portable devices or embedded systems.

    1mm
  • Length

    Length, in the context of electronic components, refers to the physical dimension of a component along its longest axis. It is typically measured in millimeters (mm) or inches (in). Length is a crucial parameter for determining the physical size and space requirements of a component on a printed circuit board (PCB) or other assembly. It also affects the component's electrical characteristics, such as inductance and capacitance, which can be influenced by the length of conductors or traces within the component.

    4mm
  • Width
    4mm
  • Thickness

    Thickness, in the context of electronic components, refers to the vertical distance between two opposing surfaces of a component. It is typically measured in millimeters (mm) or inches (in). Thickness is a crucial parameter that affects the component's physical dimensions, weight, and performance characteristics. It influences factors such as heat dissipation, electrical insulation, and mechanical stability. Thinner components generally offer better heat dissipation and space efficiency, while thicker components may provide enhanced durability and structural integrity.

    880μm
  • RoHS Status
    ROHS3 Compliant
  • Lead Free
    Lead Free

Description

The RF430FRL15xH device is a 13.56-MHz transponder chip with a programmable 16-bit MSP430 low-power microcontroller. The device features embedded universal FRAM nonvolatile memory for storage of program code or user data such as calibration and measurement data. The RF430FRL15xH supports communication, parameter setting, and configuration through the ISO/IEC 15693, ISO/IEC 18000-3 compliant RFID interface and the SPI or I2C interface. Sensor measurements are supported by the internal temperature sensor and the onboard 14-bit sigma-delta analog-to-digital converter (ADC), and digital sensors can be connected through SPI or I2C.

The RF430FRL15xH device is optimized for operation in fully passive (battery-less) or single-cell battery-powered (semi-active) mode to achieve extended battery life in portable and wireless sensing applications. FRAM is a nonvolatile memory that combines the speed, flexibility, and endurance of SRAM with the stability and reliability of flash, all at lower total power consumption.

RF430FRL152HCRGER More Descriptions
NFC/RFID Tag and Transponder Chip 13560kHz 2KByte 24-Pin VQFN EP T/R
NFC ISO15693 Sensor Transponder With SPI/I2C Interface and 14-Bit Sigma-Delta ADC 24-VQFN 0 to 70
IC RFID TRANSP 13.56MHZ 24VQFN
IC NFC DYNAMIC TAG TARG 24VQFN
Sensor Transponder 24-Pin VQFN T/R
Microprocessor Circuit, CMOS, PQCC24

Certification

  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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