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NXP USA Inc. NT3H2111W0FTTJ

Part Number:

NT3H2111W0FTTJ

Manufacturer:

NXP USA Inc.

Ventron No:

4409829-NT3H2111W0FTTJ

Description:

IC RFID NFC 13.56MHZ 8TSSOP

Datasheet:

NT3H2111W0FTTJ

Payment:

Payment

Delivery:

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Specifications

NXP USA Inc. NT3H2111W0FTTJ technical specifications, attributes, parameters and parts with similar specifications to NXP USA Inc. NT3H2111W0FTTJ.

  • Factory Lead Time
    8 Weeks
  • Mounting Type

    Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include: * Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side. * Surface-mount: Component is placed on the surface of the PCB and soldered in place. * Press-fit: Component is pressed into place on the PCB without soldering. * Socket: Component is inserted into a socket on the PCB, allowing for easy replacement. The mounting type is determined by factors such as the component's size, shape, and power requirements.

    Surface Mount
  • Package / Case

    Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.

    8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
  • Operating Temperature

    Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.

    -40°C~105°C
  • Packaging
    Tape & Reel (TR)
  • Published
    2010
  • Part Status

    Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.

    Active
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.

    1 (Unlimited)
  • Voltage - Supply
    3.3V
  • Frequency

    Frequency, in the context of electronic components, refers to the rate at which an alternating current or voltage changes direction per second. It is measured in Hertz (Hz), which represents one cycle per second. Frequency is a crucial parameter for various electronic components, such as capacitors, inductors, and resonators. It determines the component's ability to store or release energy, filter signals, and resonate at specific frequencies. Understanding the frequency characteristics of electronic components is essential for designing and optimizing electronic circuits.

    13.56MHz
  • Interface

    In electronics, an interface refers to the connection point or boundary between two or more electronic systems or devices. It defines the physical, electrical, and logical characteristics that enable communication and data exchange between them. An interface specifies the protocols, pinouts, voltage levels, data formats, and other parameters necessary for the systems to interact seamlessly. It ensures compatibility and interoperability between different components or devices, allowing them to exchange information and perform their intended functions.

    I2C
  • Standards
    ISO 14443
  • RoHS Status
    ROHS3 Compliant

Description

Description:
The NT3H2111W0FTTJ is an NFC Forum Type 2 Tag compliant IC from NXP Semiconductors with an integrated I2C interface. It is designed for RFID, RF access, and monitoring applications. The IC is packaged in a TSSOP-8 package and is compliant with the NTAG I2C Plus standard.

Features:
• NFC Forum Type 2 Tag compliant
• Integrated I2C interface
• Compliant with NTAG I2C Plus standard
• TSSOP-8 package
• Low power consumption
• High data transfer rate
• High security
• High reliability

Applications:
• RFID
• RF access
• Monitoring
• Automotive
• Industrial
• Medical
• Retail
• Security
NT3H2111W0FTTJ More Descriptions
NTAG I2C Plus, NFC Forum Type 2 Tag Compliant IC with I2C Interface - TSSOP-8
NFC/RFID Tag and Transponder IC 13560kHz 1KByte Automotive 8-Pin TSSOP T/R
NTAG Contactless and Contact Interface 8-Pin TSSOP T/R
RFID READ/WRITE, 13.56MHZ, TSSOP-8; Frequency Min: -; Frequency Max: 13.56MHz; RFID IC Type: Read, Write; Programmable Memory: -; Output Power: -; RF IC Case Style: TSSOP; No. of Pins: 8Pins; Supply Voltage Min: 1.2V; Supply Voltage Max: 3.6V; Current Consumption: -; Product Range: -; MSL: MSL 1 - Unlimited; SVHC: No SVHC (15-Jan-2019)

Product Comparison

The three parts on the right have similar specifications to NT3H2111W0FTTJ.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Mounting Type
    Package / Case
    Operating Temperature
    Packaging
    Published
    Part Status
    Moisture Sensitivity Level (MSL)
    Voltage - Supply
    Frequency
    Interface
    Standards
    RoHS Status
    Surface Mount
    Number of Terminations
    Technology
    Terminal Position
    Terminal Form
    Peak Reflow Temperature (Cel)
    Time@Peak Reflow Temperature-Max (s)
    Pin Count
    JESD-30 Code
    Length
    Height Seated (Max)
    Width
    View Compare
  • NT3H2111W0FTTJ
    NT3H2111W0FTTJ
    8 Weeks
    Surface Mount
    8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
    -40°C~105°C
    Tape & Reel (TR)
    2010
    Active
    1 (Unlimited)
    3.3V
    13.56MHz
    I2C
    ISO 14443
    ROHS3 Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • NT3H2211W0FT1X
    8 Weeks
    Surface Mount
    8-SOIC (0.154, 3.90mm Width)
    -40°C~105°C
    Tape & Reel (TR)
    2010
    Active
    1 (Unlimited)
    3.3V
    13.56MHz
    I2C
    ISO 14443
    ROHS3 Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • NT3H1101W0FHKH
    8 Weeks
    Surface Mount
    8-XFQFN Exposed Pad
    -40°C~95°C
    Tape & Reel (TR)
    2010
    Active
    1 (Unlimited)
    1.7V~3.6V
    13.56MHz
    I2C
    ISO 14443
    ROHS3 Compliant
    YES
    8
    CMOS
    QUAD
    NO LEAD
    260
    NOT SPECIFIED
    8
    S-PQCC-N8
    1.6mm
    0.5mm
    1.6mm
  • NT3H2211W0FHKH
    8 Weeks
    Surface Mount
    8-XFQFN Exposed Pad
    -40°C~105°C
    Tape & Reel (TR)
    2010
    Active
    1 (Unlimited)
    3.6V
    13.56MHz
    I2C
    ISO 14443
    ROHS3 Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -

Certification

  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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