Home > Products > Integrated Circuits (ICs) > Embedded - Microcontrollers > MK60DN256VMD10
MK60DN256VMD10

NXP USA Inc. MK60DN256VMD10

Part Number:
MK60DN256VMD10
Manufacturer:
NXP USA Inc.
Ventron No:
3643170-MK60DN256VMD10
Description:
IC MCU 32BIT 256KB FLASH 144BGA
ECAD Model:
Datasheet:
MK60DN256VMD10

Quick Request Quote

Please send RFQ , We will respond immediately.

Part Number
Quantity
Company
E-mail
Phone
Comments
Specifications
NXP USA Inc. MK60DN256VMD10 technical specifications, attributes, parameters and parts with similar specifications to NXP USA Inc. MK60DN256VMD10.
  • Factory Lead Time
    13 Weeks
  • Mounting Type
    Surface Mount
  • Package / Case
    144-LBGA
  • Surface Mount
    YES
  • Operating Temperature
    -40°C~105°C TA
  • Packaging
    Tray
  • Published
    2012
  • Series
    Kinetis K60
  • JESD-609 Code
    e1
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    144
  • ECCN Code
    3A991.A.2
  • Terminal Finish
    TIN SILVER COPPER
  • HTS Code
    8542.31.00.01
  • Subcategory
    Microcontrollers
  • Technology
    CMOS
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    260
  • Supply Voltage
    3.3V
  • Terminal Pitch
    1mm
  • Reflow Temperature-Max (s)
    40
  • Base Part Number
    MK60DN256
  • JESD-30 Code
    S-PBGA-B144
  • Qualification Status
    Not Qualified
  • Supply Voltage-Max (Vsup)
    3.6V
  • Power Supplies
    1.8/3.3V
  • Supply Voltage-Min (Vsup)
    1.71V
  • Oscillator Type
    Internal
  • Number of I/O
    100
  • Speed
    100MHz
  • RAM Size
    64K x 8
  • Voltage - Supply (Vcc/Vdd)
    1.71V~3.6V
  • uPs/uCs/Peripheral ICs Type
    MICROCONTROLLER, RISC
  • Core Processor
    ARM® Cortex®-M4
  • Peripherals
    DMA, I2S, LVD, POR, PWM, WDT
  • Clock Frequency
    32MHz
  • Program Memory Type
    FLASH
  • Core Size
    32-Bit
  • Program Memory Size
    256KB 256K x 8
  • Connectivity
    CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
  • Supply Current-Max
    77mA
  • Bit Size
    32
  • Data Converter
    A/D 42x16b; D/A 2x12b
  • Has ADC
    YES
  • DMA Channels
    YES
  • PWM Channels
    YES
  • DAC Channels
    YES
  • ROM (words)
    262144
  • CPU Family
    CORTEX-M4
  • Height Seated (Max)
    1.7mm
  • Length
    13mm
  • Width
    13mm
  • RoHS Status
    ROHS3 Compliant
Description
MK60DN256VMD10 Overview
The device, which was published in 2012, is classified under the ECCN Code 3A991.A.2. It features an internal oscillator type and has a total of 100 input/output connections. The voltage supply range for this device is between 1.71V and 3.6V. It is equipped with an ARM Cortex-M4 core processor, which operates on a 32-bit core size. Additionally, this device includes an analog-to-digital converter (ADC), providing the capability to convert analog signals into digital data. It also offers pulse-width modulation (PWM) channels and digital-to-analog converter (DAC) channels, enhancing its versatility and functionality.

MK60DN256VMD10 Features
144-LBGA package
Mounting type of Surface Mount
Microcontrollers subcategory

MK60DN256VMD10 Applications
There are a lot of NXP USA Inc. MK60DN256VMD10 Microcontroller applications.

