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MICRON MT29F4G16ABADAWP:D

Name: MT29F4G16ABADAWP:D
Brand: MICRON
SKU: 5743992-MT29F4G16ABADAWP:D
Availability: InStock
Rating: 5 (1 reviews)

Part Number:: MT29F4G16ABADAWP:D

Manufacturer:: MICRON

Ventron No:: 5743992-MT29F4G16ABADAWP:D

Description:: in stock

ECAD Model:

Datasheet:: MT29F4G16ABADAWP:D

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Specifications

MICRON MT29F4G16ABADAWP:D technical specifications, attributes, parameters and parts with similar specifications to MICRON MT29F4G16ABADAWP:D.

Factory Lead Time
12 Weeks
Contact Plating
Tin
Mount
Surface Mount
Mounting Type
Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include: * Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side. * Surface-mount: Component is placed on the surface of the PCB and soldered in place. * Press-fit: Component is pressed into place on the PCB without soldering. * Socket: Component is inserted into a socket on the PCB, allowing for easy replacement. The mounting type is determined by factors such as the component's size, shape, and power requirements.
Surface Mount
Package / Case
Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.
48-TFSOP (0.724, 18.40mm Width)
Number of Pins
Number of Pins: Indicates the number of electrical connections available on the component. These pins are used to connect the component to other components or circuits on a printed circuit board (PCB). The number of pins determines the functionality and connectivity options of the component. It is important to ensure that the component has the correct number of pins for the intended application.
48
Operating Temperature
Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.
0°C~70°C TA
Packaging
Tube
Published
2006
Pbfree Code
yes
Part Status
Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.
Obsolete
Moisture Sensitivity Level (MSL)
Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.
3 (168 Hours)
Number of Terminations
48
Technology
Technology, in the context of electronic components, refers to the specific manufacturing process and materials used to create the component. It encompasses the semiconductor fabrication techniques, such as the type of transistor used (e.g., MOSFET, BJT), the gate oxide thickness, and the interconnect materials. Technology also includes the packaging type, such as surface mount or through-hole, and the leadframe or substrate material. The technology used impacts the component's performance characteristics, such as speed, power consumption, and reliability.
FLASH - NAND
Voltage - Supply
2.7V~3.6V
Terminal Position
DUAL
Peak Reflow Temperature (Cel)
260
Number of Functions
1
Supply Voltage
Supply Voltage is the voltage required to power an electronic component. It is typically measured in volts (V) and is specified in the component's datasheet. The supply voltage must be within the specified range for the component to function properly. If the supply voltage is too low, the component may not function at all. If the supply voltage is too high, the component may be damaged.
3.3V
Terminal Pitch
0.5mm
Time@Peak Reflow Temperature-Max (s)
30
Operating Supply Voltage
3.3V
Supply Voltage-Max (Vsup)
3.6V
Supply Voltage-Min (Vsup)
2.7V
Memory Size
4Gb 256M x 16
Memory Type
Memory Type refers to the type of memory technology used in an electronic device. It indicates the specific design and architecture of the memory, such as DRAM (Dynamic Random Access Memory), SRAM (Static Random Access Memory), ROM (Read-Only Memory), EEPROM (Electrically Erasable Programmable Read-Only Memory), or Flash memory. Each memory type has unique characteristics, including speed, capacity, volatility, and cost, which determine its suitability for different applications.
Non-Volatile
Supply Current-Max
0.035mA
Memory Format
Memory Format refers to the arrangement and organization of data within a memory device. It specifies the number of bits, bytes, or words stored in each memory location and how they are accessed.
FLASH
Memory Interface
Parallel
Organization
256MX16
Memory Width
16
Density
4 Gb
Standby Current-Max
0.0001A
Access Time (Max)
25 ns
Word Size
16b
Data Polling
NO
Toggle Bit
NO
Command User Interface
YES
Number of Sectors/Size
4K
Sector Size
64K
Page Size
1Kwords
Ready/Busy
YES
Height Seated (Max)
1.2mm
Length
Length, in the context of electronic components, refers to the physical dimension of a component along its longest axis. It is typically measured in millimeters (mm) or inches (in). Length is a crucial parameter for determining the physical size and space requirements of a component on a printed circuit board (PCB) or other assembly. It also affects the component's electrical characteristics, such as inductance and capacitance, which can be influenced by the length of conductors or traces within the component.
18.4mm
Width
12mm
Radiation Hardening
No
RoHS Status
ROHS3 Compliant

Description

MT29F4G16ABADAWP:D Overview
The product has a Pbfree Code of yes, indicating that it is lead-free. Its Part Status is listed as Obsolete, meaning it is no longer in production. The Moisture Sensitivity Level (MSL) is 3, with a maximum exposure time of 168 hours before potential damage may occur. The Memory Type is Non-Volatile, meaning it retains data even when power is turned off. The Supply Current-Max is 0.035mA, indicating low power consumption. The Memory Format is FLASH, and it has a Memory Width of 16. Data Polling is not supported by this product. The Height Seated (Max) is 1.2mm, and the Width is 12mm.

MT29F4G16ABADAWP:D Features
Package / Case: 48-TFSOP (0.724, 18.40mm Width)
48 Pins
Operating Supply Voltage:3.3V

MT29F4G16ABADAWP:D Applications
There are a lot of Micron Technology Inc.
MT29F4G16ABADAWP:D Memory applications.

servers
supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
Camcorders
embedded logic
eDRAM

MT29F4G16ABADAWP:D More Descriptions

SLC NAND Flash Parallel 3.3V 4G-bit 256M x 16 48-Pin TSOP-I Tray / IC FLASH 4G PARALLEL 48TSOP
M60A NAND FLASH 256MX16 PLASTIC PBF TSOP 3.3V MASS STORAGE
Obsolete Tin 2006 DUAL ic memory 0C~70C TA 2.7V 4Gb 0.0001A
IC FLASH 4GBIT PARALLEL 48TSOP I

Certification