PIC16C662-10E/P
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Microchip Technology PIC16C662-10E/P

Part Number:
PIC16C662-10E/P
Manufacturer:
Microchip Technology
Ventron No:
3154628-PIC16C662-10E/P
Description:
IC MCU 8BIT 7KB OTP 40DIP
ECAD Model:
Datasheet:
Tips N Tricks Guide MPLAB® ICE2000 Spec
Payment:
Payment
Delivery:
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Part Overview
Description
The PIC16C64X and PIC16C66X are 8-bit EPROM microcontrollers with analog comparators. They feature a high-performance RISC CPU with a 200 ns instruction cycle and up to 33 I/O pins. The analog comparator module includes two analog comparators, a programmable on-chip voltage reference, and programmable input multiplexing. Other features include a timer0 with an 8-bit programmable prescaler, a power-on reset, a power-up timer, an oscillator start-up timer, a brown-out reset, a watchdog timer, programmable code protection, a power saving SLEEP mode, and serial in-circuit programming.

Features
High-performance RISC CPU
Up to 33 I/O pins
Analog comparator module
Timer0 with 8-bit programmable prescaler
Power-on reset
Power-up timer
Oscillator start-up timer
Brown-out reset
Watchdog timer
Programmable code protection
Power saving SLEEP mode
Serial in-circuit programming

Applications
The PIC16C64X and PIC16C66X are suitable for a wide range of applications, including:
Industrial control
Automotive electronics
Consumer electronics
Medical devices
Telecommunications
Specifications
Microchip Technology PIC16C662-10E/P technical specifications, attributes, parameters and parts with similar specifications to Microchip Technology PIC16C662-10E/P.
  • Mounting Type

    Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include: * Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side. * Surface-mount: Component is placed on the surface of the PCB and soldered in place. * Press-fit: Component is pressed into place on the PCB without soldering. * Socket: Component is inserted into a socket on the PCB, allowing for easy replacement. The mounting type is determined by factors such as the component's size, shape, and power requirements.

    Through Hole
  • Package / Case

    Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.

    40-DIP (0.600, 15.24mm)
  • Surface Mount
    NO
  • Number of Pins

    Number of Pins: Indicates the number of electrical connections available on the component. These pins are used to connect the component to other components or circuits on a printed circuit board (PCB). The number of pins determines the functionality and connectivity options of the component. It is important to ensure that the component has the correct number of pins for the intended application.

    40
  • Operating Temperature

    Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.

    -40°C~125°C TA
  • Packaging
    Tube
  • Series

    Series, in the context of electronic components, refers to the arrangement of components in a circuit. When components are connected in series, they form a single path for current to flow through. The total resistance of a series circuit is the sum of the individual resistances of each component. Series connections are often used to control the flow of current in a circuit, as the total resistance can be adjusted by changing the number or type of components in the series.

    PIC® 16C
  • Published
    1996
  • JESD-609 Code
    e3
  • Pbfree Code
    yes
  • Part Status

    Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.

    Obsolete
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.

    1 (Unlimited)
  • Number of Terminations
    40
  • Terminal Finish
    Matte Tin (Sn)
  • Subcategory
    Microcontrollers
  • Max Power Dissipation
    1W
  • Technology

    Technology, in the context of electronic components, refers to the specific manufacturing process and materials used to create the component. It encompasses the semiconductor fabrication techniques, such as the type of transistor used (e.g., MOSFET, BJT), the gate oxide thickness, and the interconnect materials. Technology also includes the packaging type, such as surface mount or through-hole, and the leadframe or substrate material. The technology used impacts the component's performance characteristics, such as speed, power consumption, and reliability.

    CMOS
  • Terminal Position
    DUAL
  • Supply Voltage

    Supply Voltage is the voltage required to power an electronic component. It is typically measured in volts (V) and is specified in the component's datasheet. The supply voltage must be within the specified range for the component to function properly. If the supply voltage is too low, the component may not function at all. If the supply voltage is too high, the component may be damaged.

