PI6C4911510ZHIE
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Diodes Incorporated PI6C4911510ZHIE

Part Number:
PI6C4911510ZHIE
Manufacturer:
Diodes Incorporated
Ventron No:
2974886-PI6C4911510ZHIE
Description:
IC CLOCK BUFFER MUX 2:10 32QFN
ECAD Model:
Datasheet:
PI6C4911510
Payment:
Payment
Delivery:
Delivery

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Part Overview
Description
The PI6C4911510 is a highperformance, lowskew 1to10 LVPECL fanout buffer. It features two selectable differential clock inputs and translates to ten LVPECL outputs. The CLK inputs accept LVPECL, LVDS, CML, and SSTL signals. The PI6C4911510 is ideal for clock distribution applications, such as providing fanout for lownoise SaRonixeCera oscillators.

Features
FMAX < 1.5GHz
10 pairs of differential LVPECL outputs
Low additive jitter, <0.03ps (typ)
Selectable differential input pairs with singleended input option
Input CLK accepts: LVPECL, LVDS, CML, SSTL input level
Output skew: 40ps (typ)
Operating Temperature: 40°C to 85°C
Core Power supply: 2.5V ±5% & 3.3V ±10%
Output Power supply: 2.5V ±5% & 3.3V ±10%
Packaging (Pbfree & Green): 32pin QFN and TQFP available

Applications
Clock distribution
Fanout for lownoise oscillators
Specifications
Diodes Incorporated PI6C4911510ZHIE technical specifications, attributes, parameters and parts with similar specifications to Diodes Incorporated PI6C4911510ZHIE.
  • Factory Lead Time
    27 Weeks
  • Mount
    Surface Mount
  • Mounting Type

    Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include: * Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side. * Surface-mount: Component is placed on the surface of the PCB and soldered in place. * Press-fit: Component is pressed into place on the PCB without soldering. * Socket: Component is inserted into a socket on the PCB, allowing for easy replacement. The mounting type is determined by factors such as the component's size, shape, and power requirements.

    Surface Mount
  • Package / Case

    Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.

    32-TQFP
  • Number of Pins

    Number of Pins: Indicates the number of electrical connections available on the component. These pins are used to connect the component to other components or circuits on a printed circuit board (PCB). The number of pins determines the functionality and connectivity options of the component. It is important to ensure that the component has the correct number of pins for the intended application.

    32
  • Operating Temperature

    Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.

    -40°C~85°C
  • Packaging
    Tray
  • Published
    2015
  • Part Status

    Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.

    Obsolete
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.

    1 (Unlimited)
  • ECCN Code
    EAR99
  • Voltage - Supply
    2.375V~3.6V
  • Base Part Number
    PI6C4911510
  • Output
    LVPECL
  • Number of Circuits

    Number of Circuits refers to the number of independent signal paths within an electronic component. It indicates how many separate circuits or channels the component can handle simultaneously. For example, an operational amplifier with a Number of Circuits of 2 can amplify two separate input signals independently. This parameter is crucial for determining the component's functionality and its suitability for specific applications.

    1
  • Frequency (Max)
    1.5GHz
  • Input
    CML, LVDS, LVPECL, SSTL
  • Ratio - Input:Output
    2:10
  • Differential - Input:Output
    Yes/Yes
  • Max Duty Cycle
    52 %
  • RoHS Status
    ROHS3 Compliant
  • Lead Free
    Lead Free
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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