Micron Technology Inc. MT29F1G08ABAEAWP:E
- Part Number:
- MT29F1G08ABAEAWP:E
- Manufacturer:
- Micron Technology Inc.
- Ventron No:
- 3718232-MT29F1G08ABAEAWP:E
- Description:
- IC FLASH 1GBIT 20NS 48TSOP
- Datasheet:
- MT29F1G08ABAEAWP:E
Micron Technology Inc. MT29F1G08ABAEAWP:E technical specifications, attributes, parameters and parts with similar specifications to Micron Technology Inc. MT29F1G08ABAEAWP:E.
- Factory Lead Time6 Weeks
- MountSurface Mount
- Mounting TypeSurface Mount
- Package / Case48-TFSOP (0.724, 18.40mm Width)
- Number of Pins48
- Operating Temperature0°C~70°C TA
- PackagingTray
- Published2013
- JESD-609 Codee3
- Part StatusActive
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of Terminations48
- ECCN Code3A991.B.1.A
- Terminal FinishMATTE TIN
- HTS Code8542.32.00.51
- TechnologyFLASH - NAND
- Voltage - Supply2.7V~3.6V
- Terminal PositionDUAL
- Peak Reflow Temperature (Cel)260
- Number of Functions1
- Supply Voltage3.3V
- Terminal Pitch0.5mm
- Reflow Temperature-Max (s)30
- Base Part NumberMT29F1G08
- Operating Supply Voltage3.3V
- Supply Voltage-Max (Vsup)3.6V
- Supply Voltage-Min (Vsup)2.7V
- Memory Size1Gb 128M x 8
- Nominal Supply Current35mA
- Memory TypeNon-Volatile
- Memory FormatFLASH
- Memory InterfaceParallel
- Organization128MX8
- Memory Width8
- Address Bus Width28b
- Density1 Gb
- Sync/AsyncAsynchronous
- Word Size8b
- Programming Voltage2.7V
- Page Size2kB
- Height Seated (Max)1.2mm
- Length18.4mm
- Radiation HardeningNo
- RoHS StatusROHS3 Compliant
MT29F1G08ABAEAWP:E Overview
The number of terminations for this particular electronic component is 48, providing a sturdy and reliable connection for seamless integration into any circuit. The terminal finish is a matte tin, ensuring a smooth surface for efficient soldering during assembly. With an HTS code of 8542.32.00.51, this component falls under the category of "Electronic Integrated Circuits." Its peak reflow temperature is 260 degrees Celsius, allowing for safe and effective soldering without causing damage to the component. Additionally, this component has a maximum reflow temperature of 30 seconds and a supply voltage of 3.6V. Its memory size is 1Gb 128M x 8, and its organization is 128MX8, providing ample storage capacity for various data and functions. Finally, with a maximum seated height of only 1.2mm, this component is compact and space-saving.
MT29F1G08ABAEAWP:E Features
Package / Case: 48-TFSOP (0.724, 18.40mm Width)
48 Pins
Operating Supply Voltage:3.3V
MT29F1G08ABAEAWP:E Applications
There are a lot of Micron Technology Inc. MT29F1G08ABAEAWP:E Memory applications.
embedded logic
servers
personal digital assistants
Camcorders
mainframes
printers
nonvolatile BIOS memory
supercomputers
graphics card
main computer memory
The number of terminations for this particular electronic component is 48, providing a sturdy and reliable connection for seamless integration into any circuit. The terminal finish is a matte tin, ensuring a smooth surface for efficient soldering during assembly. With an HTS code of 8542.32.00.51, this component falls under the category of "Electronic Integrated Circuits." Its peak reflow temperature is 260 degrees Celsius, allowing for safe and effective soldering without causing damage to the component. Additionally, this component has a maximum reflow temperature of 30 seconds and a supply voltage of 3.6V. Its memory size is 1Gb 128M x 8, and its organization is 128MX8, providing ample storage capacity for various data and functions. Finally, with a maximum seated height of only 1.2mm, this component is compact and space-saving.
