MK60DN512VMD10

NXP USA Inc. MK60DN512VMD10

Part Number:
MK60DN512VMD10
Manufacturer:
NXP USA Inc.
Ventron No:
3822924-MK60DN512VMD10
Description:
IC MCU 32BIT 512KB FLASH 144BGA
ECAD Model:
Datasheet:
MK60DN512VMD10

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Specifications
NXP USA Inc. MK60DN512VMD10 technical specifications, attributes, parameters and parts with similar specifications to NXP USA Inc. MK60DN512VMD10.
  • Factory Lead Time
    13 Weeks
  • Mounting Type
    Surface Mount
  • Package / Case
    144-LBGA
  • Surface Mount
    YES
  • Operating Temperature
    -40°C~105°C TA
  • Packaging
    Tray
  • Published
    2002
  • Series
    Kinetis K60
  • JESD-609 Code
    e1
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    144
  • ECCN Code
    3A991.A.2
  • Terminal Finish
    TIN SILVER COPPER OVER NICKEL
  • HTS Code
    8542.31.00.01
  • Subcategory
    Microcontrollers
  • Technology
    CMOS
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    260
  • Supply Voltage
    3.3V
  • Terminal Pitch
    1mm
  • Reflow Temperature-Max (s)
    40
  • Base Part Number
    K60DN512
  • JESD-30 Code
    S-PBGA-B144
  • Qualification Status
    Not Qualified
  • Supply Voltage-Max (Vsup)
    3.6V
  • Power Supplies
    1.8/3.3V
  • Supply Voltage-Min (Vsup)
    1.71V
  • Oscillator Type
    Internal
  • Number of I/O
    100
  • Speed
    100MHz
  • RAM Size
    128K x 8
  • Voltage - Supply (Vcc/Vdd)
    1.71V~3.6V
  • uPs/uCs/Peripheral ICs Type
    MICROCONTROLLER, RISC
  • Core Processor
    ARM® Cortex®-M4
  • Peripherals
    DMA, I2S, LVD, POR, PWM, WDT
  • Clock Frequency
    32MHz
  • Program Memory Type
    FLASH
  • Core Size
    32-Bit
  • Program Memory Size
    512KB 512K x 8
  • Connectivity
    CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
  • Supply Current-Max
    77mA
  • Bit Size
    32
  • Data Converter
    A/D 42x16b; D/A 2x12b
  • Has ADC
    YES
  • DMA Channels
    YES
  • PWM Channels
    YES
  • DAC Channels
    YES
  • ROM (words)
    524288
  • CPU Family
    CORTEX-M4
  • Height Seated (Max)
    1.7mm
  • Length
    13mm
  • Width
    13mm
  • RoHS Status
    ROHS3 Compliant
Description
MK60DN512VMD10 Description
The Surface Mount technology used for the packaging of the component is YES, and it is packaged in a tray. The part status is currently active, indicating that it is readily available for use. The HTS code for this component is 8542.31.00.01, which is the Harmonized System code used for classifying goods for international trade. The terminal pitch, or the distance between the terminals, is 1mm. The base part number for this component is K60DN512. It has an internal oscillator type, meaning it has an integrated oscillator for generating clock signals. The core size of this component is 32-bit, indicating its processing capability. In terms of connectivity, it supports CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, and USB OTG. Additionally, it has a data converter that includes an A/D converter with 42x16b resolution and a D/A converter with 2x12b resolution.

