Everspin Technologies Inc. MR25H10MDC
- Part Number:
- MR25H10MDC
- Manufacturer:
- Everspin Technologies Inc.
- Ventron No:
- 3228725-MR25H10MDC
- Description:
- IC MRAM 1MBIT 40MHZ 8DFN
- Datasheet:
- MR25H10MDC
Everspin Technologies Inc. MR25H10MDC technical specifications, attributes, parameters and parts with similar specifications to Everspin Technologies Inc. MR25H10MDC.
- Factory Lead Time14 Weeks
- MountSurface Mount
- Mounting TypeSurface Mount
- Package / Case8-TDFN Exposed Pad
- Number of Pins8
- Operating Temperature-40°C~125°C TA
- PackagingTray
- Published2013
- SeriesAutomotive, AEC-Q100
- Part StatusNot For New Designs
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of Terminations8
- ECCN CodeEAR99
- TechnologyMRAM (Magnetoresistive RAM)
- Voltage - Supply2.7V~3.6V
- Terminal PositionDUAL
- Number of Functions1
- Supply Voltage3V
- Terminal Pitch1.27mm
- Pin Count8
- Operating Supply Voltage3.3V
- Voltage3V
- InterfaceSPI, Serial
- Memory Size1Mb 128K x 8
- Nominal Supply Current27mA
- Memory TypeNon-Volatile
- Clock Frequency40MHz
- Access Time10 ns
- Memory FormatRAM
- Memory InterfaceSPI
- Memory Width8
- Density1 Mb
- Standby Current-Max0.000115A
- Word Size8b
- Height Seated (Max)1mm
- Length6mm
- Width5mm
- Radiation HardeningNo
- RoHS StatusROHS3 Compliant
- Lead FreeLead Free
MR25H10MDC Overview
The mount for this device is a surface mount, making it easy to install and secure onto any surface. It is specifically designed for use in automotive applications, meeting the stringent requirements of AEC-Q100 standards. The operating supply voltage for this device is 3.3V, ensuring efficient and reliable performance. The memory interface is SPI, allowing for fast and efficient data transfer. The standby current for this device is incredibly low, at only 0.000115A, making it energy efficient. With a word size of 8b and a width of 5mm, this device is compact and versatile. It does not have radiation hardening, but it is still a reliable and durable option. Additionally, it is ROHS3 compliant, meeting environmental standards for electronic components.
MR25H10MDC Features
Package / Case: 8-TDFN Exposed Pad
8 Pins
Operating Supply Voltage:3.3V
MR25H10MDC Applications
There are a lot of Everspin Technologies Inc.
MR25H10MDC Memory applications.
networking
personal computers
servers
supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
Camcorders
The mount for this device is a surface mount, making it easy to install and secure onto any surface. It is specifically designed for use in automotive applications, meeting the stringent requirements of AEC-Q100 standards. The operating supply voltage for this device is 3.3V, ensuring efficient and reliable performance. The memory interface is SPI, allowing for fast and efficient data transfer. The standby current for this device is incredibly low, at only 0.000115A, making it energy efficient. With a word size of 8b and a width of 5mm, this device is compact and versatile. It does not have radiation hardening, but it is still a reliable and durable option. Additionally, it is ROHS3 compliant, meeting environmental standards for electronic components.
MR25H10MDC Features
Package / Case: 8-TDFN Exposed Pad
8 Pins
Operating Supply Voltage:3.3V
MR25H10MDC Applications
There are a lot of Everspin Technologies Inc.
MR25H10MDC Memory applications.
networking
personal computers
servers
supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
Camcorders
MR25H10MDC More Descriptions
EAR99 Surface Mount Tray MRAM (Magnetoresistive RAM) ic memory 40MHz 10ns 5mm 27mA
MR25 Series 1 Mb (128K X 8) 40 MHz 3.3 V Serial SPI MRAM - DFN-8
MRAM 1Mbit Serial-SPI Interface 3.3V Automotive 8-Pin DFN EP Tray
Surface Mount Automotive, AEC-Q100 8 Pin Memory IC Automotive, AEC-Q100 Series 1 Mb kb 6mm mm 27mA mA 8b b
NVRAM 1Mb 3V 128Kx8 Serial MRAM
MR25 Series 1 Mb (128K X 8) 40 MHz 3.3 V Serial SPI MRAM - DFN-8
MRAM 1Mbit Serial-SPI Interface 3.3V Automotive 8-Pin DFN EP Tray
Surface Mount Automotive, AEC-Q100 8 Pin Memory IC Automotive, AEC-Q100 Series 1 Mb kb 6mm mm 27mA mA 8b b
NVRAM 1Mb 3V 128Kx8 Serial MRAM
The three parts on the right have similar specifications to MR25H10MDC.
