MSC8251SAG1000B

NXP USA Inc. MSC8251SAG1000B

Part Number:
MSC8251SAG1000B
Manufacturer:
NXP USA Inc.
Ventron No:
3124627-MSC8251SAG1000B
Description:
IC DSP 1X 1GHZ SC3850 783FCBGA
ECAD Model:
Datasheet:
MSC8251SAG1000B

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Specifications
NXP USA Inc. MSC8251SAG1000B technical specifications, attributes, parameters and parts with similar specifications to NXP USA Inc. MSC8251SAG1000B.
  • Mounting Type
    Surface Mount
  • Package / Case
    783-BBGA, FCBGA
  • Surface Mount
    YES
  • Operating Temperature
    0°C~105°C TJ
  • Packaging
    Tray
  • Published
    2008
  • Series
    StarCore
  • JESD-609 Code
    e1
  • Part Status
    Obsolete
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    783
  • ECCN Code
    3A991.A.1
  • Terminal Finish
    TIN SILVER COPPER
  • HTS Code
    8542.31.00.01
  • Subcategory
    Digital Signal Processors
  • Technology
    CMOS
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    245
  • Supply Voltage
    1V
  • Terminal Pitch
    1mm
  • Reflow Temperature-Max (s)
    30
  • JESD-30 Code
    S-PBGA-B783
  • Qualification Status
    Not Qualified
  • Supply Voltage-Max (Vsup)
    1.05V
  • Power Supplies
    11.5/1.82.5V
  • Supply Voltage-Min (Vsup)
    0.97V
  • Interface
    Ethernet, I2C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART
  • Bit Size
    32
  • Boundary Scan
    YES
  • Low Power Mode
    YES
  • Format
    FIXED POINT
  • RAM (words)
    8192
  • Voltage - I/O
    2.50V
  • Barrel Shifter
    NO
  • Non-Volatile Memory
    ROM (96kB)
  • Voltage - Core
    1.00V
  • On Chip Data RAM
    576kB
  • Clock Rate
    1GHz
  • Height Seated (Max)
    3.94mm
  • Length
    29mm
  • Width
    29mm
  • RoHS Status
    ROHS3 Compliant
Description
MSC8251SAG1000B Overview
This particular component is manufactured by NXP USA Inc. and falls under the category of Embedded - DSP (Digital Signal Processors). It is a chip designed for digital signal processing and is suitable for embedded systems. The chip is surface mounted and has a terminal finish of TIN SILVER COPPER. The terminal position is located at the bottom of the chip and has a pitch of 1mm. The maximum supply voltage for this chip is 1.05V and it requires power supplies of 11.5/1.82.5V. The chip is equipped with various interfaces such as Ethernet, I2C, PCI, RGMII, Serial RapidIO, SGMII, SPI, and UART/USART. It operates at a voltage of 2.50V for its input/output and has a clock rate of 1GHz. This component is also compliant with the Restriction of Hazardous Substances Directive (RoHS) and is considered to be environmentally friendly.

MSC8251SAG1000B Features
Supplied in the 783-BBGA, FCBGA package

MSC8251SAG1000B Applications
There are a lot of NXP USA Inc. MSC8251SAG1000B DSP applications.

Seismology
Medical imaging
Statistical signal processing
Geophysical processing
Receivers
Machinery and equipment
3D tomography and imaging processing
Processing system
Audio compression
Image signal processing
MSC8251SAG1000B More Descriptions
StarCore DSP, 1x 1GHz SC3850 cores, DDR2/3, SRIO, PCIe, QE, GbE, 0-105C
IC DSP 1X 1GHZ SC3850 783FCBGA
LED Lighting Drivers DUAL AMOLED DRV SPLY
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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