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Renesas Electronics America R5F56217BDLD#U0

Part Number:

R5F56217BDLD#U0

Manufacturer:

Renesas Electronics America

Ventron No:

3147232-R5F56217BDLD#U0

Description:

IC MCU 32BIT 384KB FLASH 85TFLGA

ECAD Model:

Datasheet:

R5F56217BDLD#U0

Payment:

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Delivery:

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Reference Price ( In US Dollars )

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Qty

Unit Price

Ext Price

  • 1

    $5.6414

    $5.64

  • 200

    $2.1841

    $436.82

  • 416

    $2.1069

    $876.47

  • 832

    $2.0698

    $1722.07

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    One Stop Service

  • Competitive Price

    Competitive Price

  • Source Traceability

    Source Traceability

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    Same Day Delivery

Part Overview

Description
The RX62N Group and RX621 Group of 32-bit RX MCUs from Renesas offer exceptional performance with up to 165 DMIPS at 100 MHz operating frequency. These MCUs feature a single-precision 32-bit IEEE-754 floating-point unit, delivering high-speed processing capabilities. With up to 512 KB of Flash memory, they provide ample storage for code and data.

Features
32-bit RX CPU Core:
165 DMIPS at 100 MHz
Single-precision 32-bit IEEE-754 floating-point unit
5-stage pipeline architecture
Memory Protection Unit (MPU) support
Low Power Design:
2.7V to 3.6V single-supply operation
480 μA/MHz Run Mode with all peripherals on
Deep Software Standby Mode with RTC
Main Flash Memory:
Up to 512 KB
No wait states at 100 MHz
Programming via USB, SCI, JTAG, or user code
Data Flash Memory:
Up to 32 KB
Background Erase/Program
SRAM:
Up to 96 KB
No wait states
Back-up retention in Deep Software Standby Mode
DMA:
Four fully programmable internal DMA channels
Two EXDMA channels for external-to-external transfers
Reset and Supply Management:
Power-On Reset (POR) monitor/generator
Low Voltage Detect (LVD) with precision setting
System Clocking:
External crystal, 8 MHz to 14 MHz to Internal PLL
PLL source to system, USB, and Ethernet
Internal 125 kHz LOCO for IWDT
Watchdog Timers:
Two independent watchdog timers
125-kHz LOCO operation
Communication Interfaces:
USB 2.0 Full-Speed interfaces with PHY (2ch)
Ethernet MAC 10/100 Mbps (1ch)
CAN ISO11898-1 (1ch)
SCI channels (6ch)
I²C interfaces (2ch)
RSPI (2ch)
External Address Space:
Eight CS areas (8 x 16 Mbytes)
128-Mbyte SDRAM area
TFT-LCD:
Up to WQVGA resolution
Extended Function Timers:
Up to 20 timers
16-bit MTU2, 8-bit TMR, 16-bit CMT
ADC:
1-MHz ADC units
12-bit x 8 ch. or (2) 10-bit x 4 ch. units
DAC:
10-bit DAC, 2 channels
GPIO:
Up to 128 GPIO
5V tolerant
Open-Drain, Internal Pull-up

Applications
The RX62N Group and RX621 Group of MCUs are suitable for a wide range of applications, including:
Industrial automation
Motor control
Power electronics
Medical devices
Consumer electronics
Automotive systems

Specifications

Renesas Electronics America R5F56217BDLD#U0 technical specifications, attributes, parameters and parts with similar specifications to Renesas Electronics America R5F56217BDLD#U0.

  • Factory Lead Time
    20 Weeks
  • Mounting Type

    Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include: * Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side. * Surface-mount: Component is placed on the surface of the PCB and soldered in place. * Press-fit: Component is pressed into place on the PCB without soldering. * Socket: Component is inserted into a socket on the PCB, allowing for easy replacement. The mounting type is determined by factors such as the component's size, shape, and power requirements.

