NXP USA Inc. MC9S12XEP100MVL

MC9S12XEP100MVL Overview
The package is 208-BGA-shaped. There are 152 I/Os. In the case of the IC chip, the type of mounting is Surface Mount. Microcontroller is based on the 16-Bit core architecture. The type of program memory it uses is FLASH. Temperatures in the range of -40°C~125°C TA are operated by this Microcontroller. It is part of the HCS12X series of electrical components. Having a size of 1MB 1M x 8, Microcontroller has a program memory of X bytes. This device belongs to the MICROCONTROLLER, RISC uPs/uCs/Peripheral ICs category. IC Chip 208 has 208 terminations. 32-bits are used for its size. IC Chip has 1.8V volt supply outputs. With YES DMA channels, Microcontroller chip can handle large data transfers. Using the base part number MC9S12XEP100, you will be able to find alternatives for the part. Devices work in YES PWM channels. There is an embedded the CPU12 CPU family inside the device, which makes it a powerful device. As far as its frequency goes, it operates according to a 40MHz clock. In addition to the above, there are other features such as IT ALSO REQUIRES 5 V I/O SUPPLY, to name but a few.

MC9S12XEP100MVL Features
208-BGA package
Mounting type of Surface Mount
Microcontrollers subcategory


MC9S12XEP100MVL Applications
There are a lot of NXP USA Inc.
MC9S12XEP100MVL Microcontroller applications.


Instrument control
Toys
Robots
Radio
Television
Heater/Fan
Calculator
Kindle
Christmas lights
3D printers