Micron Technology Inc. MTFC8GLDEA-1M WT

MTFC8GLDEA-1M WT Overview
The mounting type for this electronic component is surface mount, meaning it is designed to be mounted on the surface of a circuit board. The package or case of the component is a 153-WFBGA, which stands for "fine pitch ball grid array" and has a total of 153 terminals. The terminal finish is TIN SILVER COPPER, indicating the type of coating on the terminals for improved conductivity. This component belongs to the e•MMC™ series, which is a type of embedded multimedia card used for data storage. It falls under the HTS code 8542.31.00.01, which classifies it as an electronic integrated circuit. The peak reflow temperature for this component is 260 degrees Celsius, indicating the maximum temperature it can withstand during the soldering process. It is a non-volatile memory type, meaning it can retain data even when the power is turned off. The component has a length of 13mm and a width of 11.5mm, making it a compact and space-saving option for electronic devices.

MTFC8GLDEA-1M WT Features
Package / Case: 153-WFBGA
Additional Feature:ALSO OPERATES AT 2.7 TO 3.6 V SUPPLY


MTFC8GLDEA-1M WT Applications
There are a lot of Micron Technology Inc.
MTFC8GLDEA-1M WT Memory applications.


networking
personal computers
servers
supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
Camcorders