Micron Technology Inc. MT45W1MW16BAFB-706 WT

MT45W1MW16BAFB-706 WT Overview
The specific package or case for this particular product is a 54-VFBGA, which stands for Very Fine Pitch Ball Grid Array. This packaging is typically used for integrated circuits and contains a large number of small solder balls for connection to a circuit board. The packaging itself comes in a box and is classified under the HTS Code 8542.32.00.41, which is used for electronic integrated circuits. The terminal position for this package is located at the bottom, as indicated by the JESD-30 Code R-PBGA-B54. However, it should be noted that this product is currently not qualified for use. The output characteristics are 3-STATE, meaning that the output can be in a high-impedance state. The memory width is 16, indicating the number of bits that can be stored in the memory. The I/O type is COMMON, which means that the input and output signals share a common ground. Finally, the maximum seated height for this package is 1mm.

MT45W1MW16BAFB-706 WT Features
Package / Case: 54-VFBGA
I/O Type: COMMON


MT45W1MW16BAFB-706 WT Applications
There are a lot of Micron Technology Inc.
MT45W1MW16BAFB-706 WT Memory applications.


telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
Camcorders
embedded logic
eDRAM
graphics card
hard disk drive (HDD)