Firewalls
CD players
Toys
DVD\DV\MP3 players
Blenders
Gas monitoring systems
Electrocardiogram (EKG)
Computed Tomography (CT scan)
Fabric
Guidance-GPS
MK60DN256VMD10 More Descriptions
Kinetis K60: 100MHz Cortex-M4 MCU, 256KB Flash, 64KB SRAM, Full-Speed USB, Ethernet, 144-MAPBGA
MCU, 32BIT, CORTEX-M4, 100MHZ, MAPBGA144; Controller Family/Series:(ARM Cortex -
MCU 32-bit K60 ARM Cortex M4 RISC 256KB Flash 1.8V/2.5V/3.3V 144-Pin MAP-BGA Tray
RISC Microcontroller, 32-Bit, FLASH, CORTEX-M4 CPU, 100MHz, CMOS, PBGA144
Product Comparison
The three parts on the right have similar specifications to MK60DN256VMD10.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Mounting Type
    Package / Case
    Surface Mount
    Operating Temperature
    Packaging
    Published
    Series
    JESD-609 Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    ECCN Code
    Terminal Finish
    HTS Code
    Subcategory
    Technology
    Terminal Position
    Terminal Form
    Peak Reflow Temperature (Cel)
    Supply Voltage
    Terminal Pitch
    Reflow Temperature-Max (s)
    Base Part Number
    JESD-30 Code
    Qualification Status
    Supply Voltage-Max (Vsup)
    Power Supplies
    Supply Voltage-Min (Vsup)
    Oscillator Type
    Number of I/O
    Speed
    RAM Size
    Voltage - Supply (Vcc/Vdd)
    uPs/uCs/Peripheral ICs Type
    Core Processor
    Peripherals
    Clock Frequency
    Program Memory Type
    Core Size
    Program Memory Size
    Connectivity
    Supply Current-Max
    Bit Size
    Data Converter
    Has ADC
    DMA Channels
    PWM Channels
    DAC Channels
    ROM (words)
    CPU Family
    Height Seated (Max)
    Length
    Width
    RoHS Status
    View Compare
  • MK60DN256VMD10
    MK60DN256VMD10
    NXP USA Inc.
    13 Weeks
    Surface Mount
    144-LBGA
    YES
    -40°C~105°C TA
    Tray
    2012
    Kinetis K60
    e1
    Active
    3 (168 Hours)
    144
    3A991.A.2
    TIN SILVER COPPER
    8542.31.00.01
    Microcontrollers
    CMOS
    BOTTOM
    BALL
    260
    3.3V
    1mm
    40
    MK60DN256
    S-PBGA-B144
    Not Qualified
    3.6V
    1.8/3.3V
    1.71V
    Internal
    100
    100MHz
    64K x 8
    1.71V~3.6V
    MICROCONTROLLER, RISC
    ARM® Cortex®-M4
    DMA, I2S, LVD, POR, PWM, WDT
    32MHz
    FLASH
    32-Bit
    256KB 256K x 8
    CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
    77mA
    32
    A/D 42x16b; D/A 2x12b
    YES
    YES
    YES
    YES
    262144
    CORTEX-M4
    1.7mm
    13mm
    13mm
    ROHS3 Compliant
    -
  • MK60FN1M0VLQ15
    MK60FN1M0VLQ15
    NXP USA Inc.
    13 Weeks
    Surface Mount
    144-LQFP
    YES
    -40°C~105°C TA
    Tray
    2013
    Kinetis K60
    e3
    Active
    3 (168 Hours)
    144
    3A991.A.2
    Matte Tin (Sn)
    8542.31.00.01
    Microcontrollers
    CMOS
    QUAD
    GULL WING
    260
    3.3V
    0.5mm
    40
    MK60FN1M0
    S-PQFP-G144
    Not Qualified
    3.6V
    1.8/3.3V
    1.71V
    Internal
    100
    150MHz
    128K x 8
    1.71V~3.6V
    MICROCONTROLLER, RISC
    ARM® Cortex®-M4
    DMA, I2S, LVD, POR, PWM, WDT
    60MHz
    FLASH
    32-Bit
    1MB 1M x 8
    CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
    210mA
    32
    A/D 58x16b; D/A 2x12b
    YES
    YES
    YES
    YES
    1048576
    CORTEX-M4F
    -
    20mm
    20mm
    ROHS3 Compliant
    MK60DN256VMD10 vs MK60FN1M0VLQ15
  • MK60FN1M0VLQ12
    MK60FN1M0VLQ12
    NXP USA Inc.
    13 Weeks
    Surface Mount
    144-LQFP
    YES
    -40°C~105°C TA
    Tray
    2002
    Kinetis K60
    e3
    Active
    3 (168 Hours)
    144
    3A991.A.2
    Matte Tin (Sn)
    8542.31.00.01
    Microcontrollers
    CMOS
    QUAD
    GULL WING
    260
    3V
    0.5mm
    40
    MK60FN1M0
    S-PQFP-G144
    Not Qualified
    3.6V
    1.8/3.3V
    1.71V
    Internal
    100
    120MHz
    128K x 8
    1.71V~3.6V
    MICROCONTROLLER, RISC
    ARM® Cortex®-M4
    DMA, I2S, LVD, POR, PWM, WDT
    50MHz
    FLASH
    32-Bit
    1MB 1M x 8
    CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
    177mA
    32
    A/D 58x16b; D/A 2x12b
    YES
    YES
    YES
    YES
    1048576
    CORTEX-M4F
    1.6mm
    20mm
    20mm
    ROHS3 Compliant
    MK60DN256VMD10 vs MK60FN1M0VLQ12
  • MK60DN512ZVMC10
    MK60DN512ZVMC10
    NXP USA Inc.
    13 Weeks
    Surface Mount
    121-LFBGA
    YES
    -40°C~105°C TA
    Tray
    2013
    Kinetis K60
    e1
    Not For New Designs
    3 (168 Hours)
    121
    3A991.A.2
    TIN SILVER COPPER
    8542.31.00.01
    -
    CMOS
    BOTTOM
    BALL
    260
    3.3V
    0.65mm
    40
    K60DN512
    S-PBGA-B121
    Not Qualified
    3.6V
    -
    1.71V
    Internal
    86
    100MHz
    128K x 8
    1.71V~3.6V
    MICROCONTROLLER, RISC
    ARM® Cortex®-M4
    DMA, I2S, LVD, POR, PWM, WDT
    32MHz
    FLASH
    32-Bit
    512KB 512K x 8
    CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
    -
    32
    A/D 38x16b; D/A 2x12b
    YES
    YES
    YES
    YES
    -
    -
    1.52mm
    8mm
    8mm
    ROHS3 Compliant
    MK60DN256VMD10 vs MK60DN512ZVMC10
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS
Related parts for MK60DN256VMD10
Popular Search Part Number Related Keywords Search Tags

