Samtec Inc. MEC1-140-02-L-D-RA1-SL

Contact Material refers to the material used to make the electrical contacts in a component. It determines the electrical conductivity, durability, and resistance to corrosion and wear of the contacts. Common contact materials include copper, silver, gold, and alloys of these metals. The choice of contact material depends on the specific application and the required performance characteristics.

Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.

Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.

Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.

Number of Positions, in the context of electronic components, refers to the number of distinct terminals or connection points available on the component. It indicates the number of individual electrical connections that can be made to the component. A higher number of positions typically allows for more complex functionality and versatility in circuit design.

Pitch, in the context of electronic components, refers to the distance between the centers of adjacent pins or terminals on a component. It is typically measured in millimeters (mm) or inches (in). The pitch determines the spacing between components on a printed circuit board (PCB) and affects the overall size and layout of the board. A smaller pitch allows for more components to be placed on a given area, but it also increases the risk of shorts and other manufacturing defects.

Card Type refers to the physical form factor of an electronic card or module. It specifies the size, shape, and pin configuration of the card, allowing it to fit into specific slots or connectors on a printed circuit board (PCB) or backplane. Common card types include PCI, PCIe, ISA, and CompactPCI, each with its own unique dimensions, pinouts, and functionality. The Card Type parameter helps ensure compatibility between the card and the system it is intended for.