-
ImagePart NumberManufacturerFactory Lead TimeMountMounting TypePackage / CaseNumber of PinsOperating TemperaturePackagingPublishedSeriesPart StatusMoisture Sensitivity Level (MSL)Number of TerminationsECCN CodeTechnologyVoltage - SupplyTerminal PositionNumber of FunctionsSupply VoltageTerminal PitchPin CountOperating Supply VoltageVoltageInterfaceMemory SizeNominal Supply CurrentMemory TypeClock FrequencyAccess TimeMemory FormatMemory InterfaceMemory WidthDensityStandby Current-MaxWord SizeHeight Seated (Max)LengthWidthRadiation HardeningRoHS StatusLead FreePeak Reflow Temperature (Cel)Time@Peak Reflow Temperature-Max (s)Qualification StatusSupply Voltage-Max (Vsup)Supply Voltage-Min (Vsup)Operating ModeHTS CodeOperating Supply CurrentData Bus WidthOrganizationWrite Cycle Time - Word, PageAccess Time (Max)View Compare
-
MR25H10MDC14 WeeksSurface MountSurface Mount8-TDFN Exposed Pad8-40°C~125°C TATray2013Automotive, AEC-Q100Not For New Designs3 (168 Hours)8EAR99MRAM (Magnetoresistive RAM)2.7V~3.6VDUAL13V1.27mm83.3V3VSPI, Serial1Mb 128K x 827mANon-Volatile40MHz10 nsRAMSPI81 Mb0.000115A8b1mm6mm5mmNoROHS3 CompliantLead Free-------------
-
14 WeeksSurface MountSurface Mount8-VDFN Exposed Pad8-40°C~85°C TATape & Reel (TR)2014-Not For New Designs3 (168 Hours)8EAR99MRAM (Magnetoresistive RAM)3V~3.6VDUAL13.3V1.27mm83.3V-SPI, Serial4Mb 512K x 842mANon-Volatile40MHz9 nsRAMSPI84 Mb-8b1.05mm6mm5mm-ROHS3 Compliant-NOT SPECIFIEDNOT SPECIFIEDNot Qualified3.6V3VSYNCHRONOUS------
-
12 WeeksSurface MountSurface Mount44-TSOP (0.400, 10.16mm Width)44-40°C~85°C TATray2011-Active3 (168 Hours)44EAR99MRAM (Magnetoresistive RAM)3V~3.6VDUAL13.3V0.8mm443.3V--256Kb 32K x 875mANon-Volatile--RAMParallel8256 kb0.007A8b1.2mm18.41mm--ROHS3 CompliantLead FreeNOT SPECIFIEDNOT SPECIFIEDNot Qualified3.6V3VASYNCHRONOUS8542.32.00.7165mA8b32KX835ns35 ns
-
14 WeeksSurface MountSurface Mount8-TDFN Exposed Pad8-40°C~125°C TATape & Reel (TR)2010Automotive, AEC-Q100Not For New Designs3 (168 Hours)8EAR99MRAM (Magnetoresistive RAM)2.7V~3.6VDUAL13.3V1.27mm83.3V-SPI, Serial256Kb 32K x 827mANon-Volatile40MHz10 nsRAMSPI8256 kb0.00001A8b1.05mm6mm5mm-ROHS3 CompliantLead FreeNOT SPECIFIEDNOT SPECIFIEDNot Qualified3.6V3VSYNCHRONOUS------
Popular Search Part Number
Related Keywords
Search Tags
Latest News
-
23 January 2024
Get to Know the TDA2822M Audio Amplifier
Ⅰ. What is TDA2822M?Ⅱ. What are the features of TDA2822M?Ⅲ. Specifications of TDA2822MⅣ. Structure and working principle of TDA2822MⅤ. TDA2822M schematic diagramⅥ. What are the applications of TDA2822M?Ⅶ.... -
24 January 2024
ESP8266 Characteristics, Structure, Application Fields and Other Details
Ⅰ. What is ESP8266?Ⅱ. Characteristics of ESP8266 moduleⅢ. Hardware interface of ESP8266Ⅳ. Development method of ESP8266Ⅴ. Structure of ESP8266Ⅵ. What are the working modes of ESP8266?Ⅶ. What are... -
24 January 2024
ULN2803A Darlington Transistor Specifications, Characteristics, Working Principle and More
Ⅰ. Overview of ULN2803AⅡ. Specifications of ULN2803AⅢ. Characteristics of ULN2803AⅣ. Schematic diagram of ULN2803AⅤ. How does ULN2803A work?Ⅵ. Where is ULN2803A used?Ⅶ. Application circuit of ULN2803AⅧ. How to... -
25 January 2024
XC6206P332MR Voltage Regulator Manufacturer, Working principle, Characteristics and More
Ⅰ. Description of XC6206P332MRⅡ. Manufacturer of XC6206P332MRⅢ. Technical parameters of XC6206P332MRⅣ. Working principle of XC6206P332MRⅤ. Block diagram of XC6206P332MRⅥ. Characteristics of XC6206P332MRⅦ. Precautions for using XC6206P332MRⅧ. How to...
Help you to save your cost and time.
Reliable package for your goods.
Fast Reliable Delivery to save time.
Quality premium after-sale service.