Micron Technology Inc. MT29RZ2B2DZZHHTB-18I.88F TR

MT29RZ2B2DZZHHTB-18I.88F TR Overview
The package or case for this particular electronic component is 162-VFBGA, which is a type of ball grid array (BGA) package that contains 162 balls. This package is designed to withstand a wide range of operating temperatures, from -40°C to 85°C, making it suitable for use in various environments. The packaging for this component is Tape & Reel (TR), which is a common method used for shipping and handling electronic components. However, it is important to note that this particular part is now obsolete, meaning it is no longer being produced or supported by the manufacturer. It has a moisture sensitivity level (MSL) of 3, which means it can withstand up to 168 hours of exposure to moisture. The technology used in this component is FLASH - NAND and DRAM - LPDDR2, which are types of non-volatile memory. The memory size is 2Gb 256M x 8 N 2G 64M x 32 LPDDR2, indicating that it has a capacity of 2 gigabits and is organized as 256 megabits by 8 bits or 64 megabits by 32 bits. The clock frequency for this component is 533MHz, meaning it can process data at a rate of 533 million cycles per second. Finally, it is important to note that this component is compliant with ROHS3, which means it is free from hazardous substances and meets environmental standards.

MT29RZ2B2DZZHHTB-18I.88F TR Features
Package / Case: 162-VFBGA


MT29RZ2B2DZZHHTB-18I.88F TR Applications
There are a lot of Micron Technology Inc.
MT29RZ2B2DZZHHTB-18I.88F TR Memory applications.


cell phones
eSRAM
mainframes
multimedia computers
networking
personal computers
servers
supercomputers
telecommunications
workstations,