MX29GL256FDXGI-11G

Macronix MX29GL256FDXGI-11G

Part Number:
MX29GL256FDXGI-11G
Manufacturer:
Macronix
Ventron No:
3233279-MX29GL256FDXGI-11G
Description:
IC FLASH 256MBIT 110NS 56FBGA
ECAD Model:
Datasheet:
MX29GL256FDXGI-11G

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Specifications
Macronix MX29GL256FDXGI-11G technical specifications, attributes, parameters and parts with similar specifications to Macronix MX29GL256FDXGI-11G.
  • Factory Lead Time
    16 Weeks
  • Mounting Type
    Surface Mount
  • Package / Case
    56-TFBGA, CSPBGA
  • Surface Mount
    YES
  • Operating Temperature
    -40°C~85°C TA
  • Packaging
    Tray
  • Series
    MX29GL
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    56
  • Technology
    FLASH - NOR
  • Voltage - Supply
    2.7V~3.6V
  • Terminal Position
    BOTTOM
  • Peak Reflow Temperature (Cel)
    260
  • Number of Functions
    1
  • Supply Voltage
    3V
  • Terminal Pitch
    0.8mm
  • Time@Peak Reflow Temperature-Max (s)
    40
  • JESD-30 Code
    R-PBGA-B56
  • Qualification Status
    Not Qualified
  • Supply Voltage-Max (Vsup)
    3.6V
  • Power Supplies
    3/3.3V
  • Supply Voltage-Min (Vsup)
    2.7V
  • Memory Size
    256Mb 32M x 8
  • Memory Type
    Non-Volatile
  • Operating Mode
    ASYNCHRONOUS
  • Supply Current-Max
    0.03mA
  • Memory Format
    FLASH
  • Memory Interface
    Parallel
  • Organization
    16MX16
  • Memory Width
    16
  • Write Cycle Time - Word, Page
    110ns
  • Standby Current-Max
    0.00001A
  • Memory Density
    268435456 bit
  • Access Time (Max)
    110 ns
  • Programming Voltage
    3V
  • Alternate Memory Width
    8
  • Data Polling
    YES
  • Toggle Bit
    YES
  • Command User Interface
    YES
  • Number of Sectors/Size
    256
  • Sector Size
    128K
  • Page Size
    8/16words
  • Ready/Busy
    YES
  • Common Flash Interface
    YES
  • Height Seated (Max)
    1.2mm
  • Length
    9mm
  • Width
    7mm
  • RoHS Status
    ROHS3 Compliant
Description
MX29GL256FDXGI-11G Overview
The technology used for this particular device is FLASH - NOR, which refers to the type of memory used. The terminal position for this device is located at the bottom, making it easy to access and connect to other components. The qualification status for this device is currently listed as "Not Qualified," indicating that it has not yet gone through the necessary testing and approvals. The power supply for this device is 3/3.3V, ensuring stable and efficient performance. The organization of the memory is 16MX16, meaning it has a capacity of 16 megabytes with a 16-bit data bus. The standby current-max is an impressively low 0.00001A, indicating minimal power consumption when not in use. The alternate memory width is 8, providing options for different data transfer sizes. Data polling is available for this device, allowing for efficient data retrieval. With a number of 256 sectors and a size of 256, this device has a large storage capacity. Additionally, it is equipped with a common flash interface, making it compatible with other devices and systems.

MX29GL256FDXGI-11G Features
Package / Case: 56-TFBGA, CSPBGA


MX29GL256FDXGI-11G Applications
There are a lot of Macronix
MX29GL256FDXGI-11G Memory applications.


eSRAM
mainframes
multimedia computers
networking
personal computers
servers
supercomputers
telecommunications
workstations,
DVD disk buffer
MX29GL256FDXGI-11G More Descriptions
IC FLASH 256MBIT PARALLEL 56FBGA
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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