Macronix MX68GL1G0FHXFI-11G
- Part Number:
- MX68GL1G0FHXFI-11G
- Manufacturer:
- Macronix
- Ventron No:
- 3235057-MX68GL1G0FHXFI-11G
- Description:
- IC FLASH 1GBIT 110NS 64LFBGA
- Datasheet:
- MX68GL1G0F
Macronix MX68GL1G0FHXFI-11G technical specifications, attributes, parameters and parts with similar specifications to Macronix MX68GL1G0FHXFI-11G.
- Surface MountYES
- Number of Terminations64
- Max Operating Temperature85°C
- Min Operating Temperature-40°C
- SubcategoryFlash Memories
- TechnologyCMOS
- Terminal PositionBOTTOM
- Terminal FormBALL
- Peak Reflow Temperature (Cel)260
- Number of Functions1
- Supply Voltage3V
- Terminal Pitch1mm
- Time@Peak Reflow Temperature-Max (s)40
- JESD-30 CodeR-PBGA-B64
- Qualification StatusNot Qualified
- Supply Voltage-Max (Vsup)3.6V
- Power Supplies3/3.3V
- Temperature GradeINDUSTRIAL
- Supply Voltage-Min (Vsup)2.7V
- InterfaceParallel
- Memory TypeFLASH, NOR
- Operating ModeASYNCHRONOUS
- Supply Current-Max0.1mA
- Organization64MX16
- Memory Width16
- Standby Current-Max0.00012A
- Memory Density1073741824 bit
- Access Time (Max)110 ns
- Programming Voltage3V
- Alternate Memory Width8
- Data PollingYES
- Toggle BitYES
- Number of Sectors/Size1K
- Sector Size128K
- Page Size8/16words
- Ready/BusyYES
- Length13mm
- Height Seated (Max)1.4mm
- Width11mm
- RoHS StatusRoHS Compliant
MX68GL1G0FHXFI-11G Overview
There is a memory type FLASH, NOR for this type of device. The chip contains 64 terminations. As many as 1 functions are supported for comprehensive working. An 3V supply is required for this ic memory chip to operate properly. The power supply needed for this memory chip is only 3/3.3V . There must be at least an -40°C operating temperature for this device. The part should not be operated at temperatures above 85°C degrees Celsius as otherwise, the part may be damaged due to the excessive amount of heat. This device can be operated from a maximum supply current of 0.1mA under ideal conditions. 3V programming voltage is required to change the state of certain nonvolatile memory arrays. The component is usually referred to as a type of Flash Memories. It is important to keep in mind that this memory has 1K specific sized divisions in total.
MX68GL1G0FHXFI-11G Features
MX68GL1G0FHXFI-11G Applications
There are a lot of Macronix
MX68GL1G0FHXFI-11G Memory applications.
personal computers
servers
supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
Camcorders
embedded logic
There is a memory type FLASH, NOR for this type of device. The chip contains 64 terminations. As many as 1 functions are supported for comprehensive working. An 3V supply is required for this ic memory chip to operate properly. The power supply needed for this memory chip is only 3/3.3V . There must be at least an -40°C operating temperature for this device. The part should not be operated at temperatures above 85°C degrees Celsius as otherwise, the part may be damaged due to the excessive amount of heat. This device can be operated from a maximum supply current of 0.1mA under ideal conditions. 3V programming voltage is required to change the state of certain nonvolatile memory arrays. The component is usually referred to as a type of Flash Memories. It is important to keep in mind that this memory has 1K specific sized divisions in total.
MX68GL1G0FHXFI-11G Features
MX68GL1G0FHXFI-11G Applications
There are a lot of Macronix
MX68GL1G0FHXFI-11G Memory applications.
personal computers
servers
supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
Camcorders
embedded logic
MX68GL1G0FHXFI-11G More Descriptions
NOR Flash Parallel 3.3V 1Gbit 128M/64M x 8bit/16bit 110ns 64-Pin LFBGA
Parallel FLASH 1GBIT 3V 110NS 64LFBGA
LFBGA-64,CSP(11x13) NOR FLASH ROHS
Parallel FLASH 1GBIT 3V 110NS 64LFBGA
LFBGA-64,CSP(11x13) NOR FLASH ROHS
The three parts on the right have similar specifications to MX68GL1G0FHXFI-11G.
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ImagePart NumberManufacturerSurface MountNumber of TerminationsMax Operating TemperatureMin Operating TemperatureSubcategoryTechnologyTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Number of FunctionsSupply VoltageTerminal PitchTime@Peak Reflow Temperature-Max (s)JESD-30 CodeQualification StatusSupply Voltage-Max (Vsup)Power SuppliesTemperature GradeSupply Voltage-Min (Vsup)InterfaceMemory TypeOperating ModeSupply Current-MaxOrganizationMemory WidthStandby Current-MaxMemory DensityAccess Time (Max)Programming VoltageAlternate Memory WidthData PollingToggle BitNumber of Sectors/SizeSector SizePage SizeReady/BusyLengthHeight Seated (Max)WidthRoHS StatusFactory Lead TimeMounting TypePackage / CaseOperating TemperaturePackagingSeriesPart StatusVoltage - SupplyReach Compliance CodeMemory SizeMemory FormatMemory InterfaceWrite Cycle Time - Word, PageMoisture Sensitivity Level (MSL)View Compare
-
MX68GL1G0FHXFI-11GYES6485°C-40°CFlash MemoriesCMOSBOTTOMBALL26013V1mm40R-PBGA-B64Not Qualified3.6V3/3.3VINDUSTRIAL2.7VParallelFLASH, NORASYNCHRONOUS0.1mA64MX16160.00012A1073741824 bit110 ns3V8YESYES1K128K8/16wordsYES13mm1.4mm11mmRoHS Compliant---------------
-
YES56---FLASH - NORDUAL-NOT SPECIFIED13V0.5mmNOT SPECIFIEDR-PDSO-G56-3.6V--2.7V-Non-VolatileASYNCHRONOUS-64MX1616-1073741824 bit100 ns3V-------18.4mm1.2mm14mmRoHS Compliant10 WeeksSurface Mount56-TFSOP (0.724, 18.40mm Width)-40°C~85°C TATrayMX68GLActive2.7V~3.6Vcompliant1Gb 128M x 8FLASHParallel100ns-
-
YES56---FLASH - NORDUAL--13V0.5mm-R-PDSO-G56-3.6V--2.7V-Non-VolatileASYNCHRONOUS-64MX1616-1073741824 bit110 ns3V-------18.4mm1.2mm14mmROHS3 Compliant8 WeeksSurface Mount56-TFSOP (0.724, 18.40mm Width)-40°C~85°C TATape & Reel (TR)MXSMIO™Active2.7V~3.6V-1Gb 128M x 8FLASHParallel110ns3 (168 Hours)
-
YES6485°C-40°CFlash MemoriesCMOSBOTTOMBALL26013V1mm40R-PBGA-B64Not Qualified3.6V3/3.3VINDUSTRIAL2.7VParallelFLASH, NORASYNCHRONOUS0.1mA64MX16160.00012A1073741824 bit120 ns3V8YESYES1K128K8/16wordsYES13mm1.4mm11mmRoHS Compliant--------------
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