Micron Technology Inc. MT49H16M18FM-33:B
- Part Number:
- MT49H16M18FM-33:B
- Manufacturer:
- Micron Technology Inc.
- Ventron No:
- 3255394-MT49H16M18FM-33:B
- Description:
- IC RLDRAM 288MBIT 300MHZ 144UBGA
- Datasheet:
- MT49H32M9, 16M18, 8M36
Description
The MicronCIO RLDRAM 2 is a high-performance, low-power memory device designed for use in high-bandwidth applications. It features a 533 MHz DDR operation, a 38.4 Gb/s peak bandwidth, and a reduced cycle time of 15ns at 533 MHz. The RLDRAM 2 is organized as 32 Meg x 9, 16 Meg x 18, or 8 Meg x 36, and has 8 internal banks for concurrent operation and maximum bandwidth.
Features
533 MHz DDR operation (1.067 Gb/s/pin data rate)
38.4 Gb/s peak bandwidth (x36 at 533 MHz clock frequency)
Organization:
32 Meg x 9
16 Meg x 18
8 Meg x 36
8 internal banks for concurrent operation and maximum bandwidth
Reduced cycle time (15ns at 533 MHz)
Nonmultiplexed addresses (address multiplexing option available)
SRAM-type interface
Programmable READ latency (RL), row cycle time, and burst sequence length
Balanced READ and WRITE latencies to optimize data bus utilization
Data mask for WRITE commands
Differential input clocks (CK, CK#)
Differential input data clocks (DKx, DKx#)
On-die DLL generates CK edge-aligned data and output data clock signals
Data valid signal (QVLD)
32ms refresh (8K refresh for each bank; 64K refresh command must be issued in total each 32ms)
HSTL I/O (1.5V or 1.8V nominal)
25-6002 matched impedance outputs
2.5V VEXT: 1.8VVDD - 1.5V or 1.8VVDDQ I/O
On-die termination (ODT) RTT
Applications
The MicronCIO RLDRAM 2 is ideal for use in a variety of high-bandwidth applications, including:
Networking
Storage
Graphics
Gaming
Embedded systems
The MicronCIO RLDRAM 2 is a high-performance, low-power memory device designed for use in high-bandwidth applications. It features a 533 MHz DDR operation, a 38.4 Gb/s peak bandwidth, and a reduced cycle time of 15ns at 533 MHz. The RLDRAM 2 is organized as 32 Meg x 9, 16 Meg x 18, or 8 Meg x 36, and has 8 internal banks for concurrent operation and maximum bandwidth.
Features
533 MHz DDR operation (1.067 Gb/s/pin data rate)
38.4 Gb/s peak bandwidth (x36 at 533 MHz clock frequency)
Organization:
32 Meg x 9
16 Meg x 18
8 Meg x 36
8 internal banks for concurrent operation and maximum bandwidth
Reduced cycle time (15ns at 533 MHz)
Nonmultiplexed addresses (address multiplexing option available)
SRAM-type interface
Programmable READ latency (RL), row cycle time, and burst sequence length
Balanced READ and WRITE latencies to optimize data bus utilization
Data mask for WRITE commands
Differential input clocks (CK, CK#)
Differential input data clocks (DKx, DKx#)
On-die DLL generates CK edge-aligned data and output data clock signals
Data valid signal (QVLD)
32ms refresh (8K refresh for each bank; 64K refresh command must be issued in total each 32ms)
HSTL I/O (1.5V or 1.8V nominal)
25-6002 matched impedance outputs
2.5V VEXT: 1.8VVDD - 1.5V or 1.8VVDDQ I/O
On-die termination (ODT) RTT
Applications
The MicronCIO RLDRAM 2 is ideal for use in a variety of high-bandwidth applications, including:
Networking
Storage
Graphics
Gaming
Embedded systems
Micron Technology Inc. MT49H16M18FM-33:B technical specifications, attributes, parameters and parts with similar specifications to Micron Technology Inc. MT49H16M18FM-33:B.
