NAND512W3A2SN6E

Micron Technology Inc. NAND512W3A2SN6E

Part Number:
NAND512W3A2SN6E
Manufacturer:
Micron Technology Inc.
Ventron No:
3233014-NAND512W3A2SN6E
Description:
IC FLASH 512MBIT 48TSOP
ECAD Model:
Datasheet:
NAND512W3A2SN6E

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Specifications
Micron Technology Inc. NAND512W3A2SN6E technical specifications, attributes, parameters and parts with similar specifications to Micron Technology Inc. NAND512W3A2SN6E.
  • Contact Plating
    Tin
  • Mount
    Surface Mount
  • Mounting Type
    Surface Mount
  • Package / Case
    48-TFSOP (0.724, 18.40mm Width)
  • Number of Pins
    48
  • Operating Temperature
    -40°C~85°C TA
  • Packaging
    Tray
  • Published
    2010
  • JESD-609 Code
    e4
  • Pbfree Code
    yes
  • Part Status
    Obsolete
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    48
  • ECCN Code
    3A991.B.1.A
  • Terminal Finish
    Nickel/Palladium/Gold (Ni/Pd/Au)
  • HTS Code
    8542.32.00.51
  • Voltage - Rated DC
    3V
  • Technology
    FLASH - NAND
  • Voltage - Supply
    2.7V~3.6V
  • Terminal Position
    DUAL
  • Peak Reflow Temperature (Cel)
    260
  • Number of Functions
    1
  • Supply Voltage
    3V
  • Terminal Pitch
    0.5mm
  • Reflow Temperature-Max (s)
    30
  • Base Part Number
    NAND512-A
  • Pin Count
    48
  • Voltage
    3V
  • Memory Size
    512Mb 64M x 8
  • Nominal Supply Current
    8mA
  • Memory Type
    Non-Volatile
  • Memory Format
    FLASH
  • Memory Interface
    Parallel
  • Organization
    64MX8
  • Memory Width
    8
  • Write Cycle Time - Word, Page
    50ns
  • Address Bus Width
    26b
  • Density
    512 Mb
  • Sync/Async
    Asynchronous
  • Word Size
    8b
  • Page Size
    512B
  • Ambient Temperature Range High
    85°C
  • Height
    1.2mm
  • Length
    18.4mm
  • Radiation Hardening
    No
  • RoHS Status
    ROHS3 Compliant
Description
NAND512W3A2SN6E Overview
As far as memory types are concerned, Non-Volatile is considered to be its memory type. The case comes in the Tray style. An embedded 48-TFSOP (0.724, 18.40mm Width) case surrounds memory ics. There is 512Mb 64M x 8 of memory on the chip. This device uses takes advantage of the FLASH format. A wide operating temperature range makes this device ideal for a variety of demanding applications. A voltage of 2.7V~3.6V is possible to be applied to the supply. Its recommended mounting type is Surface Mount. It is planted on the chip with 48 terminations. The comprehensive working procedure of this part involves 1 functions. An 3V supply is required for this ic memory chip to operate properly. When selecting similar parts for the ic memory chip, NAND512-A is often referred to. The memory device has an 48-pin package, which encloses it in a small package. The memory device in question has 48 pins, thus indicating that it has 48 memory locations that can be accessed. Chips such as this one are mounted using Surface Mount mounting, a straightforward method of mounting that is effective. It is rated 8mA for its nominal supply current when it comes to the memory component. As for the voltage, the ic memory chip is able to operate well under a voltage of 3V volts.

NAND512W3A2SN6E Features
Package / Case: 48-TFSOP (0.724, 18.40mm Width)
48 Pins

NAND512W3A2SN6E Applications
There are a lot of Micron Technology Inc. NAND512W3A2SN6E Memory applications.