    Surface Mount
  • Package / Case

    Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.

    85-TFLGA
  • Surface Mount
    YES
  • Number of Pins

    Number of Pins: Indicates the number of electrical connections available on the component. These pins are used to connect the component to other components or circuits on a printed circuit board (PCB). The number of pins determines the functionality and connectivity options of the component. It is important to ensure that the component has the correct number of pins for the intended application.

    85
  • Operating Temperature

    Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.

    -40°C~85°C TA
  • Packaging
    Tray
  • Series

    Series, in the context of electronic components, refers to the arrangement of components in a circuit. When components are connected in series, they form a single path for current to flow through. The total resistance of a series circuit is the sum of the individual resistances of each component. Series connections are often used to control the flow of current in a circuit, as the total resistance can be adjusted by changing the number or type of components in the series.

    RX600
  • Published
    2011
  • Pbfree Code
    yes
  • Part Status

    Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.

    Active
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.

    3 (168 Hours)
  • Number of Terminations
    85
  • Additional Feature
    A/D CONVERTERS CAN ALSO CONFIGURED AS 4-CH 10-BIT (2)
  • Subcategory
    Microcontrollers
  • Technology

    Technology, in the context of electronic components, refers to the specific manufacturing process and materials used to create the component. It encompasses the semiconductor fabrication techniques, such as the type of transistor used (e.g., MOSFET, BJT), the gate oxide thickness, and the interconnect materials. Technology also includes the packaging type, such as surface mount or through-hole, and the leadframe or substrate material. The technology used impacts the component's performance characteristics, such as speed, power consumption, and reliability.

    CMOS
  • Terminal Position
    BOTTOM
  • Terminal Form
    BUTT
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Supply Voltage

    Supply Voltage is the voltage required to power an electronic component. It is typically measured in volts (V) and is specified in the component's datasheet. The supply voltage must be within the specified range for the component to function properly. If the supply voltage is too low, the component may not function at all. If the supply voltage is too high, the component may be damaged.

    3V
  • Terminal Pitch
    0.65mm
  • Frequency

    Frequency, in the context of electronic components, refers to the rate at which an alternating current or voltage changes direction per second. It is measured in Hertz (Hz), which represents one cycle per second. Frequency is a crucial parameter for various electronic components, such as capacitors, inductors, and resonators. It determines the component's ability to store or release energy, filter signals, and resonate at specific frequencies. Understanding the frequency characteristics of electronic components is essential for designing and optimizing electronic circuits.

    100MHz
  • Time@Peak Reflow Temperature-Max (s)
    NOT SPECIFIED
  • Base Part Number
    R5F5621
  • Pin Count
    85
  • Qualification Status
    Not Qualified
  • Supply Voltage-Max (Vsup)
    3.6V
  • Power Supplies
    3/3.3V
  • Supply Voltage-Min (Vsup)
    2.7V
  • Interface

    In electronics, an interface refers to the connection point or boundary between two or more electronic systems or devices. It defines the physical, electrical, and logical characteristics that enable communication and data exchange between them. An interface specifies the protocols, pinouts, voltage levels, data formats, and other parameters necessary for the systems to interact seamlessly. It ensures compatibility and interoperability between different components or devices, allowing them to exchange information and perform their intended functions.

    CAN, EBI/EMI, I2C, SCI, SPI, USB
  • Memory Size
    384kB
  • Oscillator Type
    Internal
  • Number of I/O
    58
  • RAM Size
    64K x 8
  • Voltage - Supply (Vcc/Vdd)
    2.7V~3.6V
  • uPs/uCs/Peripheral ICs Type
    MICROCONTROLLER
  • Core Processor

    Core Processor refers to the central processing unit (CPU) of an electronic device. It is the brain of the device, responsible for executing instructions, processing data, and managing the overall operation of the system. The core processor's speed, number of cores, and architecture determine the device's performance and capabilities.

