0 Shopping Cart

Microchip Technology PIC16F1513-I/MV

Part Number:

PIC16F1513-I/MV

Manufacturer:

Microchip Technology

Ventron No:

3147205-PIC16F1513-I/MV

Description:

IC MCU 8BIT 7KB FLASH 28UQFN

ECAD Model:

Datasheet:

PIC16F1513-I/MV

Payment:

Payment

Delivery:

Delivery

Quick Request Quote

Reference Price ( In US Dollars )

Pricing

Qty

Unit Price

Ext Price

  • 1

    $1.6145

    $1.61

  • 200

    $0.6252

    $125.04

  • 500

    $0.6035

    $301.75

  • 1000

    $0.5927

    $592.70

Do you want a lower wholesale price? Please send us an inquiry, and we will respond immediately.
Quantity
Comments
  • One Stop Service

    One Stop Service

  • Competitive Price

    Competitive Price

  • Source Traceability

    Source Traceability

  • Same Day Delivery

    Same Day Delivery

Part Overview

Description
The PIC16(L)F1512/3 are 28-pin Flash microcontrollers with XLP technology. They feature a high-performance RISC CPU with a C compiler optimized architecture, only 49 instructions, and up to 7 Kbytes of linear program memory addressing. They also have up to 256 bytes of linear data memory addressing and an operating speed of up to 20 MHz clock input at 2.5V or 16 MHz clock input at 1.8V.

Features
High-performance RISC CPU
Flexible oscillator structure
Analog features
Extreme low-power management
Special microcontroller features
Peripheral highlights

Applications
Industrial control
Consumer electronics
Automotive
Medical
Wireless communication

Specifications

Microchip Technology PIC16F1513-I/MV technical specifications, attributes, parameters and parts with similar specifications to Microchip Technology PIC16F1513-I/MV.

  • Factory Lead Time
    7 Weeks
  • Mounting Type

    Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include: * Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side. * Surface-mount: Component is placed on the surface of the PCB and soldered in place. * Press-fit: Component is pressed into place on the PCB without soldering. * Socket: Component is inserted into a socket on the PCB, allowing for easy replacement. The mounting type is determined by factors such as the component's size, shape, and power requirements.

    Surface Mount
  • Package / Case

    Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.

    28-UFQFN Exposed Pad
  • Surface Mount
    YES
  • Number of Pins

    Number of Pins: Indicates the number of electrical connections available on the component. These pins are used to connect the component to other components or circuits on a printed circuit board (PCB). The number of pins determines the functionality and connectivity options of the component. It is important to ensure that the component has the correct number of pins for the intended application.

    28
  • Operating Temperature

    Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.

    -40°C~85°C TA
  • Packaging
    Tube
  • Series

    Series, in the context of electronic components, refers to the arrangement of components in a circuit. When components are connected in series, they form a single path for current to flow through. The total resistance of a series circuit is the sum of the individual resistances of each component. Series connections are often used to control the flow of current in a circuit, as the total resistance can be adjusted by changing the number or type of components in the series.

    PIC® XLP™ 16F
  • Published
    2012
  • JESD-609 Code
    e3
  • Part Status

    Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.

    Active
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.

    1 (Unlimited)
  • Number of Terminations
    28
  • Terminal Finish
    Matte Tin (Sn) - annealed
  • Subcategory
    Microcontrollers
  • Max Power Dissipation
    800mW
  • Technology

    Technology, in the context of electronic components, refers to the specific manufacturing process and materials used to create the component. It encompasses the semiconductor fabrication techniques, such as the type of transistor used (e.g., MOSFET, BJT), the gate oxide thickness, and the interconnect materials. Technology also includes the packaging type, such as surface mount or through-hole, and the leadframe or substrate material. The technology used impacts the component's performance characteristics, such as speed, power consumption, and reliability.

