Micron Technology Inc. MT29E1T08CMHBBJ4-3:B TR
- Part Number:
- MT29E1T08CMHBBJ4-3:B TR
- Manufacturer:
- Micron Technology Inc.
- Ventron No:
- 3237074-MT29E1T08CMHBBJ4-3:B TR
- Description:
- IC FLASH 1TBIT 333MHZ 132VBGA
- ECAD Model:
-
- Datasheet:
- MT29E1T08CMHBBJ4-3:B TR
Micron Technology Inc. MT29E1T08CMHBBJ4-3:B TR technical specifications, attributes, parameters and parts with similar specifications to Micron Technology Inc. MT29E1T08CMHBBJ4-3:B TR.
- Mounting TypeSurface Mount
- Package / Case132-VBGA
- Operating Temperature0°C~70°C TA
- PackagingTape & Reel (TR)
- Part StatusNot For New Designs
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- TechnologyFLASH - NAND
- Voltage - Supply2.5V~3.6V
- Memory Size1Tb 128G x 8
- Memory TypeNon-Volatile
- Clock Frequency333MHz
- Memory FormatFLASH
- Memory InterfaceParallel
- RoHS StatusROHS3 Compliant
MT29E1T08CMHBBJ4-3:B TR Overview
The mounting type for this particular electronic component is surface mount, meaning it is designed to be mounted directly onto a circuit board. The package or case for this component is a 132-VBGA, indicating its size and shape. It is capable of operating within a temperature range of 0°C to 70°C, as denoted by the TA designation. However, it should be noted that this part is not recommended for new designs. The technology used in this component is FLASH - NAND, which refers to the type of memory it utilizes. It requires a voltage supply of 2.5V to 3.6V to function properly. This is a non-volatile memory type, meaning it retains data even when the power is turned off. The clock frequency for this component is 333MHz, and it utilizes a parallel memory interface. Additionally, it is compliant with the ROHS3 standard for environmental safety.
MT29E1T08CMHBBJ4-3:B TR Features
Package / Case: 132-VBGA
MT29E1T08CMHBBJ4-3:B TR Applications
There are a lot of Micron Technology Inc.
MT29E1T08CMHBBJ4-3:B TR Memory applications.
cell phones
eSRAM
mainframes
multimedia computers
networking
personal computers
servers
supercomputers
telecommunications
workstations,
The mounting type for this particular electronic component is surface mount, meaning it is designed to be mounted directly onto a circuit board. The package or case for this component is a 132-VBGA, indicating its size and shape. It is capable of operating within a temperature range of 0°C to 70°C, as denoted by the TA designation. However, it should be noted that this part is not recommended for new designs. The technology used in this component is FLASH - NAND, which refers to the type of memory it utilizes. It requires a voltage supply of 2.5V to 3.6V to function properly. This is a non-volatile memory type, meaning it retains data even when the power is turned off. The clock frequency for this component is 333MHz, and it utilizes a parallel memory interface. Additionally, it is compliant with the ROHS3 standard for environmental safety.
MT29E1T08CMHBBJ4-3:B TR Features
Package / Case: 132-VBGA
MT29E1T08CMHBBJ4-3:B TR Applications
There are a lot of Micron Technology Inc.
MT29E1T08CMHBBJ4-3:B TR Memory applications.
cell phones
eSRAM
mainframes
multimedia computers
networking
personal computers
servers
supercomputers
telecommunications
workstations,
MT29E1T08CMHBBJ4-3:B TR More Descriptions
DRAM Chip DDR3 SDRAM 4Gbit 256Mx16 1.5V 96-Pin FBGA
IC FLASH 1TBIT PARALLEL 132VBGA
IC FLASH 1T PARALLEL 333MHZ
IC FLASH 1TBIT PARALLEL 132VBGA
IC FLASH 1T PARALLEL 333MHZ
The three parts on the right have similar specifications to MT29E1T08CMHBBJ4-3:B TR.
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ImagePart NumberManufacturerMounting TypePackage / CaseOperating TemperaturePackagingPart StatusMoisture Sensitivity Level (MSL)TechnologyVoltage - SupplyMemory SizeMemory TypeClock FrequencyMemory FormatMemory InterfaceRoHS StatusSeriesFactory Lead TimeSurface MountNumber of TerminationsAdditional FeatureTerminal PositionPeak Reflow Temperature (Cel)Number of FunctionsSupply VoltageTerminal PitchReach Compliance CodeTime@Peak Reflow Temperature-Max (s)JESD-30 CodeSupply Voltage-Max (Vsup)Supply Voltage-Min (Vsup)Operating ModeOrganizationMemory WidthMemory DensityHeight Seated (Max)LengthWidthView Compare
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MT29E1T08CMHBBJ4-3:B TRSurface Mount132-VBGA0°C~70°C TATape & Reel (TR)Not For New Designs3 (168 Hours)FLASH - NAND2.5V~3.6V1Tb 128G x 8Non-Volatile333MHzFLASHParallelROHS3 Compliant----------------------- -
Surface Mount162-VFBGA-40°C~105°C TATape & Reel (TR)Last Time Buy3 (168 Hours)FLASH - NAND, Mobile LPDRAM1.7V~1.9V4Gb 512M x 8 N 8Gb 512M x 16 LPDDR2Non-Volatile533MHzFLASH, RAMParallelROHS3 CompliantAutomotive, AEC-Q100---------------------
-
Surface Mount130-VFBGA-40°C~85°C TATrayActive-FLASH - NAND, Mobile LPDRAM1.7V~1.95V1Gb 128M x 8 N 512M 16M x 32 LPDRAMNon-Volatile200MHzFLASH, RAMParallelRoHS Compliant-16 WeeksYES130LPDRAM IS ORGANISED AS 32M X 16BOTTOMNOT SPECIFIED11.8V0.65mmcompliantNOT SPECIFIEDR-PBGA-B1301.95V1.7VSYNCHRONOUS128MX881073741824 bit1mm9mm8mm
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Surface Mount162-VFBGA-40°C~85°C TATrayLast Time Buy3 (168 Hours)FLASH - NAND, Mobile LPDRAM1.7V~1.9V4Gb 512M x 8 N 2Gb 128M x 16 LPDDR2Non-Volatile533MHzFLASH, RAMParallel-----------------------
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Automotive, AEC-Q100 Memory IC Automotive, AEC-Q100 Series
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Automotive, AEC-Q100 Memory IC Automotive, AEC-Q100 Series
-
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