    RX
  • Peripherals
    DMA, LVD, POR, PWM, WDT
  • Program Memory Type
    FLASH
  • Core Size

    Core Size refers to the physical dimensions of the magnetic core used in an electronic component, such as an inductor or transformer. It is typically expressed in terms of its length, width, and height, or as a diameter and height for cylindrical cores. The core size determines the inductance, current-carrying capacity, and other electrical characteristics of the component. Larger core sizes generally result in higher inductance and current-handling capabilities.

    32-Bit
  • Program Memory Size
    384KB 384K x 8
  • Connectivity

    Connectivity refers to the number of terminals or pins on an electronic component that allow it to connect to other components in a circuit. It determines the component's ability to interact and exchange signals with other elements in the system. Higher connectivity indicates more connection points, enabling the component to perform complex functions and integrate with various circuits.

    CANbus, EBI/EMI, I2C, SCI, SPI, USB
  • Supply Current-Max
    100mA
  • Bit Size
    32
  • Data Converter
    A/D 8x10/12b; D/A 1x10b
  • Watchdog Timer
    Yes
  • Has ADC
    YES
  • DMA Channels
    YES
  • PWM Channels
    YES
  • DAC Channels
    YES
  • Number of Timers/Counters
    20
  • ROM (words)
    393216
  • On Chip Program ROM Width
    8
  • Length

    Length, in the context of electronic components, refers to the physical dimension of a component along its longest axis. It is typically measured in millimeters (mm) or inches (in). Length is a crucial parameter for determining the physical size and space requirements of a component on a printed circuit board (PCB) or other assembly. It also affects the component's electrical characteristics, such as inductance and capacitance, which can be influenced by the length of conductors or traces within the component.

    7mm
  • Height Seated (Max)
    1.2mm
  • Width
    7mm
  • RoHS Status
    ROHS3 Compliant
  • Lead Free
    Lead Free