    CMOS
  • Terminal Position
    QUAD
  • Peak Reflow Temperature (Cel)
    260
  • Frequency

    Frequency, in the context of electronic components, refers to the rate at which an alternating current or voltage changes direction per second. It is measured in Hertz (Hz), which represents one cycle per second. Frequency is a crucial parameter for various electronic components, such as capacitors, inductors, and resonators. It determines the component's ability to store or release energy, filter signals, and resonate at specific frequencies. Understanding the frequency characteristics of electronic components is essential for designing and optimizing electronic circuits.

    20MHz
  • Time@Peak Reflow Temperature-Max (s)
    40
  • Base Part Number
    PIC16F1513
  • Supply Voltage-Max (Vsup)
    5.5V
  • Interface

    In electronics, an interface refers to the connection point or boundary between two or more electronic systems or devices. It defines the physical, electrical, and logical characteristics that enable communication and data exchange between them. An interface specifies the protocols, pinouts, voltage levels, data formats, and other parameters necessary for the systems to interact seamlessly. It ensures compatibility and interoperability between different components or devices, allowing them to exchange information and perform their intended functions.

    I2C, LIN, SPI, UART, USART
  • Memory Size
    7kB
  • Oscillator Type
    Internal
  • Number of I/O
    25
  • RAM Size
    256 x 8
  • Voltage - Supply (Vcc/Vdd)
    2.3V~5.5V
  • uPs/uCs/Peripheral ICs Type
    MICROCONTROLLER, RISC
  • Core Processor

    Core Processor refers to the central processing unit (CPU) of an electronic device. It is the brain of the device, responsible for executing instructions, processing data, and managing the overall operation of the system. The core processor's speed, number of cores, and architecture determine the device's performance and capabilities.

    PIC
  • Peripherals
    Brown-out Detect/Reset, POR, PWM, WDT
  • Program Memory Type
    FLASH
  • Core Size

    Core Size refers to the physical dimensions of the magnetic core used in an electronic component, such as an inductor or transformer. It is typically expressed in terms of its length, width, and height, or as a diameter and height for cylindrical cores. The core size determines the inductance, current-carrying capacity, and other electrical characteristics of the component. Larger core sizes generally result in higher inductance and current-handling capabilities.

    8-Bit
  • Program Memory Size
    7KB 4K x 14
  • Connectivity

    Connectivity refers to the number of terminals or pins on an electronic component that allow it to connect to other components in a circuit. It determines the component's ability to interact and exchange signals with other elements in the system. Higher connectivity indicates more connection points, enabling the component to perform complex functions and integrate with various circuits.

    I2C, LINbus, SPI, UART/USART
  • Bit Size
    8
  • Data Converter
    A/D 17x10b
  • Watchdog Timer
    Yes
  • Has ADC
    YES
  • DMA Channels
    NO
  • Data Bus Width

    Data Bus Width refers to the number of bits that can be transmitted simultaneously on a data bus. It determines the amount of data that can be transferred between components in a single operation. A wider data bus allows for faster data transfer rates and higher system performance. Common data bus widths include 8, 16, 32, and 64 bits, with wider buses typically found in high-performance systems.

    8b
  • Number of Timers/Counters
    3
  • ROM (words)
    4096
  • CPU Family
    PIC
  • Number of ADC Channels
    17
  • Number of PWM Channels
    2
  • Number of I2C Channels
    1
  • Height

    Height, in the context of electronic components, refers to the vertical dimension of the component. It is typically measured in millimeters (mm) or inches (in). Height is an important parameter to consider when designing and assembling electronic circuits, as it affects the overall size and form factor of the device. Components with a smaller height are often preferred for applications where space is limited, such as in portable devices or embedded systems.

    500μm
  • Length

    Length, in the context of electronic components, refers to the physical dimension of a component along its longest axis. It is typically measured in millimeters (mm) or inches (in). Length is a crucial parameter for determining the physical size and space requirements of a component on a printed circuit board (PCB) or other assembly. It also affects the component's electrical characteristics, such as inductance and capacitance, which can be influenced by the length of conductors or traces within the component.

    4mm
  • Width
    4mm
  • REACH SVHC
    No SVHC
  • Radiation Hardening
    No
  • RoHS Status
    ROHS3 Compliant
  • Lead Free
    Lead Free

Certification

  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

Latest News