    5V
  • Terminal Pitch
    2.54mm
  • Frequency

    Frequency, in the context of electronic components, refers to the rate at which an alternating current or voltage changes direction per second. It is measured in Hertz (Hz), which represents one cycle per second. Frequency is a crucial parameter for various electronic components, such as capacitors, inductors, and resonators. It determines the component's ability to store or release energy, filter signals, and resonate at specific frequencies. Understanding the frequency characteristics of electronic components is essential for designing and optimizing electronic circuits.

    10MHz
  • Base Part Number
    PIC16C662
  • Pin Count
    40
  • Supply Voltage-Max (Vsup)
    5.5V
  • Power Supplies
    5V
  • Supply Voltage-Min (Vsup)
    4.5V
  • Interface

    In electronics, an interface refers to the connection point or boundary between two or more electronic systems or devices. It defines the physical, electrical, and logical characteristics that enable communication and data exchange between them. An interface specifies the protocols, pinouts, voltage levels, data formats, and other parameters necessary for the systems to interact seamlessly. It ensures compatibility and interoperability between different components or devices, allowing them to exchange information and perform their intended functions.

    RS-232
  • Memory Size
    7kB
  • Oscillator Type
    External
  • Number of I/O
    33
  • RAM Size
    176 x 8
  • Memory Type

    Memory Type refers to the type of memory technology used in an electronic device. It indicates the specific design and architecture of the memory, such as DRAM (Dynamic Random Access Memory), SRAM (Static Random Access Memory), ROM (Read-Only Memory), EEPROM (Electrically Erasable Programmable Read-Only Memory), or Flash memory. Each memory type has unique characteristics, including speed, capacity, volatility, and cost, which determine its suitability for different applications.

    EPROM
  • Voltage - Supply (Vcc/Vdd)
    4V~6V
  • uPs/uCs/Peripheral ICs Type
    MICROCONTROLLER, RISC
  • Core Processor

    Core Processor refers to the central processing unit (CPU) of an electronic device. It is the brain of the device, responsible for executing instructions, processing data, and managing the overall operation of the system. The core processor's speed, number of cores, and architecture determine the device's performance and capabilities.

    PIC
  • Peripherals
    Brown-out Detect/Reset, LED, POR, WDT
  • Program Memory Type
    OTP
  • Core Size

    Core Size refers to the physical dimensions of the magnetic core used in an electronic component, such as an inductor or transformer. It is typically expressed in terms of its length, width, and height, or as a diameter and height for cylindrical cores. The core size determines the inductance, current-carrying capacity, and other electrical characteristics of the component. Larger core sizes generally result in higher inductance and current-handling capabilities.

    8-Bit
  • Program Memory Size
    7KB 4K x 14
  • Supply Current-Max
    30mA
  • Bit Size
    8
  • Watchdog Timer
    Yes
  • Access Time

    Access time is the time it takes for a memory device to retrieve data from a specific location. It is typically measured in nanoseconds (ns) and is a critical factor in determining the performance of a computer system. The lower the access time, the faster the memory device can retrieve data and the faster the computer can perform tasks.

    10 μs
  • Has ADC
    NO
  • DMA Channels
    NO
  • Data Bus Width

    Data Bus Width refers to the number of bits that can be transmitted simultaneously on a data bus. It determines the amount of data that can be transferred between components in a single operation. A wider data bus allows for faster data transfer rates and higher system performance. Common data bus widths include 8, 16, 32, and 64 bits, with wider buses typically found in high-performance systems.

    8b
  • PWM Channels
    NO
  • DAC Channels
    NO
  • Number of Timers/Counters
    8
  • On Chip Program ROM Width
    14
  • CPU Family
    PIC
  • Radiation Hardening
    No
  • RoHS Status
    ROHS3 Compliant
  • Lead Free
    Lead Free
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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