Micron Technology Inc. N25Q256A11E1241E

N25Q256A11E1241E Overview
The package or case for this device is a 24-TBGA, which stands for 24-terminal ball grid array. This is a type of surface-mount packaging that allows for a higher number of connections compared to other packaging options. The supplier device package is also a 24-T-PBGA, which stands for 24-terminal plastic ball grid array with a size of 6x8. This type of packaging is commonly used for integrated circuits, providing a compact and efficient design. The maximum operating temperature for this device is 85°C, making it suitable for a wide range of applications. The technology used in this device is FLASH - NOR, which stands for flash memory with a NOR architecture. The voltage supply for this device is 1.7V~2V, providing a stable and efficient power source. The frequency for this device is 108MHz, allowing for fast data transfer and processing. With a voltage of 1.7V, this device operates efficiently while minimizing power consumption. The interface for this device is SPI, serial peripheral interface, which is a common communication protocol used in many electronic devices. The memory format for this device is FLASH, which stands for flash memory, a type of non-volatile storage. The write cycle time for this device is 8ms for a word and 5ms for a page, ensuring fast and efficient data storage. Overall, this device offers a compact and efficient design with high-speed data transfer and low power consumption, making it suitable for a variety of applications.

N25Q256A11E1241E Features
Package / Case: 24-TBGA
24 Pins
Freguency at 108MHz
108MHz terminals


N25Q256A11E1241E Applications
There are a lot of Micron Technology Inc.
N25Q256A11E1241E Memory applications.


servers
supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
Camcorders
embedded logic
eDRAM