MK60DN512VMD10 Features
Rapid and easy Kinetis MCU prototyping and development
Online mbed SDK, developer community
Free software libraries
Common bootloader for all Kinetis MCUs
In-system flash programming over a serial connection: erase, program, verify


MK60DN512VMD10 Applications
Building control
Factory automation
Home automation
Industrial drivers
IoT data concentrators
Medical monitoring

MK60DN512VMD10 More Descriptions
Kinetis K 32-bit MCU, ARM Cortex-M4 core, 512KB Flash, 100MHz, Ethernet, MAPBGA 144
MCU 32-bit Kinetis K60 ARM Cortex M4 RISC 512KB Flash 1.8V/2.5V/3.3V 144-Pin MAP-BGA Tray
RISC Microcontroller, 32-Bit, FLASH, CORTEX-M4 CPU, 100MHz, CMOS, PBGA144
IC 32BIT MCU KINETIS K60 100MHZ 144-MAPBGA; Controller Family/Series:(ARM Cortex - M4) Kinetis K60; Core Size:32bit; No. of I/O's:100; Program Memory Size:512 KB; RAM Memory Size:128KB; CPU Speed:100MHz ;RoHS Compliant: Yes
MCU, KINETIS, K60, CORTEX M4, 144MAP; Controller Family/Series:(ARM Cortex - M4) Kinetis K60; Core Size:32bit; No. of I/O's:100; Supply Voltage Min:1.71V; Supply Voltage Max:3.6V; Digital IC Case Style:MAPBGA; No. of Pins:144; Program Memory Size:512KB; RAM Memory Size:128KB; CPU Speed:100MHz; Peripherals:ADC, Comparator, CRC, DAC; Embedded Interface Type:CAN, I2C, I2S, SPI, UART, USB, ETHERNET; Operating Temperature Range:-40°C to 105°C; MSL:MSL 3 - 168 hours; SVHC:No SVHC (19-Dec-2012); No. of Timers:4; Oscillator Type:External, Internal; Supply Voltage Range:1.71V to 3.6V
Device Core = ARM® Cortex® M4 / Data Bus Width Bit = 32 / Instruction Set Architecture = RISC / Family Name = Kinetis / Clock Frequency Max. MHz = 100 / Program Memory Type = Flash / Program Memory Size KB = 512 / RAM Memory Size KB = 128 / Interfaces = Ethernet / Interfaces = USB / Interfaces = CAN / Interfaces = I²C / Interfaces = SPI / Interfaces = UART / Interfaces = I²S / Interfaces = SDHC / ADC Resolution Bit = 16 / DAC Resolution Bit = 12 / Number of Programmable I/Os = 100 / Number of Timers/Counters = 9 / Comparators = 3 / Supply Voltage Min. V = 1.71 / Supply Voltage Max. V = 3.6 / Operating Temperature Min. °C = -40 / Operating Temperature Max. °C = 105 / Package Type = LBGA / Pins = 144 / Mounting Type = SMD / MSL = Level-3 / Packaging = Tray / Length mm = 13 / Width mm = 13 / Height mm = 1.7 / Reflow Temperature Max. °C = 260
Product Comparison
The three parts on the right have similar specifications to MK60DN512VMD10.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Mounting Type
    Package / Case
    Surface Mount
    Operating Temperature
    Packaging
    Published
    Series
    JESD-609 Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    ECCN Code
    Terminal Finish
    HTS Code
    Subcategory
    Technology
    Terminal Position
    Terminal Form
    Peak Reflow Temperature (Cel)
    Supply Voltage
    Terminal Pitch
    Reflow Temperature-Max (s)
    Base Part Number
    JESD-30 Code
    Qualification Status
    Supply Voltage-Max (Vsup)
    Power Supplies
    Supply Voltage-Min (Vsup)
    Oscillator Type
    Number of I/O
    Speed
    RAM Size
    Voltage - Supply (Vcc/Vdd)
    uPs/uCs/Peripheral ICs Type
    Core Processor
    Peripherals
    Clock Frequency
    Program Memory Type
    Core Size
    Program Memory Size
    Connectivity
    Supply Current-Max
    Bit Size