- Contact PlatingLead, Silver, Tin
- MountSurface Mount
- Mounting TypeSurface Mount
- Package / Case144-TFBGA
- Number of Pins144
- Operating Temperature0°C~95°C TC
- PackagingTray
- Published2015
- JESD-609 Codee0
- Part StatusDiscontinued
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of Terminations144
- Terminal FinishTIN LEAD SILVER
- Additional FeatureAUTO REFRESH
- TechnologyCMOS
- Voltage - Supply1.7V~1.9V
- Terminal PositionBOTTOM
- Peak Reflow Temperature (Cel)235
- Number of Functions1
- Supply Voltage1.8V
- Terminal Pitch1mm
- Time@Peak Reflow Temperature-Max (s)30
- Operating Supply Voltage1.8V
- Supply Voltage-Max (Vsup)1.9V
- Power Supplies1.5/1.81.82.5V
- Supply Voltage-Min (Vsup)1.7V
- Memory Size288Mb 16M x 18
- Number of Ports1
- Memory TypeVolatile
- Supply Current-Max0.53mA
- Access Time20ns
- Memory FormatDRAM
- Memory InterfaceParallel
- Data Bus Width18b
- Organization16MX18
- Output Characteristics3-STATE
- Memory Width18
- Address Bus Width23b
- Density288 Mb
- Max Frequency300MHz
- I/O TypeCOMMON
- Sequential Burst Length248
- Height Seated (Max)1.2mm
- Length18.5mm
- Radiation HardeningNo
- RoHS StatusROHS3 Compliant
The three parts on the right have similar specifications to MT49H16M18FM-33:B.
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ImagePart NumberManufacturerContact PlatingMountMounting TypePackage / CaseNumber of PinsOperating TemperaturePackagingPublishedJESD-609 CodePart StatusMoisture Sensitivity Level (MSL)Number of TerminationsTerminal FinishAdditional FeatureTechnologyVoltage - SupplyTerminal PositionPeak Reflow Temperature (Cel)Number of FunctionsSupply VoltageTerminal PitchTime@Peak Reflow Temperature-Max (s)Operating Supply VoltageSupply Voltage-Max (Vsup)Power SuppliesSupply Voltage-Min (Vsup)Memory SizeNumber of PortsMemory TypeSupply Current-MaxAccess TimeMemory FormatMemory InterfaceData Bus WidthOrganizationOutput CharacteristicsMemory WidthAddress Bus WidthDensityMax FrequencyI/O TypeSequential Burst LengthHeight Seated (Max)LengthRadiation HardeningRoHS StatusECCN CodeHTS CodeBase Part NumberPin CountStandby Current-MaxLead FreeSupplier Device PackageClock FrequencyFactory Lead TimeSurface MountOperating ModeView Compare
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MT49H16M18FM-33:BLead, Silver, TinSurface MountSurface Mount144-TFBGA1440°C~95°C TCTray2015e0Discontinued3 (168 Hours)144TIN LEAD SILVERAUTO REFRESHCMOS1.7V~1.9VBOTTOM23511.8V1mm301.8V1.9V1.5/1.81.82.5V1.7V288Mb 16M x 181Volatile0.53mA20nsDRAMParallel18b16MX183-STATE1823b288 Mb300MHzCOMMON2481.2mm18.5mmNoROHS3 Compliant------------
-
-Surface MountSurface Mount144-TFBGA1440°C~95°C TCBulk2011e1Obsolete3 (168 Hours)144Tin/Silver/Copper (Sn/Ag/Cu)AUTO REFRESHCMOS1.7V~1.9VBOTTOM-11.8V1mm-1.8V1.9V1.5/1.81.82.5V1.7V576Mb 32M x 181Volatile0.655mA20nsDRAMParallel18b32MX183-STATE1824b576 Mb400MHzCOMMON2481.2mm18.5mmNoROHS3 CompliantEAR998542.32.00.32MT49H32M181440.055ALead Free-----
-
--Surface Mount144-TFBGA-0°C~95°C TCTape & Reel (TR)2008-Obsolete3 (168 Hours)---DRAM1.7V~1.9V----------288Mb 16M x 18-Volatile-20nsDRAMParallel------------ROHS3 Compliant--MT49H16M18---144-μBGA (18.5x11)300MHz---
-
--Surface Mount144-TFBGA1440°C~95°C TCTray--Obsolete3 (168 Hours)144-AUTO REFRESHCMOS1.7V~1.9VBOTTOM-11.8V1mm-1.8V1.9V-1.7V576Mb 32M x 181Volatile-15nsDRAMParallel-32MX18-1820b576 Mb400MHz--1.2mm18.5mm-ROHS3 Compliant--------9 WeeksYESSYNCHRONOUS
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