Micron Technology Inc. N25Q512A13G1241F TR

N25Q512A13G1241F TR Overview
The package or case for this device is a 24-TBGA, which stands for 24-terminal ball grid array. This is a type of integrated circuit package that uses a grid of solder balls to connect the device to a circuit board. The supplier device package is also a 24-pin package, but it is a 24-T-PBGA (6x8), which means it has 6 rows and 8 columns of solder balls. The operating temperature for this device is -40°C to 85°C, making it suitable for a wide range of environments. The packaging for this device is tape and reel (TR), which is a common method for shipping and storing electronic components. The moisture sensitivity level (MSL) for this device is 3, which means it can be exposed to ambient air for up to 168 hours without being damaged. The base part number for this device is N25Q512, indicating the specific model and type of memory. This is a non-volatile memory, meaning it retains data even when the power is turned off. The clock frequency for this device is 108MHz, which is the speed at which it can process data. The write cycle time for this device is 8ms for a word and 5ms for a page, meaning it can write data to memory in a specified amount of time. Lastly, this device is RoHS3 compliant, meaning it is in compliance with the European Union's Restriction of Hazardous Substances directive.

N25Q512A13G1241F TR Features
Package / Case: 24-TBGA


N25Q512A13G1241F TR Applications
There are a lot of Micron Technology Inc.
N25Q512A13G1241F TR Memory applications.


cell phones
eSRAM
mainframes
multimedia computers
networking
personal computers
servers
supercomputers
telecommunications
workstations,