MX29GL512FDT2I-12G

Macronix MX29GL512FDT2I-12G

Part Number:
MX29GL512FDT2I-12G
Manufacturer:
Macronix
Ventron No:
3234007-MX29GL512FDT2I-12G
Description:
IC FLASH 512MBIT 120NS 56TSOP
ECAD Model:
Datasheet:
MX29GL512F

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Specifications
Macronix MX29GL512FDT2I-12G technical specifications, attributes, parameters and parts with similar specifications to Macronix MX29GL512FDT2I-12G.
  • Factory Lead Time
    16 Weeks
  • Mounting Type
    Surface Mount
  • Package / Case
    56-TFSOP (0.724, 18.40mm Width)
  • Surface Mount
    YES
  • Operating Temperature
    -40°C~85°C TA
  • Packaging
    Tray
  • Series
    MX29GL
  • JESD-609 Code
    e3
  • Part Status
    Not For New Designs
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    56
  • Terminal Finish
    Matte Tin (Sn)
  • Technology
    FLASH - NOR
  • Voltage - Supply
    2.7V~3.6V
  • Terminal Position
    DUAL
  • Peak Reflow Temperature (Cel)
    260
  • Number of Functions
    1
  • Supply Voltage
    3V
  • Terminal Pitch
    0.5mm
  • Time@Peak Reflow Temperature-Max (s)
    40
  • JESD-30 Code
    R-PDSO-G56
  • Qualification Status
    Not Qualified
  • Supply Voltage-Max (Vsup)
    3.6V
  • Power Supplies
    3/3.3V
  • Supply Voltage-Min (Vsup)
    2.7V
  • Memory Size
    512Mb 64M x 8
  • Memory Type
    Non-Volatile
  • Operating Mode
    ASYNCHRONOUS
  • Supply Current-Max
    0.03mA
  • Memory Format
    FLASH
  • Memory Interface
    Parallel
  • Organization
    32MX16
  • Memory Width
    16
  • Write Cycle Time - Word, Page
    120ns
  • Standby Current-Max
    0.00002A
  • Memory Density
    536870912 bit
  • Access Time (Max)
    120 ns
  • Programming Voltage
    3V
  • Alternate Memory Width
    8
  • Data Polling
    YES
  • Toggle Bit
    YES
  • Command User Interface
    YES
  • Number of Sectors/Size
    512
  • Sector Size
    128K
  • Page Size
    8/16words
  • Ready/Busy
    YES
  • Common Flash Interface
    YES
  • Height Seated (Max)
    1.2mm
  • Length
    18.4mm
  • Width
    14mm
  • RoHS Status
    ROHS3 Compliant
Description
MX29GL512FDT2I-12G Overview
The Surface Mount technology has become increasingly popular in the electronics industry due to its compact size and efficient use of space. One common packaging option for surface mount components is the tray, which allows for easy handling and storage during the manufacturing process. It is important to note that these components have a Moisture Sensitivity Level (MSL) of 3, meaning they can withstand 168 hours of exposure to moisture before any potential damage occurs. The terminal finish used for these components is Matte Tin (Sn), which provides a reliable and durable connection. They are classified under the JESD-30 Code R-PDSO-G56 and have a minimum supply voltage of 2.7V. With a memory density of 536870912 bits and a maximum access time of 120 ns, these components offer high performance and efficiency. Additionally, they have an alternate memory width of 8 and a width of 14mm, making them suitable for a wide range of applications.

MX29GL512FDT2I-12G Features
Package / Case: 56-TFSOP (0.724, 18.40mm Width)


MX29GL512FDT2I-12G Applications
There are a lot of Macronix
MX29GL512FDT2I-12G Memory applications.


multimedia computers
networking
personal computers
servers
supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
MX29GL512FDT2I-12G More Descriptions
IC FLASH 512MBIT PARALLEL 56TSOP
Single Voltage Flash Memory 512Mb Capacity 64M x 8/32M x 16 Organization 3V Supply Voltage 120ns Speed Surface Mount 56-Pin TSOP Tray
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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