Diodes Incorporated PI3B34X245BEX

PI3B34X245BEX Overview
The Surface Mount technology, also known as SMT, has become the preferred method for assembling electronic components onto printed circuit boards. This technology allows for a smaller form factor and higher component density, making it ideal for compact devices. The Mount used for this process is designed to withstand a wide range of temperatures, from -40°C to 85°C, ensuring reliability in various environments. The components are packaged in Tape & Reel format, making it easier for automated assembly. The ECCN Code for this technology is EAR99, indicating that it is not subject to any export control restrictions. With a supply voltage of 3.3V and a minimum of 2.97V, this technology offers low power consumption with a quiescent current of only 10μA. The Reflow Temperature-Max (s) is 40, ensuring that the components can withstand high-temperature soldering processes. With a fast propagation delay of 250 ps and a TRUE output polarity, this Surface Mount technology offers high performance and reliability for a wide range of electronic applications.

PI3B34X245BEX Features
Supplied in the 80-FSOP (0.154, 3.90mm Width) package
Adopting a supply type of Single
Operating with the supply voltage of 3.3V

PI3B34X245BEX Applications
There are a lot of Diodes Incorporated PI3B34X245BEX Signal Switches / Multiplexers / Decoders applications.

Code converters
Analog to digital conversion
HDMI applications
Automatic Monitoring systems
Electronically controlled engine system
Speed synchronization of multiple motors in industries
PCIe
Video transmission
Enabling different functions units in microprocessor instruction decoding
CNC machines