Micron Technology Inc. MT29F256G08CECCBH6-6ITR:C TR
- Part Number:
- MT29F256G08CECCBH6-6ITR:C TR
- Manufacturer:
- Micron Technology Inc.
- Ventron No:
- 3245855-MT29F256G08CECCBH6-6ITR:C TR
- Description:
- IC FLASH 256GBIT 167MHZ 152VBGA
- Datasheet:
- MT29F256G08CECCBH6-6ITR:C TR
Micron Technology Inc. MT29F256G08CECCBH6-6ITR:C TR technical specifications, attributes, parameters and parts with similar specifications to Micron Technology Inc. MT29F256G08CECCBH6-6ITR:C TR.
- Mounting TypeSurface Mount
- Package / Case152-VBGA
- Operating Temperature-40°C~85°C TA
- PackagingTape & Reel (TR)
- Part StatusObsolete
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- TechnologyFLASH - NAND
- Voltage - Supply2.7V~3.6V
- Memory Size256Gb 32G x 8
- Memory TypeNon-Volatile
- Clock Frequency167MHz
- Memory FormatFLASH
- Memory InterfaceParallel
- RoHS StatusROHS3 Compliant
MT29F256G08CECCBH6-6ITR:C TR Overview
The mounting type of a device refers to how it is physically attached to a circuit board. In this case, the mounting type is surface mount, meaning the device is soldered directly onto the surface of the board. This type of mounting is commonly used in compact electronic devices. The operating temperature range for this device is -40°C to 85°C, making it suitable for use in a wide range of environments. It is packaged in tape and reel (TR) format, which is a standard method for shipping and handling electronic components. However, it is important to note that this particular device is now considered obsolete, meaning it is no longer being manufactured. The technology used in this device is FLASH - NAND, which is a type of non-volatile memory that can retain data even when power is removed. The memory size is 256Gb, with a 32G x 8 configuration, meaning it has 32Gb of memory per chip and a total of 8 chips. The clock frequency for this device is 167MHz, which determines how fast data can be read and written. The memory format is FLASH, which is a type of memory that can be erased and reprogrammed. Lastly, this device is ROHS3 compliant, meaning it meets the European Union's Restriction of Hazardous Substances directive.
MT29F256G08CECCBH6-6ITR:C TR Features
Package / Case: 152-VBGA
MT29F256G08CECCBH6-6ITR:C TR Applications
There are a lot of Micron Technology Inc.
MT29F256G08CECCBH6-6ITR:C TR Memory applications.
Cache memory
cell phones
eSRAM
mainframes
multimedia computers
networking
personal computers
servers
supercomputers
telecommunications
The mounting type of a device refers to how it is physically attached to a circuit board. In this case, the mounting type is surface mount, meaning the device is soldered directly onto the surface of the board. This type of mounting is commonly used in compact electronic devices. The operating temperature range for this device is -40°C to 85°C, making it suitable for use in a wide range of environments. It is packaged in tape and reel (TR) format, which is a standard method for shipping and handling electronic components. However, it is important to note that this particular device is now considered obsolete, meaning it is no longer being manufactured. The technology used in this device is FLASH - NAND, which is a type of non-volatile memory that can retain data even when power is removed. The memory size is 256Gb, with a 32G x 8 configuration, meaning it has 32Gb of memory per chip and a total of 8 chips. The clock frequency for this device is 167MHz, which determines how fast data can be read and written. The memory format is FLASH, which is a type of memory that can be erased and reprogrammed. Lastly, this device is ROHS3 compliant, meaning it meets the European Union's Restriction of Hazardous Substances directive.
MT29F256G08CECCBH6-6ITR:C TR Features
Package / Case: 152-VBGA
MT29F256G08CECCBH6-6ITR:C TR Applications
There are a lot of Micron Technology Inc.
MT29F256G08CECCBH6-6ITR:C TR Memory applications.
Cache memory
cell phones
eSRAM
mainframes
multimedia computers
networking
personal computers
servers
supercomputers
telecommunications
MT29F256G08CECCBH6-6ITR:C TR More Descriptions
IC FLASH 256G PARALLEL 167MHZ
LPDDR4 6G DIE 384MX16
LPDDR4 6G DIE 384MX16
The three parts on the right have similar specifications to MT29F256G08CECCBH6-6ITR:C TR.
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ImagePart NumberManufacturerMounting TypePackage / CaseOperating TemperaturePackagingPart StatusMoisture Sensitivity Level (MSL)TechnologyVoltage - SupplyMemory SizeMemory TypeClock FrequencyMemory FormatMemory InterfaceRoHS StatusSeriesFactory Lead TimeSurface MountNumber of TerminationsAdditional FeatureTerminal PositionPeak Reflow Temperature (Cel)Number of FunctionsSupply VoltageTerminal PitchReach Compliance CodeTime@Peak Reflow Temperature-Max (s)JESD-30 CodeSupply Voltage-Max (Vsup)Supply Voltage-Min (Vsup)Operating ModeOrganizationMemory WidthMemory DensityHeight Seated (Max)LengthWidthView Compare
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MT29F256G08CECCBH6-6ITR:C TRSurface Mount152-VBGA-40°C~85°C TATape & Reel (TR)Obsolete3 (168 Hours)FLASH - NAND2.7V~3.6V256Gb 32G x 8Non-Volatile167MHzFLASHParallelROHS3 Compliant-----------------------
-
Surface Mount162-VFBGA-40°C~105°C TATape & Reel (TR)Last Time Buy3 (168 Hours)FLASH - NAND, Mobile LPDRAM1.7V~1.9V4Gb 512M x 8 N 8Gb 512M x 16 LPDDR2Non-Volatile533MHzFLASH, RAMParallelROHS3 CompliantAutomotive, AEC-Q100---------------------
-
Surface Mount130-VFBGA-40°C~85°C TATrayActive-FLASH - NAND, Mobile LPDRAM1.7V~1.95V1Gb 128M x 8 N 512M 16M x 32 LPDRAMNon-Volatile200MHzFLASH, RAMParallelRoHS Compliant-16 WeeksYES130LPDRAM IS ORGANISED AS 32M X 16BOTTOMNOT SPECIFIED11.8V0.65mmcompliantNOT SPECIFIEDR-PBGA-B1301.95V1.7VSYNCHRONOUS128MX881073741824 bit1mm9mm8mm
-
Surface Mount162-VFBGA-40°C~85°C TATrayLast Time Buy3 (168 Hours)FLASH - NAND, Mobile LPDRAM1.7V~1.9V4Gb 512M x 8 N 2Gb 128M x 16 LPDDR2Non-Volatile533MHzFLASH, RAMParallel-----------------------
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