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Microchip Technology PIC16LF1718-I/SO

Part Number:

PIC16LF1718-I/SO

Manufacturer:

Microchip Technology

Ventron No:

3147233-PIC16LF1718-I/SO

Description:

IC MCU 8BIT 28KB FLASH 28SOIC

ECAD Model:

Datasheet:

PIC16LF1718-I/SO

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Delivery:

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Unit Price

Ext Price

  • 1

    $1.8538

    $1.85

  • 200

    $0.7178

    $143.56

  • 500

    $0.6931

    $346.55

  • 1000

    $0.6807

    $680.70

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Part Overview

Description
The PIC16(L)F1717/8/9 microcontrollers combine Intelligent Analog integration with low cost and extreme low power (XLP) for general purpose applications. These devices offer on-chip op amps, Core Independent Peripherals (CLC, NCO, and COG), Peripheral Pin Select, and Zero-Cross Detect for increased design flexibility.

Features
C Compiler Optimized RISC Architecture
Operating Speed: 0-32 MHz clock input
Interrupt Capability
16-Level Deep Hardware Stack
Up to Four 8-Bit Timers
One 16-Bit Timer
Power-on Reset (POR)
Power-up Timer (PWRT)
Low-Power Brown-out Reset (LPBOR)
Programmable Watchdog Timer (WDT) up to 2568
Programmable Code Protection
Up to 16 Kwords Flash Program Memory
Up to 2048 Bytes Data SRAM Memory
Direct, Indirect, and Relative Addressing modes
High-Endurance Flash (HEF): 1288 of nonvolatile data storage, 100K Erase/Write cycles
Operating Voltage Range: 1.8V to 3.6V (PIC16LF1717/8/9), 2.3V to 5.5V (PIC16F1717/8/9)
Temperature Range: Industrial: -40°C to 85°C, Extended: -40°C to 125°C
Sleep mode: 50 nA @ 1.8V, typical
Watchdog Timer: 500 nA @ 1.8V, typical
Secondary Oscillator: 500 nA @ 32 kHz
Operating Current: - 8 UA @ 32 kHz, 1.8V, typical, - 32 uA/MHz @ 1.8V, typical
Configurable Logic Cell (CLC): Integrated combinational and sequential logic
Complementary Output Generator (COG): Rising/falling edge dead-band control blanking
Numerically Controlled Oscillator (NCO): Generates true linear frequency control and increased frequency resolution
Capture/Compare/PWM (CCP) module
PWM: Two 10-Bit Pulse-Width Modulators
Serial Communications: SPI, I²C, RS-232, RS-485, LIN compatible, Auto-Baud Detect, auto-wake-up on start
Up to 35 I/O Pins and One Input Pin: Individually programmable pull-ups, Slew rate control, Interrupt-on-Change with edge-select
Peripheral Pin Select (PPS): Enables pin mapping of digital I/O
Operational Amplifiers: Two configurable rail-to-rail op amps, Selectable internal and external channels, 2 MHz gain bandwidth product
High-Speed Comparators: Up to two comparators, 50 ns response time, Rail-to-rail inputs
10-Bit Analog-to-Digital Converter (ADC): Up to 28 external channels, Conversion available during Sleep, Temperature indicator
Zero-Cross Detector (ZCD): Detect when AC signal on pin crosses ground
8-Bit Digital-to-Analog Converter (DAC): Output available externally, Internal connections to comparators, op amps, Fixed Voltage Reference (FVR), and ADC
Internal Voltage Reference module

Applications
General purpose applications
Industrial control
Consumer electronics
Automotive
Medical devices
Battery-powered applications

Specifications

Microchip Technology PIC16LF1718-I/SO technical specifications, attributes, parameters and parts with similar specifications to Microchip Technology PIC16LF1718-I/SO.

  • Factory Lead Time
    6 Weeks
  • Mount
    Surface Mount
  • Mounting Type

    Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include: * Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side. * Surface-mount: Component is placed on the surface of the PCB and soldered in place. * Press-fit: Component is pressed into place on the PCB without soldering. * Socket: Component is inserted into a socket on the PCB, allowing for easy replacement. The mounting type is determined by factors such as the component's size, shape, and power requirements.

    Surface Mount
  • Package / Case

    Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.

    28-SOIC (0.295, 7.50mm Width)
  • Number of Pins

    Number of Pins: Indicates the number of electrical connections available on the component. These pins are used to connect the component to other components or circuits on a printed circuit board (PCB). The number of pins determines the functionality and connectivity options of the component. It is important to ensure that the component has the correct number of pins for the intended application.

    28
  • Weight
    2.214806g
  • Operating Temperature

    Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.

    -40°C~85°C TA
  • Packaging
    Tube
  • Series

    Series, in the context of electronic components, refers to the arrangement of components in a circuit. When components are connected in series, they form a single path for current to flow through. The total resistance of a series circuit is the sum of the individual resistances of each component. Series connections are often used to control the flow of current in a circuit, as the total resistance can be adjusted by changing the number or type of components in the series.

