Micron Technology Inc. MT29F256G08CKCBBH2-10:B TR
- Part Number:
- MT29F256G08CKCBBH2-10:B TR
- Manufacturer:
- Micron Technology Inc.
- Ventron No:
- 4547958-MT29F256G08CKCBBH2-10:B TR
- Description:
- IC FLASH 256GBIT 100MHZ 100TBGA
- Datasheet:
- MT29F256G08CKCBBH2-10:B TR
Micron Technology Inc. MT29F256G08CKCBBH2-10:B TR technical specifications, attributes, parameters and parts with similar specifications to Micron Technology Inc. MT29F256G08CKCBBH2-10:B TR.
- Mounting TypeSurface Mount
- Package / Case100-TBGA
- Operating Temperature0°C~70°C TA
- PackagingTape & Reel (TR)
- Published2016
- Part StatusObsolete
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- TechnologyFLASH - NAND
- Voltage - Supply2.7V~3.6V
- Memory Size256Gb 32G x 8
- Memory TypeNon-Volatile
- Clock Frequency100MHz
- Memory FormatFLASH
- Memory InterfaceParallel
- RoHS StatusROHS3 Compliant
MT29F256G08CKCBBH2-10:B TR Overview
The package or case of this product is a 100-TBGA, which stands for Thin Ball Grid Array. It is a type of surface mount integrated circuit package that is used for high-density applications. The operating temperature range for this product is 0°C to 70°C, meaning it can operate in a wide range of temperatures. This product was published in 2016, but it is now considered obsolete, meaning it is no longer being manufactured. The Moisture Sensitivity Level (MSL) for this product is 3, which means it can withstand exposure to moisture for up to 168 hours. The memory size is 256Gb, with a configuration of 32G x 8. It is a non-volatile memory type, meaning it retains data even when power is turned off. The clock frequency for this product is 100MHz, and it uses a parallel memory interface. It is also important to note that this product is RoHS3 compliant, meaning it meets the Restriction of Hazardous Substances directive for environmentally friendly materials.
MT29F256G08CKCBBH2-10:B TR Features
Package / Case: 100-TBGA
MT29F256G08CKCBBH2-10:B TR Applications
There are a lot of Micron Technology Inc.
MT29F256G08CKCBBH2-10:B TR Memory applications.
personal computers
servers
supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
Camcorders
embedded logic
The package or case of this product is a 100-TBGA, which stands for Thin Ball Grid Array. It is a type of surface mount integrated circuit package that is used for high-density applications. The operating temperature range for this product is 0°C to 70°C, meaning it can operate in a wide range of temperatures. This product was published in 2016, but it is now considered obsolete, meaning it is no longer being manufactured. The Moisture Sensitivity Level (MSL) for this product is 3, which means it can withstand exposure to moisture for up to 168 hours. The memory size is 256Gb, with a configuration of 32G x 8. It is a non-volatile memory type, meaning it retains data even when power is turned off. The clock frequency for this product is 100MHz, and it uses a parallel memory interface. It is also important to note that this product is RoHS3 compliant, meaning it meets the Restriction of Hazardous Substances directive for environmentally friendly materials.
MT29F256G08CKCBBH2-10:B TR Features
Package / Case: 100-TBGA
MT29F256G08CKCBBH2-10:B TR Applications
There are a lot of Micron Technology Inc.
MT29F256G08CKCBBH2-10:B TR Memory applications.
personal computers
servers
supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
Camcorders
embedded logic
MT29F256G08CKCBBH2-10:B TR More Descriptions
Flash MLC NAND Parallel/Serial 3.3V 256Gbit 32G x 8bit 100-Pin TBGA T/R
IC FLASH 256GBIT 100TBGA
IC FLASH 256G PARALLEL 100MHZ
IC PSRAM 16M PARALLEL 54VFBGA
IC FLASH 256GBIT 100TBGA
IC FLASH 256G PARALLEL 100MHZ
IC PSRAM 16M PARALLEL 54VFBGA
The three parts on the right have similar specifications to MT29F256G08CKCBBH2-10:B TR.
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ImagePart NumberManufacturerMounting TypePackage / CaseOperating TemperaturePackagingPublishedPart StatusMoisture Sensitivity Level (MSL)TechnologyVoltage - SupplyMemory SizeMemory TypeClock FrequencyMemory FormatMemory InterfaceRoHS StatusSeriesFactory Lead TimeSurface MountNumber of TerminationsAdditional FeatureTerminal PositionPeak Reflow Temperature (Cel)Number of FunctionsSupply VoltageTerminal PitchReach Compliance CodeTime@Peak Reflow Temperature-Max (s)JESD-30 CodeSupply Voltage-Max (Vsup)Supply Voltage-Min (Vsup)Operating ModeOrganizationMemory WidthMemory DensityHeight Seated (Max)LengthWidthView Compare
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MT29F256G08CKCBBH2-10:B TRSurface Mount100-TBGA0°C~70°C TATape & Reel (TR)2016Obsolete3 (168 Hours)FLASH - NAND2.7V~3.6V256Gb 32G x 8Non-Volatile100MHzFLASHParallelROHS3 Compliant-----------------------
-
Surface Mount162-VFBGA-40°C~105°C TATape & Reel (TR)-Last Time Buy3 (168 Hours)FLASH - NAND, Mobile LPDRAM1.7V~1.9V4Gb 512M x 8 N 8Gb 512M x 16 LPDDR2Non-Volatile533MHzFLASH, RAMParallelROHS3 CompliantAutomotive, AEC-Q100---------------------
-
Surface Mount130-VFBGA-40°C~85°C TATray-Active-FLASH - NAND, Mobile LPDRAM1.7V~1.95V1Gb 128M x 8 N 512M 16M x 32 LPDRAMNon-Volatile200MHzFLASH, RAMParallelRoHS Compliant-16 WeeksYES130LPDRAM IS ORGANISED AS 32M X 16BOTTOMNOT SPECIFIED11.8V0.65mmcompliantNOT SPECIFIEDR-PBGA-B1301.95V1.7VSYNCHRONOUS128MX881073741824 bit1mm9mm8mm
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Surface Mount162-VFBGA-40°C~85°C TATray-Last Time Buy3 (168 Hours)FLASH - NAND, Mobile LPDRAM1.7V~1.9V4Gb 512M x 8 N 2Gb 128M x 16 LPDDR2Non-Volatile533MHzFLASH, RAMParallel-----------------------
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