NXP USA Inc. MSC8251SAG1000B
- Part Number:
- MSC8251SAG1000B
- Manufacturer:
- NXP USA Inc.
- Ventron No:
- 3124627-MSC8251SAG1000B
- Description:
- IC DSP 1X 1GHZ SC3850 783FCBGA
- Datasheet:
- MSC8251SAG1000B
NXP USA Inc. MSC8251SAG1000B technical specifications, attributes, parameters and parts with similar specifications to NXP USA Inc. MSC8251SAG1000B.
- Mounting TypeSurface Mount
- Package / Case783-BBGA, FCBGA
- Surface MountYES
- Operating Temperature0°C~105°C TJ
- PackagingTray
- Published2008
- SeriesStarCore
- JESD-609 Codee1
- Part StatusObsolete
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of Terminations783
- ECCN Code3A991.A.1
- Terminal FinishTIN SILVER COPPER
- HTS Code8542.31.00.01
- SubcategoryDigital Signal Processors
- TechnologyCMOS
- Terminal PositionBOTTOM
- Terminal FormBALL
- Peak Reflow Temperature (Cel)245
- Supply Voltage1V
- Terminal Pitch1mm
- Reflow Temperature-Max (s)30
- JESD-30 CodeS-PBGA-B783
- Qualification StatusNot Qualified
- Supply Voltage-Max (Vsup)1.05V
- Power Supplies11.5/1.82.5V
- Supply Voltage-Min (Vsup)0.97V
- InterfaceEthernet, I2C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART
- Bit Size32
- Boundary ScanYES
- Low Power ModeYES
- FormatFIXED POINT
- RAM (words)8192
- Voltage - I/O2.50V
- Barrel ShifterNO
- Non-Volatile MemoryROM (96kB)
- Voltage - Core1.00V
- On Chip Data RAM576kB
- Clock Rate1GHz
- Height Seated (Max)3.94mm
- Length29mm
- Width29mm
- RoHS StatusROHS3 Compliant
MSC8251SAG1000B Overview
This particular component is manufactured by NXP USA Inc. and falls under the category of Embedded - DSP (Digital Signal Processors). It is a chip designed for digital signal processing and is suitable for embedded systems. The chip is surface mounted and has a terminal finish of TIN SILVER COPPER. The terminal position is located at the bottom of the chip and has a pitch of 1mm. The maximum supply voltage for this chip is 1.05V and it requires power supplies of 11.5/1.82.5V. The chip is equipped with various interfaces such as Ethernet, I2C, PCI, RGMII, Serial RapidIO, SGMII, SPI, and UART/USART. It operates at a voltage of 2.50V for its input/output and has a clock rate of 1GHz. This component is also compliant with the Restriction of Hazardous Substances Directive (RoHS) and is considered to be environmentally friendly.
MSC8251SAG1000B Features
Supplied in the 783-BBGA, FCBGA package
MSC8251SAG1000B Applications
There are a lot of NXP USA Inc. MSC8251SAG1000B DSP applications.
Seismology
Medical imaging
Statistical signal processing
Geophysical processing
Receivers
Machinery and equipment
3D tomography and imaging processing
Processing system
Audio compression
Image signal processing
This particular component is manufactured by NXP USA Inc. and falls under the category of Embedded - DSP (Digital Signal Processors). It is a chip designed for digital signal processing and is suitable for embedded systems. The chip is surface mounted and has a terminal finish of TIN SILVER COPPER. The terminal position is located at the bottom of the chip and has a pitch of 1mm. The maximum supply voltage for this chip is 1.05V and it requires power supplies of 11.5/1.82.5V. The chip is equipped with various interfaces such as Ethernet, I2C, PCI, RGMII, Serial RapidIO, SGMII, SPI, and UART/USART. It operates at a voltage of 2.50V for its input/output and has a clock rate of 1GHz. This component is also compliant with the Restriction of Hazardous Substances Directive (RoHS) and is considered to be environmentally friendly.
MSC8251SAG1000B Features
Supplied in the 783-BBGA, FCBGA package
MSC8251SAG1000B Applications
There are a lot of NXP USA Inc. MSC8251SAG1000B DSP applications.
Seismology
Medical imaging
Statistical signal processing
Geophysical processing
Receivers
Machinery and equipment
3D tomography and imaging processing
Processing system
Audio compression
Image signal processing
MSC8251SAG1000B More Descriptions
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