Micron Technology Inc. MT29F512G08CEHBBJ4-3RES:B TR
- Part Number:
- MT29F512G08CEHBBJ4-3RES:B TR
- Manufacturer:
- Micron Technology Inc.
- Ventron No:
- 3238943-MT29F512G08CEHBBJ4-3RES:B TR
- Description:
- IC FLASH 512GBIT 333MHZ 132VBGA
- Datasheet:
- MT29F512G08CEHBBJ4-3RES:B TR
Micron Technology Inc. MT29F512G08CEHBBJ4-3RES:B TR technical specifications, attributes, parameters and parts with similar specifications to Micron Technology Inc. MT29F512G08CEHBBJ4-3RES:B TR.
- Factory Lead Time12 Weeks
- Mounting TypeSurface Mount
- Package / Case132-VBGA
- Operating Temperature0°C~70°C TA
- PackagingTape & Reel (TR)
- Part StatusActive
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- TechnologyFLASH - NAND
- Voltage - Supply2.5V~3.6V
- Memory Size512Gb 64G x 8
- Memory TypeNon-Volatile
- Clock Frequency333MHz
- Memory FormatFLASH
- Memory InterfaceParallel
- RoHS StatusROHS3 Compliant
MT29F512G08CEHBBJ4-3RES:B TR Overview
The package or case for this particular electronic component is a 132-VBGA, which is a type of surface-mount package that is commonly used for integrated circuits. The packaging for this component is a Tape & Reel (TR) format, which is a method of packaging and shipping electronic components in a continuous strip. This component is currently in active production, meaning it is readily available for purchase. It has a Moisture Sensitivity Level (MSL) of 3, which indicates that it can withstand exposure to moisture for up to 168 hours. The technology used in this component is FLASH - NAND, which is a type of non-volatile memory technology. It requires a voltage supply of 2.5V~3.6V and has a memory size of 512Gb 64G x 8. The clock frequency for this component is 333MHz, and it is designed in a FLASH memory format with a parallel memory interface.
MT29F512G08CEHBBJ4-3RES:B TR Features
Package / Case: 132-VBGA
MT29F512G08CEHBBJ4-3RES:B TR Applications
There are a lot of Micron Technology Inc.
MT29F512G08CEHBBJ4-3RES:B TR Memory applications.
personal computers
servers
supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
Camcorders
embedded logic
The package or case for this particular electronic component is a 132-VBGA, which is a type of surface-mount package that is commonly used for integrated circuits. The packaging for this component is a Tape & Reel (TR) format, which is a method of packaging and shipping electronic components in a continuous strip. This component is currently in active production, meaning it is readily available for purchase. It has a Moisture Sensitivity Level (MSL) of 3, which indicates that it can withstand exposure to moisture for up to 168 hours. The technology used in this component is FLASH - NAND, which is a type of non-volatile memory technology. It requires a voltage supply of 2.5V~3.6V and has a memory size of 512Gb 64G x 8. The clock frequency for this component is 333MHz, and it is designed in a FLASH memory format with a parallel memory interface.
MT29F512G08CEHBBJ4-3RES:B TR Features
Package / Case: 132-VBGA
MT29F512G08CEHBBJ4-3RES:B TR Applications
There are a lot of Micron Technology Inc.
MT29F512G08CEHBBJ4-3RES:B TR Memory applications.
personal computers
servers
supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
Camcorders
embedded logic
MT29F512G08CEHBBJ4-3RES:B TR More Descriptions
IC FLASH 512GBIT PAR 132VBGA
IC FLASH 512G PARALLEL 333MHZ
IC FLASH 512G PARALLEL 333MHZ
The three parts on the right have similar specifications to MT29F512G08CEHBBJ4-3RES:B TR.
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ImagePart NumberManufacturerFactory Lead TimeMounting TypePackage / CaseOperating TemperaturePackagingPart StatusMoisture Sensitivity Level (MSL)TechnologyVoltage - SupplyMemory SizeMemory TypeClock FrequencyMemory FormatMemory InterfaceRoHS StatusSeriesSurface MountNumber of TerminationsAdditional FeatureTerminal PositionPeak Reflow Temperature (Cel)Number of FunctionsSupply VoltageTerminal PitchReach Compliance CodeTime@Peak Reflow Temperature-Max (s)JESD-30 CodeSupply Voltage-Max (Vsup)Supply Voltage-Min (Vsup)Operating ModeOrganizationMemory WidthMemory DensityHeight Seated (Max)LengthWidthView Compare
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MT29F512G08CEHBBJ4-3RES:B TR12 WeeksSurface Mount132-VBGA0°C~70°C TATape & Reel (TR)Active3 (168 Hours)FLASH - NAND2.5V~3.6V512Gb 64G x 8Non-Volatile333MHzFLASHParallelROHS3 Compliant----------------------
-
-Surface Mount162-VFBGA-40°C~105°C TATape & Reel (TR)Last Time Buy3 (168 Hours)FLASH - NAND, Mobile LPDRAM1.7V~1.9V4Gb 512M x 8 N 8Gb 512M x 16 LPDDR2Non-Volatile533MHzFLASH, RAMParallelROHS3 CompliantAutomotive, AEC-Q100--------------------
-
16 WeeksSurface Mount130-VFBGA-40°C~85°C TATrayActive-FLASH - NAND, Mobile LPDRAM1.7V~1.95V1Gb 128M x 8 N 512M 16M x 32 LPDRAMNon-Volatile200MHzFLASH, RAMParallelRoHS Compliant-YES130LPDRAM IS ORGANISED AS 32M X 16BOTTOMNOT SPECIFIED11.8V0.65mmcompliantNOT SPECIFIEDR-PBGA-B1301.95V1.7VSYNCHRONOUS128MX881073741824 bit1mm9mm8mm
-
-Surface Mount162-VFBGA-40°C~85°C TATrayLast Time Buy3 (168 Hours)FLASH - NAND, Mobile LPDRAM1.7V~1.9V4Gb 512M x 8 N 2Gb 128M x 16 LPDDR2Non-Volatile533MHzFLASH, RAMParallel----------------------
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