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NXP USA Inc. NT3H1101W0FHKH

Part Number:

NT3H1101W0FHKH

Manufacturer:

NXP USA Inc.

Ventron No:

4409854-NT3H1101W0FHKH

Description:

IC SMART TAG

Datasheet:

NT3H1101W0FHKH

Payment:

Payment

Delivery:

Delivery

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    One Stop Service

  • Competitive Price

    Competitive Price

  • Source Traceability

    Source Traceability

  • Same Day Delivery

    Same Day Delivery

Specifications

NXP USA Inc. NT3H1101W0FHKH technical specifications, attributes, parameters and parts with similar specifications to NXP USA Inc. NT3H1101W0FHKH.

  • Factory Lead Time
    8 Weeks
  • Mounting Type

    Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include: * Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side. * Surface-mount: Component is placed on the surface of the PCB and soldered in place. * Press-fit: Component is pressed into place on the PCB without soldering. * Socket: Component is inserted into a socket on the PCB, allowing for easy replacement. The mounting type is determined by factors such as the component's size, shape, and power requirements.

    Surface Mount
  • Package / Case

    Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.

    8-XFQFN Exposed Pad
  • Surface Mount
    YES
  • Operating Temperature

    Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.

    -40°C~95°C
  • Packaging
    Tape & Reel (TR)
  • Published
    2010
  • Part Status

    Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.

    Active
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.

    1 (Unlimited)
  • Number of Terminations
    8
  • Technology

    Technology, in the context of electronic components, refers to the specific manufacturing process and materials used to create the component. It encompasses the semiconductor fabrication techniques, such as the type of transistor used (e.g., MOSFET, BJT), the gate oxide thickness, and the interconnect materials. Technology also includes the packaging type, such as surface mount or through-hole, and the leadframe or substrate material. The technology used impacts the component's performance characteristics, such as speed, power consumption, and reliability.

    CMOS
  • Voltage - Supply
    1.7V~3.6V
  • Terminal Position
    QUAD
  • Terminal Form
    NO LEAD
  • Peak Reflow Temperature (Cel)
    260
  • Frequency

    Frequency, in the context of electronic components, refers to the rate at which an alternating current or voltage changes direction per second. It is measured in Hertz (Hz), which represents one cycle per second. Frequency is a crucial parameter for various electronic components, such as capacitors, inductors, and resonators. It determines the component's ability to store or release energy, filter signals, and resonate at specific frequencies. Understanding the frequency characteristics of electronic components is essential for designing and optimizing electronic circuits.

    13.56MHz
  • Time@Peak Reflow Temperature-Max (s)
    NOT SPECIFIED
  • Pin Count
    8
  • JESD-30 Code
    S-PQCC-N8
  • Interface

    In electronics, an interface refers to the connection point or boundary between two or more electronic systems or devices. It defines the physical, electrical, and logical characteristics that enable communication and data exchange between them. An interface specifies the protocols, pinouts, voltage levels, data formats, and other parameters necessary for the systems to interact seamlessly. It ensures compatibility and interoperability between different components or devices, allowing them to exchange information and perform their intended functions.

    I2C
  • Standards
    ISO 14443
  • Length

    Length, in the context of electronic components, refers to the physical dimension of a component along its longest axis. It is typically measured in millimeters (mm) or inches (in). Length is a crucial parameter for determining the physical size and space requirements of a component on a printed circuit board (PCB) or other assembly. It also affects the component's electrical characteristics, such as inductance and capacitance, which can be influenced by the length of conductors or traces within the component.

    1.6mm
  • Height Seated (Max)
    0.5mm
  • Width
    1.6mm
  • RoHS Status
    ROHS3 Compliant

Description

part No. NT3H1101W0FHKH Is this available? : YesShipped from : HK warehouseSame model may have different manufacturers, images only for reference.
NT3H1101W0FHKH More Descriptions
NFC/RFID Tag and Transponder IC 13560kHz 1KByte 8-Pin XQFN EP T/R
RFID READ/WRITE, 13.56MHZ, XQFN-8; Frequency Min: -; Frequency Max: 13.56MHz; RFID IC Type: Read, Write; Programmable Memory: -; Output Power: -; RF IC Case Style: XQFN; No. of Pins: 8Pins; Available until stocks are exhausted
RFID, RF Access, Monitoring ICs 1 (Unlimited) Tape & Reel (TR) Surface Mount 13.56MHz RFID Transponder 8-XFQFN Exposed Pad -40°C~95°C ISO 14443 8 Weeks IC SMART TAG

Product Comparison

The three parts on the right have similar specifications to NT3H1101W0FHKH.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Mounting Type
    Package / Case
    Surface Mount
    Operating Temperature
    Packaging
    Published
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    Technology
    Voltage - Supply
    Terminal Position
    Terminal Form
    Peak Reflow Temperature (Cel)
    Frequency
    Time@Peak Reflow Temperature-Max (s)
    Pin Count
    JESD-30 Code
    Interface
    Standards
    Length
    Height Seated (Max)
    Width
    RoHS Status
    View Compare
  • NT3H1101W0FHKH
    NT3H1101W0FHKH
    8 Weeks
    Surface Mount
    8-XFQFN Exposed Pad
    YES
    -40°C~95°C
    Tape & Reel (TR)
    2010
    Active
    1 (Unlimited)
    8
    CMOS
    1.7V~3.6V
    QUAD
    NO LEAD
    260
    13.56MHz
    NOT SPECIFIED
    8
    S-PQCC-N8
    I2C
    ISO 14443
    1.6mm
    0.5mm
    1.6mm
    ROHS3 Compliant
    -
  • NT3H2211W0FTTJ
    8 Weeks
    Surface Mount
    8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
    -
    -40°C~105°C
    Tape & Reel (TR)
    2010
    Active
    1 (Unlimited)
    -
    -
    3.3V
    -
    -
    -
    13.56MHz
    -
    -
    -
    I2C
    ISO 14443
    -
    -
    -
    ROHS3 Compliant
  • NT3H2211W0FHKH
    8 Weeks
    Surface Mount
    8-XFQFN Exposed Pad
    -
    -40°C~105°C
    Tape & Reel (TR)
    2010
    Active
    1 (Unlimited)
    -
    -
    3.6V
    -
    -
    -
    13.56MHz
    -
    -
    -
    I2C
    ISO 14443
    -
    -
    -
    ROHS3 Compliant
  • NT3H2111W0FTTJ
    8 Weeks
    Surface Mount
    8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
    -
    -40°C~105°C
    Tape & Reel (TR)
    2010
    Active
    1 (Unlimited)
    -
    -
    3.3V
    -
    -
    -
    13.56MHz
    -
    -
    -
    I2C
    ISO 14443
    -
    -
    -
    ROHS3 Compliant

Certification

  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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