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MT29F32G08ABEABM73A3WC1P

Micron Technology Inc. MT29F32G08ABEABM73A3WC1P

Part Number:
MT29F32G08ABEABM73A3WC1P
Manufacturer:
Micron Technology Inc.
Ventron No:
3246054-MT29F32G08ABEABM73A3WC1P
Description:
IC FLASH 32GBIT WAFER
ECAD Model:
Datasheet:
MT29F32G08ABEABM73A3WC1P

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Specifications
Micron Technology Inc. MT29F32G08ABEABM73A3WC1P technical specifications, attributes, parameters and parts with similar specifications to Micron Technology Inc. MT29F32G08ABEABM73A3WC1P.
  • Mounting Type
    Surface Mount
  • Package / Case
    Die
  • Supplier Device Package
    Die
  • Operating Temperature
    0°C~70°C TA
  • Packaging
    Bulk
  • Published
    2016
  • Part Status
    Obsolete
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Max Operating Temperature
    70°C
  • Min Operating Temperature
    0°C
  • Technology
    FLASH - NAND
  • Voltage - Supply
    2.7V~3.6V
  • Interface
    Parallel
  • Memory Size
    32Gb 4G x 8
  • Memory Type
    Non-Volatile
  • Memory Format
    FLASH
  • Memory Interface
    Parallel
  • RoHS Status
    ROHS3 Compliant
Description
MT29F32G08ABEABM73A3WC1P Overview
This product is packaged as a die and has a supplier device package of die. It was published in 2016 and has a moisture sensitivity level of 3, meaning it can withstand up to 168 hours of exposure to moisture. The maximum operating temperature for this product is 70°C. It requires a voltage supply of 2.7V to 3.6V and has a parallel interface. This product is a non-volatile memory type and has a FLASH memory format. It is also ROHS3 compliant, meaning it meets the requirements for the Restriction of Hazardous Substances Directive.

MT29F32G08ABEABM73A3WC1P Features
Package / Case: Die


MT29F32G08ABEABM73A3WC1P Applications
There are a lot of Micron Technology Inc.
MT29F32G08ABEABM73A3WC1P Memory applications.


cell phones
eSRAM
mainframes
multimedia computers
networking
personal computers
servers
supercomputers
telecommunications
workstations,
MT29F32G08ABEABM73A3WC1P More Descriptions
IC FLASH 32GBIT PARALLEL DIE
IC FLASH 64M SPI 75MHZ 16SO
SLC 32G DIE 4GX8
Product Comparison
The three parts on the right have similar specifications to MT29F32G08ABEABM73A3WC1P.
  • Image
    Part Number
    Manufacturer
    Mounting Type
    Package / Case
    Supplier Device Package
    Operating Temperature
    Packaging
    Published
    Part Status
    Moisture Sensitivity Level (MSL)
    Max Operating Temperature
    Min Operating Temperature
    Technology
    Voltage - Supply
    Interface
    Memory Size
    Memory Type
    Memory Format
    Memory Interface
    RoHS Status
    Series
    Clock Frequency
    Factory Lead Time
    Surface Mount
    Number of Terminations
    Additional Feature
    Terminal Position
    Peak Reflow Temperature (Cel)
    Number of Functions
    Supply Voltage
    Terminal Pitch
    Reach Compliance Code
    Time@Peak Reflow Temperature-Max (s)
    JESD-30 Code
    Supply Voltage-Max (Vsup)
    Supply Voltage-Min (Vsup)
    Operating Mode
    Organization
    Memory Width
    Memory Density
    Height Seated (Max)
    Length
    Width
    View Compare
  • MT29F32G08ABEABM73A3WC1P
    MT29F32G08ABEABM73A3WC1P
    Micron Technology Inc.
    Surface Mount
    Die
    Die
    0°C~70°C TA
    Bulk
    2016
    Obsolete
    3 (168 Hours)
    70°C
    0°C
    FLASH - NAND
    2.7V~3.6V
    Parallel
    32Gb 4G x 8
    Non-Volatile
    FLASH
    Parallel
    ROHS3 Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • MT29AZ5A3CHHWD-18AAT.84F TR
    MT29AZ5A3CHHWD-18AAT.84F TR
    Micron Technology Inc.
    Surface Mount
    162-VFBGA
    -
    -40°C~105°C TA
    Tape & Reel (TR)
    -
    Last Time Buy
    3 (168 Hours)
    -
    -
    FLASH - NAND, Mobile LPDRAM
    1.7V~1.9V
    -
    4Gb 512M x 8 N 8Gb 512M x 16 LPDDR2
    Non-Volatile
    FLASH, RAM
    Parallel
    ROHS3 Compliant
    Automotive, AEC-Q100
    533MHz
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    MT29F32G08ABEABM73A3WC1P vs MT29AZ5A3CHHWD-18AAT.84F TR
  • MT29C1G12MAAIYAMR-5 AIT
    MT29C1G12MAAIYAMR-5 AIT
    Micron Technology Inc.
    Surface Mount
    130-VFBGA
    -
    -40°C~85°C TA
    Tray
    -
    Active
    -
    -
    -
    FLASH - NAND, Mobile LPDRAM
    1.7V~1.95V
    -
    1Gb 128M x 8 N 512M 16M x 32 LPDRAM
    Non-Volatile
    FLASH, RAM
    Parallel
    RoHS Compliant
    -
    200MHz
    16 Weeks
    YES
    130
    LPDRAM IS ORGANISED AS 32M X 16
    BOTTOM
    NOT SPECIFIED
    1
    1.8V
    0.65mm
    compliant
    NOT SPECIFIED
    R-PBGA-B130
    1.95V
    1.7V
    SYNCHRONOUS
    128MX8
    8
    1073741824 bit
    1mm
    9mm
    8mm
    MT29F32G08ABEABM73A3WC1P vs MT29C1G12MAAIYAMR-5 AIT
  • MT29AZ5A3CHHWD-18AIT.84F
    MT29AZ5A3CHHWD-18AIT.84F
    Micron Technology Inc.
    Surface Mount
    162-VFBGA
    -
    -40°C~85°C TA
    Tray
    -
    Last Time Buy
    3 (168 Hours)
    -
    -
    FLASH - NAND, Mobile LPDRAM
    1.7V~1.9V
    -
    4Gb 512M x 8 N 2Gb 128M x 16 LPDDR2
    Non-Volatile
    FLASH, RAM
    Parallel
    -
    -
    533MHz
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    MT29F32G08ABEABM73A3WC1P vs MT29AZ5A3CHHWD-18AIT.84F
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS
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