Product Comparison

The three parts on the right have similar specifications to R5F56217BDLD#U0.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Mounting Type
    Package / Case
    Surface Mount
    Number of Pins
    Operating Temperature
    Packaging
    Series
    Published
    Pbfree Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    Additional Feature
    Subcategory
    Technology
    Terminal Position
    Terminal Form
    Peak Reflow Temperature (Cel)
    Supply Voltage
    Terminal Pitch
    Frequency
    Time@Peak Reflow Temperature-Max (s)
    Base Part Number
    Pin Count
    Qualification Status
    Supply Voltage-Max (Vsup)
    Power Supplies
    Supply Voltage-Min (Vsup)
    Interface
    Memory Size
    Oscillator Type
    Number of I/O
    RAM Size
    Voltage - Supply (Vcc/Vdd)
    uPs/uCs/Peripheral ICs Type
    Core Processor
    Peripherals
    Program Memory Type
    Core Size
    Program Memory Size
    Connectivity
    Supply Current-Max
    Bit Size
    Data Converter
    Watchdog Timer
    Has ADC
    DMA Channels
    PWM Channels
    DAC Channels
    Number of Timers/Counters
    ROM (words)
    On Chip Program ROM Width
    Length
    Height Seated (Max)
    Width
    RoHS Status
    Lead Free
    Operating Supply Voltage
    Data Bus Width
    EEPROM Size
    Number of Programmable I/O
    Radiation Hardening
    HTS Code
    Speed
    CPU Family
    RAM (bytes)
    View Compare
  • R5F56217BDLD#U0
    R5F56217BDLD#U0
    20 Weeks
    Surface Mount
    85-TFLGA
    YES
    85
    -40°C~85°C TA
    Tray
    RX600
    2011
    yes
    Active
    3 (168 Hours)
    85
    A/D CONVERTERS CAN ALSO CONFIGURED AS 4-CH 10-BIT (2)
    Microcontrollers
    CMOS
    BOTTOM
    BUTT
    NOT SPECIFIED
    3V
    0.65mm
    100MHz
    NOT SPECIFIED
    R5F5621
    85
    Not Qualified
    3.6V
    3/3.3V
    2.7V
    CAN, EBI/EMI, I2C, SCI, SPI, USB
    384kB
    Internal
    58
    64K x 8
    2.7V~3.6V
    MICROCONTROLLER
    RX
    DMA, LVD, POR, PWM, WDT
    FLASH
    32-Bit
    384KB 384K x 8
    CANbus, EBI/EMI, I2C, SCI, SPI, USB
    100mA
    32
    A/D 8x10/12b; D/A 1x10b
    Yes
    YES
    YES
    YES
    YES
    20
    393216
    8
    7mm
    1.2mm
    7mm
    ROHS3 Compliant
    Lead Free
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • R5F51111ADNF#U0
    20 Weeks
    Surface Mount
    40-WFQFN Exposed Pad
    YES
    -
    -40°C~85°C TA
    Tray
    RX100
    2014
    -
    Active
    3 (168 Hours)
    40
    -
    -
    CMOS
    QUAD
    -
    -
    3.3V
    0.5mm
    32MHz
    -
    -
    -
    -
    3.6V
    -
    -
    I2C, SCI, SPI, UART, USB
    32kB
    Internal
    24
    10K x 8
    1.8V~3.6V
    MICROCONTROLLER
    RX
    DMA, LVD, POR, PWM, WDT
    FLASH
    32-Bit
    32KB 32K x 8
    I2C, SCI, SPI, USB
    -
    32
    A/D 8x12b
    Yes
    YES
    YES
    YES
    -
    8
    -
    -
    6mm
    -
    -
    ROHS3 Compliant
    -
    3.3V
    32b
    8K x 8
    25
    No
    -
    -
    -
    -
  • R5F51104ADLF#U0
    20 Weeks
    Surface Mount
    64-WFLGA
    YES
    64
    -40°C~85°C TA
    Tray
    RX100
    2016
    yes
    Active
    3 (168 Hours)
    64
    -
    Microcontrollers
    CMOS
    BOTTOM
    BUTT
    NOT SPECIFIED
    -
    0.5mm
    -
    NOT SPECIFIED
    -
    64
    Not Qualified
    -
    2/3.3V
    -
    -
    -
    Internal
    50
    16K x 8
    1.8V~3.6V
    MICROCONTROLLER
    RX
    DMA, LVD, POR, PWM, WDT
    FLASH
    32-Bit
    96KB 96K x 8
    I2C, SCI, SPI
    21.6mA
    32
    A/D 14x12b
    -
    -
    -
    -
    -
    -
    98304
    -
    -
    -
    -
    ROHS3 Compliant
    -
    -
    -
    -
    -
    -
    8542.31.00.01
    32MHz
    RX
    16384
  • R5F51101ADFK#30
    20 Weeks
    Surface Mount
    64-LQFP
    YES
    64
    -40°C~85°C TA
    Tray
    RX100
    2016
    yes
    Active
    3 (168 Hours)
    64
    -
    Microcontrollers
    CMOS
    QUAD
    GULL WING
    NOT SPECIFIED
    -
    0.8mm
    -
    NOT SPECIFIED
    -
    64
    Not Qualified
    -
    2/3.3V
    -
    -
    -
    Internal
    50
    10K x 8
    1.8V~3.6V
    MICROCONTROLLER
    RX
    DMA, LVD, POR, PWM, WDT
    FLASH
    32-Bit
    32KB 32K x 8
    I2C, SCI, SPI
    21.6mA
    32
    A/D 14x12b
    -
    -
    -
    -
    -
    -
    32768
    -
    -
    -
    -
    ROHS3 Compliant
    -
    -
    -
    -
    -
    -
    8542.31.00.01
    32MHz
    RX
    10240

Certification

  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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