MT29F1G08ABAEAWP:E

Micron Technology Inc. MT29F1G08ABAEAWP:E

Part Number:
MT29F1G08ABAEAWP:E
Manufacturer:
Micron Technology Inc.
Ventron No:
3718232-MT29F1G08ABAEAWP:E
Description:
IC FLASH 1GBIT 20NS 48TSOP
ECAD Model:
Datasheet:
MT29F1G08ABAEAWP:E

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Specifications
Micron Technology Inc. MT29F1G08ABAEAWP:E technical specifications, attributes, parameters and parts with similar specifications to Micron Technology Inc. MT29F1G08ABAEAWP:E.
  • Factory Lead Time
    6 Weeks
  • Mount
    Surface Mount
  • Mounting Type
    Surface Mount
  • Package / Case
    48-TFSOP (0.724, 18.40mm Width)
  • Number of Pins
    48
  • Operating Temperature
    0°C~70°C TA
  • Packaging
    Tray
  • Published
    2013
  • JESD-609 Code
    e3
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    48
  • ECCN Code
    3A991.B.1.A
  • Terminal Finish
    MATTE TIN
  • HTS Code
    8542.32.00.51
  • Technology
    FLASH - NAND
  • Voltage - Supply
    2.7V~3.6V
  • Terminal Position
    DUAL
  • Peak Reflow Temperature (Cel)
    260
  • Number of Functions
    1
  • Supply Voltage
    3.3V
  • Terminal Pitch
    0.5mm
  • Reflow Temperature-Max (s)
    30
  • Base Part Number
    MT29F1G08
  • Operating Supply Voltage
    3.3V
  • Supply Voltage-Max (Vsup)
    3.6V
  • Supply Voltage-Min (Vsup)
    2.7V
  • Memory Size
    1Gb 128M x 8
  • Nominal Supply Current
    35mA
  • Memory Type
    Non-Volatile
  • Memory Format
    FLASH
  • Memory Interface
    Parallel
  • Organization
    128MX8
  • Memory Width
    8
  • Address Bus Width
    28b
  • Density
    1 Gb
  • Sync/Async
    Asynchronous
  • Word Size
    8b
  • Programming Voltage
    2.7V
  • Page Size
    2kB
  • Height Seated (Max)
    1.2mm
  • Length
    18.4mm
  • Radiation Hardening
    No
  • RoHS Status
    ROHS3 Compliant
Description
MT29F1G08ABAEAWP:E Overview
The number of terminations for this particular electronic component is 48, providing a sturdy and reliable connection for seamless integration into any circuit. The terminal finish is a matte tin, ensuring a smooth surface for efficient soldering during assembly. With an HTS code of 8542.32.00.51, this component falls under the category of "Electronic Integrated Circuits." Its peak reflow temperature is 260 degrees Celsius, allowing for safe and effective soldering without causing damage to the component. Additionally, this component has a maximum reflow temperature of 30 seconds and a supply voltage of 3.6V. Its memory size is 1Gb 128M x 8, and its organization is 128MX8, providing ample storage capacity for various data and functions. Finally, with a maximum seated height of only 1.2mm, this component is compact and space-saving.

MT29F1G08ABAEAWP:E Features
Package / Case: 48-TFSOP (0.724, 18.40mm Width)
48 Pins
Operating Supply Voltage:3.3V

MT29F1G08ABAEAWP:E Applications
There are a lot of Micron Technology Inc. MT29F1G08ABAEAWP:E Memory applications.

