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MC68360ZQ33L

NXP USA Inc. MC68360ZQ33L

Part Number:
MC68360ZQ33L
Manufacturer:
NXP USA Inc.
Ventron No:
3667588-MC68360ZQ33L
Description:
IC MPU M683XX 33MHZ 357BGA
ECAD Model:
Datasheet:
MC68360ZQ33L

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Specifications
NXP USA Inc. MC68360ZQ33L technical specifications, attributes, parameters and parts with similar specifications to NXP USA Inc. MC68360ZQ33L.
  • Package / Case
    357-BBGA
  • Surface Mount
    YES
  • Operating Temperature
    0°C~70°C TA
  • Packaging
    Tray
  • Published
    1995
  • Series
    M683xx
  • JESD-609 Code
    e0
  • Part Status
    Last Time Buy
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    357
  • ECCN Code
    3A991.A.2
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • HTS Code
    8542.31.00.01
  • Technology
    CMOS
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    260
  • Supply Voltage
    5V
  • Terminal Pitch
    1.27mm
  • Reflow Temperature-Max (s)
    40
  • Base Part Number
    MC68360
  • JESD-30 Code
    S-PBGA-B357
  • Supply Voltage-Max (Vsup)
    5.25V
  • Supply Voltage-Min (Vsup)
    4.75V
  • Speed
    33MHz
  • uPs/uCs/Peripheral ICs Type
    SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
  • Core Processor
    CPU32
  • Clock Frequency
    25MHz
  • Address Bus Width
    32
  • Boundary Scan
    YES
  • Low Power Mode
    YES
  • External Data Bus Width
    32
  • Voltage - I/O
    5.0V
  • Ethernet
    10Mbps (1)
  • Number of Cores/Bus Width
    1 Core 32-Bit
  • Graphics Acceleration
    No
  • RAM Controllers
    DRAM
  • Additional Interfaces
    SCC, SMC, SPI
  • Co-Processors/DSP
    Communications; CPM
  • Bus Compatibility
    MC68040; MC68030
  • Data Transfer Rate-Max
    1.25 MBps
  • Communication Protocol
    BISYNC, HDLC; ETHERNET, PROFIBUS; SS7 TRANSPARENT; X.21; V.14; UART; APPLE TALK; DDCMP
  • Data Encoding/Decoding Method
    NRZ; NRZI-MARK; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER); DIFF BIPH-LEVEL
  • Height Seated (Max)
    1.86mm
  • Length
    25mm
  • RoHS Status
    Non-RoHS Compliant
Description
MC68360ZQ33L Overview
NXP USA Inc. is the brand of this part, which is an Embedded - Microprocessors chip in the Embedded - Microprocessors category. The package/case is 357-BBGA and the ECCN Code is 3A991.A.2. The HTS Code is 8542.31.00.01 and the Reflow Temperature-Max (s) is 40. The JESD-30 Code is S-PBGA-B357 and the Supply Voltage-Min (Vsup) is 4.75V. The clock frequency is 25MHz and the voltage - I/O is 5.0V. Ethernet is supported at 10Mbps (1) and the Data Transfer Rate-Max is 1.25 MBps.

MC68360ZQ33L Features
CPU32 Core

MC68360ZQ33L Applications
There are a lot of NXP USA Inc. MC68360ZQ33L Microprocessor applications.

Set-top boxes
Microwave ovens
Ipad
Guidance-GPS
Embedded gateways
Industrial instrumentation devices
PDAs, game consoles
Security systems
Dishwashers
Safety -airbags, automatic braking system (ABS)
MC68360ZQ33L More Descriptions
MPU ColdFire M683xx Processor RISC 32-Bit 0.57um 33MHz 357-Pin BGA Tray
CPU32 Microprocessor IC M683xx 1 Core, 32-Bit 33MHz 357-PBGA (25x25)
Microprocessors - MPU QUICC SIM 4SCC
QUAD INTEGRATED COMMUNICATION CO
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS
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