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MR256A08BMA35

Everspin Technologies Inc. MR256A08BMA35

Part Number:
MR256A08BMA35
Manufacturer:
Everspin Technologies Inc.
Ventron No:
3233306-MR256A08BMA35
Description:
IC MRAM 256KBIT 35NS 48FBGA
ECAD Model:
Datasheet:
MR256A08BMA35

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Specifications
Everspin Technologies Inc. MR256A08BMA35 technical specifications, attributes, parameters and parts with similar specifications to Everspin Technologies Inc. MR256A08BMA35.
  • Factory Lead Time
    12 Weeks
  • Mounting Type
    Surface Mount
  • Package / Case
    48-LFBGA
  • Surface Mount
    YES
  • Number of Pins
    48
  • Operating Temperature
    0°C~70°C TA
  • Packaging
    Tray
  • Published
    2010
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    48
  • ECCN Code
    EAR99
  • HTS Code
    8542.32.00.71
  • Technology
    MRAM (Magnetoresistive RAM)
  • Voltage - Supply
    3V~3.6V
  • Terminal Position
    BOTTOM
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Number of Functions
    1
  • Supply Voltage
    3.3V
  • Terminal Pitch
    0.75mm
  • Time@Peak Reflow Temperature-Max (s)
    NOT SPECIFIED
  • Pin Count
    48
  • Qualification Status
    Not Qualified
  • Supply Voltage-Max (Vsup)
    3.6V
  • Power Supplies
    3.3V
  • Supply Voltage-Min (Vsup)
    3V
  • Memory Size
    256Kb 32K x 8
  • Operating Supply Current
    65mA
  • Memory Type
    Non-Volatile
  • Operating Mode
    ASYNCHRONOUS
  • Memory Format
    RAM
  • Memory Interface
    Parallel
  • Data Bus Width
    8b
  • Organization
    32KX8
  • Memory Width
    8
  • Write Cycle Time - Word, Page
    35ns
  • Standby Current-Max
    0.007A
  • Memory Density
    262144 bit
  • Access Time (Max)
    35 ns
  • Height Seated (Max)
    1.35mm
  • Length
    8mm
  • RoHS Status
    ROHS3 Compliant
Description
MR256A08BMA35 Overview
The package or case for this particular product is a 48-LFBGA, which stands for Low-Profile Fine-Pitch Ball Grid Array. This type of packaging is known for its compact size and high pin count, making it suitable for applications that require a small form factor. The packaging for this product is a tray, which is a container used to hold and transport electronic components. The part status for this product is active, meaning it is currently in production and available for purchase. The HTS code, which is used for customs and tariff purposes, is 8542.32.00.71. The peak reflow temperature for this product is not specified, but the supply voltage is 3.3V, with a minimum of 3V. The pin count is 48, and the memory width is 8. The length of this product is 8mm, making it compact and suitable for space-constrained applications.

MR256A08BMA35 Features
Package / Case: 48-LFBGA
48 Pins


MR256A08BMA35 Applications
There are a lot of Everspin Technologies Inc.
MR256A08BMA35 Memory applications.