MT29F1G08ABAEAWP:E Features
Package / Case: 48-TFSOP (0.724, 18.40mm Width)
48 Pins
Operating Supply Voltage:3.3V
MT29F1G08ABAEAWP:E Applications
There are a lot of Micron Technology Inc. MT29F1G08ABAEAWP:E Memory applications.
embedded logic
servers
personal digital assistants
Camcorders
mainframes
printers
nonvolatile BIOS memory
supercomputers
graphics card
main computer memory
MT29F1G08ABAEAWP:E More Descriptions
SLC NAND Flash Parallel 3.3V 1G-bit 128M x 8 48-Pin TSOP-I / IC FLASH 1GBIT 20NS 48TSOP
M68M 128MX8 NAND FLASH PLASTIC TSOP 3.3V ASYNCH/PAGE READ MASS STORAGE
Flash Memory, 1Gbit, 0 To 70Deg C; Flash Memory Type:Slc Nand; Memory Configuration:128M X 8Bit; Interfaces:Parallel; Ic Case/Package:Tsop-I; No. Of Pins:48Pins; Clock Frequency Max:50Mhz; Access Time:16Ns; Supply Voltage Min:2.7V Rohs Compliant: Yes |Micron MT29F1G08ABAEAWP:E
M68M 128MX8 NAND FLASH PLASTIC TSOP 3.3V ASYNCH/PAGE READ MASS STORAGE
Flash Memory, 1Gbit, 0 To 70Deg C; Flash Memory Type:Slc Nand; Memory Configuration:128M X 8Bit; Interfaces:Parallel; Ic Case/Package:Tsop-I; No. Of Pins:48Pins; Clock Frequency Max:50Mhz; Access Time:16Ns; Supply Voltage Min:2.7V Rohs Compliant: Yes |Micron MT29F1G08ABAEAWP:E
The three parts on the right have similar specifications to MT29F1G08ABAEAWP:E.
-
ImagePart NumberManufacturerFactory Lead TimeMountMounting TypePackage / CaseNumber of PinsOperating TemperaturePackagingPublishedJESD-609 CodePart StatusMoisture Sensitivity Level (MSL)Number of TerminationsECCN CodeTerminal FinishHTS CodeTechnologyVoltage - SupplyTerminal PositionPeak Reflow Temperature (Cel)Number of FunctionsSupply VoltageTerminal PitchReflow Temperature-Max (s)Base Part NumberOperating Supply VoltageSupply Voltage-Max (Vsup)Supply Voltage-Min (Vsup)Memory SizeNominal Supply CurrentMemory TypeMemory FormatMemory InterfaceOrganizationMemory WidthAddress Bus WidthDensitySync/AsyncWord SizeProgramming VoltagePage SizeHeight Seated (Max)LengthRadiation HardeningRoHS StatusSeriesClock FrequencySurface MountAdditional FeatureReach Compliance CodeTime@Peak Reflow Temperature-Max (s)JESD-30 CodeOperating ModeMemory DensityWidthView Compare
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MT29F1G08ABAEAWP:E6 WeeksSurface MountSurface Mount48-TFSOP (0.724, 18.40mm Width)480°C~70°C TATray2013e3Active3 (168 Hours)483A991.B.1.AMATTE TIN8542.32.00.51FLASH - NAND2.7V~3.6VDUAL26013.3V0.5mm30MT29F1G083.3V3.6V2.7V1Gb 128M x 835mANon-VolatileFLASHParallel128MX8828b1 GbAsynchronous8b2.7V2kB1.2mm18.4mmNoROHS3 Compliant-----------
-
--Surface Mount162-VFBGA--40°C~105°C TATape & Reel (TR)--Last Time Buy3 (168 Hours)----FLASH - NAND, Mobile LPDRAM1.7V~1.9V----------4Gb 512M x 8 N 8Gb 512M x 16 LPDDR2-Non-VolatileFLASH, RAMParallel-----------ROHS3 CompliantAutomotive, AEC-Q100533MHz--------
-
16 Weeks-Surface Mount130-VFBGA--40°C~85°C TATray--Active-130---FLASH - NAND, Mobile LPDRAM1.7V~1.95VBOTTOMNOT SPECIFIED11.8V0.65mm---1.95V1.7V1Gb 128M x 8 N 512M 16M x 32 LPDRAM-Non-VolatileFLASH, RAMParallel128MX88------1mm9mm-RoHS Compliant-200MHzYESLPDRAM IS ORGANISED AS 32M X 16compliantNOT SPECIFIEDR-PBGA-B130SYNCHRONOUS1073741824 bit8mm
-
--Surface Mount162-VFBGA--40°C~85°C TATray--Last Time Buy3 (168 Hours)----FLASH - NAND, Mobile LPDRAM1.7V~1.9V----------4Gb 512M x 8 N 2Gb 128M x 16 LPDDR2-Non-VolatileFLASH, RAMParallel-------------533MHz--------
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