embedded logic
servers
personal digital assistants
Camcorders
mainframes
printers
nonvolatile BIOS memory
supercomputers
graphics card
main computer memory
MT29F1G08ABAEAWP:E More Descriptions
SLC NAND Flash Parallel 3.3V 1G-bit 128M x 8 48-Pin TSOP-I / IC FLASH 1GBIT 20NS 48TSOP
M68M 128MX8 NAND FLASH PLASTIC TSOP 3.3V ASYNCH/PAGE READ MASS STORAGE
Flash Memory, 1Gbit, 0 To 70Deg C; Flash Memory Type:Slc Nand; Memory Configuration:128M X 8Bit; Interfaces:Parallel; Ic Case/Package:Tsop-I; No. Of Pins:48Pins; Clock Frequency Max:50Mhz; Access Time:16Ns; Supply Voltage Min:2.7V Rohs Compliant: Yes |Micron MT29F1G08ABAEAWP:E
Product Comparison
The three parts on the right have similar specifications to MT29F1G08ABAEAWP:E.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Mount
    Mounting Type
    Package / Case
    Number of Pins
    Operating Temperature
    Packaging
    Published
    JESD-609 Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    ECCN Code
    Terminal Finish
    HTS Code
    Technology
    Voltage - Supply
    Terminal Position
    Peak Reflow Temperature (Cel)
    Number of Functions
    Supply Voltage
    Terminal Pitch
    Reflow Temperature-Max (s)
    Base Part Number
    Operating Supply Voltage
    Supply Voltage-Max (Vsup)
    Supply Voltage-Min (Vsup)
    Memory Size
    Nominal Supply Current
    Memory Type
    Memory Format
    Memory Interface
    Organization
    Memory Width
    Address Bus Width
    Density
    Sync/Async
    Word Size
    Programming Voltage
    Page Size
    Height Seated (Max)
    Length
    Radiation Hardening
    RoHS Status
    Series
    Clock Frequency
    Surface Mount
    Additional Feature
    Reach Compliance Code
    Time@Peak Reflow Temperature-Max (s)
    JESD-30 Code
    Operating Mode
    Memory Density
    Width
    View Compare
  • MT29F1G08ABAEAWP:E
    MT29F1G08ABAEAWP:E
    6 Weeks
    Surface Mount
    Surface Mount
    48-TFSOP (0.724, 18.40mm Width)
    48
    0°C~70°C TA
    Tray
    2013
    e3
    Active
    3 (168 Hours)
    48
    3A991.B.1.A
    MATTE TIN
    8542.32.00.51
    FLASH - NAND
    2.7V~3.6V
    DUAL
    260
    1
    3.3V
    0.5mm
    30
    MT29F1G08
    3.3V
    3.6V
    2.7V
    1Gb 128M x 8
    35mA
    Non-Volatile
    FLASH
    Parallel
    128MX8
    8
    28b
    1 Gb
    Asynchronous
    8b
    2.7V
    2kB
    1.2mm
    18.4mm
    No
    ROHS3 Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • MT29AZ5A3CHHWD-18AAT.84F TR
    -
    -
    Surface Mount
    162-VFBGA
    -
    -40°C~105°C TA
    Tape & Reel (TR)
    -
    -
    Last Time Buy
    3 (168 Hours)
    -
    -
    -
    -
    FLASH - NAND, Mobile LPDRAM
    1.7V~1.9V
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    4Gb 512M x 8 N 8Gb 512M x 16 LPDDR2
    -
    Non-Volatile
    FLASH, RAM
    Parallel
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    ROHS3 Compliant
    Automotive, AEC-Q100
    533MHz
    -
    -
    -
    -
    -
    -
    -
    -
  • MT29C1G12MAAIYAMR-5 AIT
    16 Weeks
    -
    Surface Mount
    130-VFBGA
    -
    -40°C~85°C TA
    Tray
    -
    -
    Active
    -
    130
    -
    -
    -
    FLASH - NAND, Mobile LPDRAM
    1.7V~1.95V
    BOTTOM
    NOT SPECIFIED
    1
    1.8V
    0.65mm
    -
    -
    -
    1.95V
    1.7V
    1Gb 128M x 8 N 512M 16M x 32 LPDRAM
    -
    Non-Volatile
    FLASH, RAM
    Parallel
    128MX8
    8
    -
    -
    -
    -
    -
    -
    1mm
    9mm
    -
    RoHS Compliant
    -
    200MHz
    YES
    LPDRAM IS ORGANISED AS 32M X 16
    compliant
    NOT SPECIFIED
    R-PBGA-B130
    SYNCHRONOUS
    1073741824 bit
    8mm
  • MT29AZ5A3CHHWD-18AIT.84F
    -
    -
    Surface Mount
    162-VFBGA
    -
    -40°C~85°C TA
    Tray
    -
    -
    Last Time Buy
    3 (168 Hours)
    -
    -
    -
    -
    FLASH - NAND, Mobile LPDRAM
    1.7V~1.9V
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    4Gb 512M x 8 N 2Gb 128M x 16 LPDDR2
    -
    Non-Volatile
    FLASH, RAM
    Parallel
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    533MHz
    -
    -
    -
    -
    -
    -
    -
    -
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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