mainframes
multimedia computers
networking
personal computers
servers
supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer
MR256A08BMA35 More Descriptions
MRAM 256Kbit Parallel Interface 3.3V 48-Pin FBGA Tray
NVRAM 256Kb 3.3V 35ns 32Kx8 Parallel MRAM
IC RAM 256KBIT PARALLEL 48FBGA
Product Comparison
The three parts on the right have similar specifications to MR256A08BMA35.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Mounting Type
    Package / Case
    Surface Mount
    Number of Pins
    Operating Temperature
    Packaging
    Published
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    ECCN Code
    HTS Code
    Technology
    Voltage - Supply
    Terminal Position
    Peak Reflow Temperature (Cel)
    Number of Functions
    Supply Voltage
    Terminal Pitch
    Time@Peak Reflow Temperature-Max (s)
    Pin Count
    Qualification Status
    Supply Voltage-Max (Vsup)
    Power Supplies
    Supply Voltage-Min (Vsup)
    Memory Size
    Operating Supply Current
    Memory Type
    Operating Mode
    Memory Format
    Memory Interface
    Data Bus Width
    Organization
    Memory Width
    Write Cycle Time - Word, Page
    Standby Current-Max
    Memory Density
    Access Time (Max)
    Height Seated (Max)
    Length
    RoHS Status
    Width
    Mount
    Operating Supply Voltage
    Nominal Supply Current
    Density
    Word Size
    Lead Free
    Interface
    Clock Frequency
    Access Time
    Radiation Hardening
    View Compare
  • MR256A08BMA35
    MR256A08BMA35
    Everspin Technologies Inc.
    12 Weeks
    Surface Mount
    48-LFBGA
    YES
    48
    0°C~70°C TA
    Tray
    2010
    Active
    3 (168 Hours)
    48
    EAR99
    8542.32.00.71
    MRAM (Magnetoresistive RAM)
    3V~3.6V
    BOTTOM
    NOT SPECIFIED
    1
    3.3V
    0.75mm
    NOT SPECIFIED
    48
    Not Qualified
    3.6V
    3.3V
    3V
    256Kb 32K x 8
    65mA
    Non-Volatile
    ASYNCHRONOUS
    RAM
    Parallel
    8b
    32KX8
    8
    35ns
    0.007A
    262144 bit
    35 ns
    1.35mm
    8mm
    ROHS3 Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • MR256DL08BMA45R
    MR256DL08BMA45R
    Everspin Technologies Inc.
    24 Weeks
    Surface Mount
    48-LFBGA
    YES
    48
    0°C~70°C TA
    Cut Tape (CT)
    2012
    Discontinued
    3 (168 Hours)
    48
    EAR99
    8542.32.00.71
    MRAM (Magnetoresistive RAM)
    2.7V~3.6V
    BOTTOM
    260
    1
    3.3V
    0.75mm
    40
    48
    -
    3.6V
    -
    2.7V
    256Kb 32K x 8
    -
    Non-Volatile
    ASYNCHRONOUS
    RAM
    Parallel
    -
    32KX8
    8
    45ns
    -
    262144 bit
    -
    1.35mm
    8mm
    ROHS3 Compliant
    8mm
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    MR256A08BMA35 vs MR256DL08BMA45R
  • MR256A08BCYS35
    MR256A08BCYS35
    Everspin Technologies Inc.
    12 Weeks
    Surface Mount
    44-TSOP (0.400, 10.16mm Width)
    -
    44
    -40°C~85°C TA
    Tray
    2011
    Active
    3 (168 Hours)
    44
    EAR99
    8542.32.00.71
    MRAM (Magnetoresistive RAM)
    3V~3.6V
    DUAL
    NOT SPECIFIED
    1
    3.3V
    0.8mm
    NOT SPECIFIED
    44
    Not Qualified
    3.6V
    -
    3V
    256Kb 32K x 8
    65mA
    Non-Volatile
    ASYNCHRONOUS
    RAM
    Parallel
    8b
    32KX8
    8
    35ns
    0.007A
    -
    35 ns
    1.2mm
    18.41mm
    ROHS3 Compliant
    -
    Surface Mount
    3.3V
    75mA
    256 kb
    8b
    Lead Free
    -
    -
    -
    -
    MR256A08BMA35 vs MR256A08BCYS35
  • MR25H256CDC
    MR25H256CDC
    Everspin Technologies Inc.
    14 Weeks
    Surface Mount
    8-TDFN Exposed Pad
    -
    8
    -40°C~85°C TA
    Tray
    2013
    Not For New Designs
    3 (168 Hours)
    8
    EAR99
    -
    MRAM (Magnetoresistive RAM)
    2.7V~3.6V
    DUAL
    -
    1
    3V
    1.27mm
    -
    8
    -
    3.6V
    -
    2.7V
    256Kb 32K x 8
    -
    Non-Volatile
    -
    RAM
    SPI
    -
    -
    8
    -
    0.00001A
    -
    -
    1.05mm
    6mm
    ROHS3 Compliant
    5mm
    Surface Mount
    3.3V
    27mA
    256 kb
    8b
    Lead Free
    SPI, Serial
    40MHz
    10 ns
    No
    MR256A08BMA35 vs MR25H256CDC
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS
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