    PIC® XLP™ 16F
  • Published
    2014
  • JESD-609 Code
    e3
  • Part Status

    Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.

    Active
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.

    1 (Unlimited)
  • Number of Terminations
    28
  • ECCN Code
    3A991.A.2
  • Terminal Finish
    Matte Tin (Sn)
  • Additional Feature
    IT ALSO OPERATES AT 16MHZ AT 1.8V MIN SUPPLY
  • Technology

    Technology, in the context of electronic components, refers to the specific manufacturing process and materials used to create the component. It encompasses the semiconductor fabrication techniques, such as the type of transistor used (e.g., MOSFET, BJT), the gate oxide thickness, and the interconnect materials. Technology also includes the packaging type, such as surface mount or through-hole, and the leadframe or substrate material. The technology used impacts the component's performance characteristics, such as speed, power consumption, and reliability.

    CMOS
  • Terminal Position
    DUAL
  • Terminal Form
    GULL WING
  • Peak Reflow Temperature (Cel)
    260
  • Supply Voltage

    Supply Voltage is the voltage required to power an electronic component. It is typically measured in volts (V) and is specified in the component's datasheet. The supply voltage must be within the specified range for the component to function properly. If the supply voltage is too low, the component may not function at all. If the supply voltage is too high, the component may be damaged.

    3V
  • Terminal Pitch
    1.27mm
  • Frequency

    Frequency, in the context of electronic components, refers to the rate at which an alternating current or voltage changes direction per second. It is measured in Hertz (Hz), which represents one cycle per second. Frequency is a crucial parameter for various electronic components, such as capacitors, inductors, and resonators. It determines the component's ability to store or release energy, filter signals, and resonate at specific frequencies. Understanding the frequency characteristics of electronic components is essential for designing and optimizing electronic circuits.

    32MHz
  • Time@Peak Reflow Temperature-Max (s)
    40
  • Base Part Number
    PIC16LF1718
  • Operating Supply Voltage
    3.6V
  • Interface

    In electronics, an interface refers to the connection point or boundary between two or more electronic systems or devices. It defines the physical, electrical, and logical characteristics that enable communication and data exchange between them. An interface specifies the protocols, pinouts, voltage levels, data formats, and other parameters necessary for the systems to interact seamlessly. It ensures compatibility and interoperability between different components or devices, allowing them to exchange information and perform their intended functions.

    I2C, LIN, SPI, UART, USART
  • Memory Size
    28kB
  • Oscillator Type
    Internal
  • Number of I/O
    24
  • RAM Size
    2K x 8
  • Voltage - Supply (Vcc/Vdd)
    1.8V~3.6V
  • uPs/uCs/Peripheral ICs Type
    MICROCONTROLLER, RISC
  • Core Processor

    Core Processor refers to the central processing unit (CPU) of an electronic device. It is the brain of the device, responsible for executing instructions, processing data, and managing the overall operation of the system. The core processor's speed, number of cores, and architecture determine the device's performance and capabilities.

    PIC
  • Peripherals
    Brown-out Detect/Reset, POR, PWM, WDT
  • Program Memory Type
    FLASH
  • Core Size

    Core Size refers to the physical dimensions of the magnetic core used in an electronic component, such as an inductor or transformer. It is typically expressed in terms of its length, width, and height, or as a diameter and height for cylindrical cores. The core size determines the inductance, current-carrying capacity, and other electrical characteristics of the component. Larger core sizes generally result in higher inductance and current-handling capabilities.

    8-Bit
  • Program Memory Size
    28KB 16K x 14
  • Connectivity

    Connectivity refers to the number of terminals or pins on an electronic component that allow it to connect to other components in a circuit. It determines the component's ability to interact and exchange signals with other elements in the system. Higher connectivity indicates more connection points, enabling the component to perform complex functions and integrate with various circuits.

    I2C, LINbus, SPI, UART/USART
  • Bit Size
    8
  • Data Converter
    A/D 17x10b; D/A 1x5b, 1x8b
  • Has ADC
    YES
  • DMA Channels
    NO
  • Data Bus Width

    Data Bus Width refers to the number of bits that can be transmitted simultaneously on a data bus. It determines the amount of data that can be transferred between components in a single operation. A wider data bus allows for faster data transfer rates and higher system performance. Common data bus widths include 8, 16, 32, and 64 bits, with wider buses typically found in high-performance systems.

    8b
  • PWM Channels
    YES
  • Number of Timers/Counters
    5
  • ROM (words)
    16384
  • On Chip Program ROM Width
    14
  • Screening Level
    TS 16949
  • Number of ADC Channels
    17
  • RoHS Status
    ROHS3 Compliant

Certification

  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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