Latest News

  • 03 January 2024

    Application Guide for LL4148 Small Signal Diode

    Ⅰ. Overview of LL4148Ⅱ. Working principle of LL4148 diodeⅢ. Technical parameters of LL4148 diodeⅣ. Electrical characteristics of LL4148 diodeⅤ. Where is LL4148 diode used?Ⅵ. What is the difference between LL4148...
  • 03 January 2024

    Exploring the 2SK2225 Transistor's Capabilities

    Ⅰ. Introduction to 2SK2225Ⅱ. Specifications of 2SK2225Ⅲ. The manufacturer of 2SK2225Ⅳ. Absolute maximum ratings of 2SK2225Ⅴ. How to use 2SK2225?Ⅵ. Where is 2SK2225 used?Ⅶ. How to improve the...
  • 04 January 2024

    ULN2003ADR: A Powerful Chip that Drives High Current Loads

    Ⅰ. ULN2003ADR descriptionⅡ. Symbol, footprint and pin configuration of ULN2003ADRⅢ. Specifications of ULN2003ADRⅣ. What are the application fields of ULN2003ADR?Ⅴ. Simplified block diagram of ULN2003ADRⅥ. How to correctly...
  • 04 January 2024

    TPS5430DDAR Converter Replacements, Characteristics, Applications and Development

    Ⅰ. What is TPS5430DDAR?Ⅱ. Characteristics of TPS5430DDARⅢ. Specifications of TPS5430DDARⅣ. Market trend of TPS5430DDARⅤ. Pin configuration and functions of TPS5430DDARⅥ. Typical applications of TPS5430DDARⅦ. Development of TPS5430DDARTPS5430DDAR is...
  • cost

    Help you to save your cost and time.

  • package

    Reliable package for your goods.

  • fast

    Fast Reliable Delivery to save time.

  • service

    Quality premium after-sale service.