MK52DN512CMD10

NXP USA Inc. MK52DN512CMD10

Part Number:
MK52DN512CMD10
Manufacturer:
NXP USA Inc.
Ventron No:
3149880-MK52DN512CMD10
Description:
IC MCU 32BIT 512KB FLASH 144BGA
ECAD Model:
Datasheet:
MK52DN512CMD10

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Specifications
NXP USA Inc. MK52DN512CMD10 technical specifications, attributes, parameters and parts with similar specifications to NXP USA Inc. MK52DN512CMD10.
  • Factory Lead Time
    13 Weeks
  • Mounting Type
    Surface Mount
  • Package / Case
    144-LBGA
  • Surface Mount
    YES
  • Operating Temperature
    -40°C~85°C TA
  • Packaging
    Tray
  • Published
    2011
  • Series
    Kinetis K50
  • JESD-609 Code
    e1
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    144
  • ECCN Code
    3A991.A.2
  • Terminal Finish
    TIN SILVER COPPER
  • HTS Code
    8542.31.00.01
  • Subcategory
    Microcontrollers
  • Technology
    CMOS
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    260
  • Supply Voltage
    3.3V
  • Terminal Pitch
    1mm
  • Reflow Temperature-Max (s)
    40
  • Base Part Number
    MK52DN512
  • JESD-30 Code
    S-PBGA-B144
  • Qualification Status
    Not Qualified
  • Supply Voltage-Max (Vsup)
    3.6V
  • Power Supplies
    1.8/3.3V
  • Supply Voltage-Min (Vsup)
    1.71V
  • Oscillator Type
    Internal
  • Number of I/O
    96
  • Speed
    100MHz
  • RAM Size
    128K x 8
  • Voltage - Supply (Vcc/Vdd)
    1.71V~3.6V
  • uPs/uCs/Peripheral ICs Type
    MICROCONTROLLER, RISC
  • Core Processor
    ARM® Cortex®-M4
  • Peripherals
    DMA, I2S, LVD, POR, PWM, WDT
  • Clock Frequency
    50MHz
  • Program Memory Type
    FLASH
  • Core Size
    32-Bit
  • Program Memory Size
    512KB 512K x 8
  • Connectivity
    EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
  • Bit Size
    32
  • Data Converter
    A/D 41x16b; D/A 2x12b
  • Has ADC
    YES
  • DMA Channels
    YES
  • PWM Channels
    YES
  • DAC Channels
    YES
  • ROM (words)
    524288
  • CPU Family
    CORTEX-M4
  • Length
    13mm
  • Width
    13mm
  • RoHS Status
    ROHS3 Compliant
Description
MK52DN512CMD10 Description
NXP USA Inc. is the brand of this part, specifically an Embedded - Microcontrollers chip. This chip falls under the category of Embedded - Microcontrollers and has a Moisture Sensitivity Level (MSL) of 3 (168 Hours). It utilizes CMOS technology and is currently not qualified for use. The maximum supply voltage (Vsup) for this chip is 3.6V and it has a RAM size of 128K x 8. The clock frequency is 50MHz and the program memory type is FLASH. Additionally, the core size is 32-Bit and it has an ADC feature. Lastly, the CPU family for this chip is CORTEX-M4.

MK52DN512CMD10 Features
Voltage range: 1.71 to 3.6 V Flash write voltage range: 1.71 to 3.6 V Temperature range (ambient): -40 to 85°C Up to 100 MHz ARM Cortex-M4 core with DSP instructions delivering 1.25 Dhrystone MIPS per MHz Multiple low-power modes to provide power optimization based on application requirements Programmable delay block Eight-channel motor control/general purpose/PWM timer

MK52DN512CMD10 Applications
Communications equipment  Datacom module  Industrial  Test & Measurement  Enterprise systems  Enterprise projectors
MK52DN512CMD10 More Descriptions
Freescale MK52DN512CMD10, 32bit ARM Cortex M4 MCU, 100MHz, 512 kB Flash, 144-Pin MAPBGA
MCU 32-Bit K52 ARM Cortex M4 RISC 512KB Flash 1.8V/2.5V/3.3V 144-Pin MAPBGA Tray
Kinetis K 32-bit MCU, ARM Cortex-M4 core, 512KB Flash, 100MHz, Analog Measuremen
Kinetis K52: 100MHz Cortex-M4 Measurement MCU, 512KB Flash, 128KB SRAM, USB, Ethernet, 144-MAPBGA
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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