embedded logic
networking
Cache memory
servers
DVD disk buffer
hard disk drive (HDD)
mainframes
eDRAM
personal digital assistants
cell phones
NAND512W3A2SN6E More Descriptions
SLC NAND Flash Parallel 3V/3.3V 512Mbit 64M x 8bit 12us 48-Pin TSOP Tray
NAND Flash SLC 512Mb , 3V , x8 , 70nm , TSOP48
3A991.B.1.A Surface Mount NAND512-A Tray ic memory 50ns 1.2mm 8mA 512Mb
IC FLASH 512MBIT PARALLEL 48TSOP
Product Description Demo for Development.
Product Comparison
The three parts on the right have similar specifications to NAND512W3A2SN6E.
  • Image
    Part Number
    Manufacturer
    Contact Plating
    Mount
    Mounting Type
    Package / Case
    Number of Pins
    Operating Temperature
    Packaging
    Published
    JESD-609 Code
    Pbfree Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    ECCN Code
    Terminal Finish
    HTS Code
    Voltage - Rated DC
    Technology
    Voltage - Supply
    Terminal Position
    Peak Reflow Temperature (Cel)
    Number of Functions
    Supply Voltage
    Terminal Pitch
    Reflow Temperature-Max (s)
    Base Part Number
    Pin Count
    Voltage
    Memory Size
    Nominal Supply Current
    Memory Type
    Memory Format
    Memory Interface
    Organization
    Memory Width
    Write Cycle Time - Word, Page
    Address Bus Width
    Density
    Sync/Async
    Word Size
    Page Size
    Ambient Temperature Range High
    Height
    Length
    Radiation Hardening
    RoHS Status
    Time@Peak Reflow Temperature-Max (s)
    Supply Voltage-Max (Vsup)
    Power Supplies
    Supply Voltage-Min (Vsup)
    Standby Current-Max
    Access Time (Max)
    Programming Voltage
    Write Cycle Time-Max (tWC)
    Data Polling
    Toggle Bit
    Command User Interface
    Number of Sectors/Size
    Sector Size
    Ready/Busy
    Height Seated (Max)
    REACH SVHC
    Qualification Status
    Operating Supply Voltage
    View Compare
  • NAND512W3A2SN6E
    NAND512W3A2SN6E
    Tin
    Surface Mount
    Surface Mount
    48-TFSOP (0.724, 18.40mm Width)
    48
    -40°C~85°C TA
    Tray
    2010
    e4
    yes
    Obsolete
    3 (168 Hours)
    48
    3A991.B.1.A
    Nickel/Palladium/Gold (Ni/Pd/Au)
    8542.32.00.51
    3V
    FLASH - NAND
    2.7V~3.6V
    DUAL
    260
    1
    3V
    0.5mm
    30
    NAND512-A
    48
    3V
    512Mb 64M x 8
    8mA
    Non-Volatile
    FLASH
    Parallel
    64MX8
    8
    50ns
    26b
    512 Mb
    Asynchronous
    8b
    512B
    85°C
    1.2mm
    18.4mm
    No
    ROHS3 Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • NAND01GW3B2CN6E
    -
    Surface Mount
    Surface Mount
    48-TFSOP (0.724, 18.40mm Width)
    48
    -40°C~85°C TA
    Tray
    2008
    e3
    -
    Obsolete
    3 (168 Hours)
    48
    3A991.B.1.A
    Matte Tin (Sn)
    8542.32.00.51
    -
    FLASH - NAND
    2.7V~3.6V
    DUAL
    260
    1
    3V
    0.5mm
    -
    NAND01G-A
    48
    -
    1Gb 128M x 8
    30mA
    Non-Volatile
    FLASH
    Parallel
    128MX8
    8
    25ns
    28b
    1 Gb
    Asynchronous
    8b
    2kB
    -
    -
    18.4mm
    No
    ROHS3 Compliant
    30
    3.6V
    3/3.3V
    2.7V
    0.00005A
    25000 ns
    3V
    25ms
    NO
    NO
    YES
    1K
    128K
    YES
    1.2mm
    No SVHC
    -
    -
  • NAND01GW3B2BZA6E
    -
    Surface Mount
    Surface Mount
    63-TFBGA
    63
    -40°C~85°C TA
    Tray
    2004
    e1
    yes
    Obsolete
    3 (168 Hours)
    63
    3A991.B.1.A
    TIN SILVER COPPER
    8542.32.00.51
    -
    FLASH - NAND
    2.7V~3.6V
    BOTTOM
    260
    1
    3V
    0.8mm
    -
    NAND01G-A
    63
    -
    1Gb 128M x 8
    30mA
    Non-Volatile
    FLASH
    Parallel
    128MX8
    8
    30ns
    28b
    1 Gb
    Asynchronous
    8b
    2Kwords
    -
    -
    12mm
    -
    ROHS3 Compliant
    30
    3.6V
    3/3.3V
    2.7V
    0.00005A
    20 ns
    3V
    -
    NO
    NO
    YES
    1K
    128K
    YES
    1.05mm
    -
    Not Qualified
    -
  • NAND02GR3B2DZA6E
    -
    Surface Mount
    Surface Mount
    63-TFBGA
    63
    -40°C~85°C TA
    Tray
    2008
    e1
    -
    Discontinued
    3 (168 Hours)
    63
    3A991.B.1.A
    TIN SILVER COPPER
    8542.32.00.51
    -
    FLASH - NAND
    1.7V~1.95V
    BOTTOM
    260
    1
    1.8V
    0.8mm
    -
    NAND02G
    63
    -
    2Gb 256M x 8
    20mA
    Non-Volatile
    FLASH
    Parallel
    256MX8
    8
    45ns
    8b
    2 Gb
    Asynchronous
    8b
    2kB
    -
    -
    11mm
    No
    ROHS3 Compliant
    30
    1.95V
    -
    1.7V
    0.00005A
    25000 ns
    -
    -
    NO
    NO
    YES
    2K
    128K
    YES
    1.05mm
    -
    -
    1.8V
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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