MT53B256M32D1GZ-062 WT ES:B TR

Micron Technology Inc. MT53B256M32D1GZ-062 WT ES:B TR

Part Number:
MT53B256M32D1GZ-062 WT ES:B TR
Manufacturer:
Micron Technology Inc.
Ventron No:
3235419-MT53B256M32D1GZ-062 WT ES:B TR
Description:
IC SDRAM 8GBIT 1.6GHZ 200FBGA
ECAD Model:
Datasheet:
MT53B256M32D1GZ-062 WT ES:B TR

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Specifications
Micron Technology Inc. MT53B256M32D1GZ-062 WT ES:B TR technical specifications, attributes, parameters and parts with similar specifications to Micron Technology Inc. MT53B256M32D1GZ-062 WT ES:B TR.
  • Factory Lead Time
    10 Weeks
  • Mounting Type
    Surface Mount
  • Package / Case
    200-WFBGA
  • Operating Temperature
    -30°C~85°C TC
  • Packaging
    Tape & Reel (TR)
  • Part Status
    Obsolete
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Technology
    SDRAM - Mobile LPDDR4
  • Voltage - Supply
    1.1V
  • Memory Size
    8Gb 256M x 32
  • Memory Type
    Volatile
  • Clock Frequency
    1600MHz
  • Memory Format
    DRAM
  • RoHS Status
    ROHS3 Compliant
Description
MT53B256M32D1GZ-062 WT ES:B TR Overview
The package or case of this particular electronic component is a 200-WFBGA, which stands for Wafer-Level Ball Grid Array. This type of package is commonly used for integrated circuits and offers a compact and efficient design. The operating temperature range for this component is -30°C to 85°C, making it suitable for use in a variety of environments. However, it is important to note that the part status is now obsolete, which means it is no longer being manufactured. The moisture sensitivity level (MSL) for this component is 3, which means it can withstand up to 168 hours of exposure to moisture without being damaged. The voltage supply for this component is 1.1V, and it has a memory size of 8Gb 256M x 32. This indicates that it has a total memory capacity of 8 gigabits, with each chip containing 256 megabits and 32 data lines. The memory type for this component is volatile, which means it requires a constant power supply to retain data. It has a clock frequency of 1600MHz, which is the speed at which data can be transferred. The memory format for this component is DRAM, which stands for Dynamic Random Access Memory. Lastly, it is important to note that this component is ROHS3 compliant, meaning it meets the requirements for the Restriction of Hazardous Substances Directive.

MT53B256M32D1GZ-062 WT ES:B TR Features
Package / Case: 200-WFBGA


MT53B256M32D1GZ-062 WT ES:B TR Applications
There are a lot of Micron Technology Inc.
MT53B256M32D1GZ-062 WT ES:B TR Memory applications.


supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
Camcorders
embedded logic
eDRAM
graphics card
MT53B256M32D1GZ-062 WT ES:B TR More Descriptions
IC SDRAM 8GBIT 1.6GHZ 200FBGA
DRAM LPDDR4 8G 256MX32 FBGA
IC DRAM 8G 1600MHZ 200FBGA
SPECIAL/CUSTOM LPDDR4
Product Comparison
The three parts on the right have similar specifications to MT53B256M32D1GZ-062 WT ES:B TR.
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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