Macronix MX29GL256FHXGI-90Q
- Part Number:
- MX29GL256FHXGI-90Q
- Manufacturer:
- Macronix
- Ventron No:
- 3233852-MX29GL256FHXGI-90Q
- Description:
- IC FLASH 256MBIT 90NS 56FBGA
- Datasheet:
- MX29GL256FHXGI-90Q
Macronix MX29GL256FHXGI-90Q technical specifications, attributes, parameters and parts with similar specifications to Macronix MX29GL256FHXGI-90Q.
- Factory Lead Time10 Weeks
- Mounting TypeSurface Mount
- Package / Case56-TFBGA, CSPBGA
- Surface MountYES
- Operating Temperature-40°C~85°C TA
- PackagingTray
- SeriesMX29GL
- Part StatusActive
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of Terminations56
- TechnologyFLASH - NOR
- Voltage - Supply2.7V~3.6V
- Terminal PositionBOTTOM
- Peak Reflow Temperature (Cel)260
- Number of Functions1
- Supply Voltage3.3V
- Terminal Pitch0.8mm
- Time@Peak Reflow Temperature-Max (s)40
- JESD-30 CodeR-PBGA-B56
- Qualification StatusNot Qualified
- Supply Voltage-Max (Vsup)3.6V
- Power Supplies3.3V
- Supply Voltage-Min (Vsup)3V
- Memory Size256Mb 32M x 8
- Memory TypeNon-Volatile
- Operating ModeASYNCHRONOUS
- Supply Current-Max0.03mA
- Memory FormatFLASH
- Memory InterfaceParallel
- Organization16MX16
- Memory Width16
- Write Cycle Time - Word, Page90ns
- Standby Current-Max0.00001A
- Memory Density268435456 bit
- Access Time (Max)90 ns
- Programming Voltage3V
- Alternate Memory Width8
- Data PollingYES
- Toggle BitYES
- Command User InterfaceYES
- Number of Sectors/Size256
- Sector Size128K
- Page Size8/16words
- Ready/BusyYES
- Common Flash InterfaceYES
- Height Seated (Max)1.2mm
- Length9mm
- Width7mm
- RoHS StatusROHS3 Compliant
- Lead FreeLead Free
MX29GL256FHXGI-90Q Overview
The mounting type for this particular component is surface mount, meaning it is designed to be directly mounted onto a surface rather than inserted into a socket. The package or case of the component is 56-TFBGA, CSPBGA, indicating that it is a 56-pin thin fine-pitch ball grid array or chip-scale package ball grid array. This series is known as MX29GL and has a total of 56 terminations. The technology used in this component is FLASH - NOR, which refers to the type of non-volatile memory it utilizes. It requires a power supply of 3.3V and has a maximum supply current of 0.03mA. The memory width is 16, meaning it can process 16 bits of data at a time, and has a memory density of 268435456 bits. The maximum height when seated is 1.2mm.
MX29GL256FHXGI-90Q Features
Package / Case: 56-TFBGA, CSPBGA
MX29GL256FHXGI-90Q Applications
There are a lot of Macronix
MX29GL256FHXGI-90Q Memory applications.
personal computers
servers
supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
Camcorders
embedded logic
The mounting type for this particular component is surface mount, meaning it is designed to be directly mounted onto a surface rather than inserted into a socket. The package or case of the component is 56-TFBGA, CSPBGA, indicating that it is a 56-pin thin fine-pitch ball grid array or chip-scale package ball grid array. This series is known as MX29GL and has a total of 56 terminations. The technology used in this component is FLASH - NOR, which refers to the type of non-volatile memory it utilizes. It requires a power supply of 3.3V and has a maximum supply current of 0.03mA. The memory width is 16, meaning it can process 16 bits of data at a time, and has a memory density of 268435456 bits. The maximum height when seated is 1.2mm.
MX29GL256FHXGI-90Q Features
Package / Case: 56-TFBGA, CSPBGA
MX29GL256FHXGI-90Q Applications
There are a lot of Macronix
MX29GL256FHXGI-90Q Memory applications.
personal computers
servers
supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
Camcorders
embedded logic
MX29GL256FHXGI-90Q More Descriptions
NOR Flash Parallel 3.3V 256Mbit 32M/16M x 8bit/16bit 90ns 56-Pin FBGA
IC FLASH 256MBIT PARALLEL 56FBGA
IC FLASH 256MBIT PARALLEL 56FBGA
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