    Data Converter
    Has ADC
    DMA Channels
    PWM Channels
    DAC Channels
    ROM (words)
    CPU Family
    Height Seated (Max)
    Length
    Width
    RoHS Status
    EEPROM Size
    View Compare
  • MK60DN512VMD10
    MK60DN512VMD10
    13 Weeks
    Surface Mount
    144-LBGA
    YES
    -40°C~105°C TA
    Tray
    2002
    Kinetis K60
    e1
    Active
    3 (168 Hours)
    144
    3A991.A.2
    TIN SILVER COPPER OVER NICKEL
    8542.31.00.01
    Microcontrollers
    CMOS
    BOTTOM
    BALL
    260
    3.3V
    1mm
    40
    K60DN512
    S-PBGA-B144
    Not Qualified
    3.6V
    1.8/3.3V
    1.71V
    Internal
    100
    100MHz
    128K x 8
    1.71V~3.6V
    MICROCONTROLLER, RISC
    ARM® Cortex®-M4
    DMA, I2S, LVD, POR, PWM, WDT
    32MHz
    FLASH
    32-Bit
    512KB 512K x 8
    CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
    77mA
    32
    A/D 42x16b; D/A 2x12b
    YES
    YES
    YES
    YES
    524288
    CORTEX-M4
    1.7mm
    13mm
    13mm
    ROHS3 Compliant
    -
    -
  • MK60DN512ZAB10R
    -
    Surface Mount
    120-UFBGA, WLCSP
    -
    0°C~70°C TA
    Tape & Reel (TR)
    2012
    Kinetis K60
    -
    Obsolete
    1 (Unlimited)
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    K60DN512
    -
    -
    -
    -
    -
    Internal
    -
    100MHz
    128K x 8
    1.71V~3.6V
    -
    ARM® Cortex®-M4
    DMA, I2S, LVD, POR, PWM, WDT
    -
    FLASH
    32-Bit
    512KB 512K x 8
    CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
    -
    -
    A/D 38x16b; D/A 2x12b
    -
    -
    -
    -
    -
    -
    -
    -
    -
    ROHS3 Compliant
    -
  • MK60FX512VLQ15
    13 Weeks
    Surface Mount
    144-LQFP
    YES
    -40°C~105°C TA
    Tray
    2002
    Kinetis K60
    e3
    Active
    3 (168 Hours)
    144
    3A991.A.2
    Matte Tin (Sn)
    8542.31.00.01
    Microcontrollers
    CMOS
    QUAD
    GULL WING
    260
    3.3V
    0.5mm
    40
    MK60FX512
    S-PQFP-G144
    Not Qualified
    3.6V
    1.8/3.3V
    1.71V
    Internal
    100
    150MHz
    128K x 8
    1.71V~3.6V
    MICROCONTROLLER, RISC
    ARM® Cortex®-M4
    DMA, I2S, LVD, POR, PWM, WDT
    60MHz
    FLASH
    32-Bit
    512KB 512K x 8
    CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
    210mA
    32
    A/D 58x16b; D/A 2x12b
    YES
    YES
    YES
    YES
    524288
    CORTEX-M4F
    -
    20mm
    20mm
    ROHS3 Compliant
    16K x 8
  • MK60FN1M0VMD12R
    13 Weeks
    Surface Mount
    144-LBGA
    YES
    -40°C~105°C TA
    Tape & Reel (TR)
    2011
    Kinetis K60
    e1
    Active
    3 (168 Hours)
    144
    3A991.A.2
    Tin/Silver/Copper (Sn/Ag/Cu)
    8542.31.00.01
    Microcontrollers
    CMOS
    BOTTOM
    BALL
    260
    3V
    1mm
    40
    MK60FN1M0
    S-PBGA-B144
    Not Qualified
    3.6V
    1.8/3.3V
    1.71V
    Internal
    100
    120MHz
    128K x 8
    1.71V~3.6V
    MICROCONTROLLER, RISC
    ARM® Cortex®-M4
    DMA, I2S, LVD, POR, PWM, WDT
    50MHz
    FLASH
    32-Bit
    1MB 1M x 8
    CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
    177mA
    32
    A/D 58x16b; D/A 2x12b
    YES
    YES
    YES
    YES
    1048576
    CORTEX-M4F
    1.7mm
    13mm
    13mm
    ROHS3 Compliant
    -
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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