NXP USA Inc. MC33911BAC

Name: MC33911BAC
Brand: NXP USA Inc.
SKU: 3840761-MC33911BAC
Availability: InStock
Rating: 5 (1 reviews)

Part Number:: MC33911BAC

Manufacturer:: NXP USA Inc.

Ventron No:: 3840761-MC33911BAC

Description:: IC SYSTEM BASIS CHIP 32LQFP

ECAD Model:

Datasheet:: MC33911BAC

Specifications

NXP USA Inc. MC33911BAC technical specifications, attributes, parameters and parts with similar specifications to NXP USA Inc. MC33911BAC.

Factory Lead Time
12 Weeks
Mounting Type
Surface Mount
Package / Case
32-LQFP
Surface Mount
YES
Operating Temperature
-40°C~125°C
Packaging
Tray
Published
2004
JESD-609 Code
e3
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
32
ECCN Code
EAR99
Terminal Finish
MATTE TIN
Applications
System Basis Chip
HTS Code
8542.39.00.01
Voltage - Supply
5.5V~27V
Terminal Position
QUAD
Terminal Form
GULL WING
Peak Reflow Temperature (Cel)
260
Number of Functions
1
Supply Voltage
13.5V
Terminal Pitch
0.8mm
Reflow Temperature-Max (s)
40
Base Part Number
MC33911
JESD-30 Code
S-PQFP-G32
Qualification Status
Not Qualified
Current - Supply
4.5mA
Interface IC Type
BUFFER OR INVERTER BASED PERIPHERAL DRIVER
Turn On Time
10 µs
Output Peak Current Limit-Nom
0.11A
Turn Off Time
10 µs
Built-in Protections
OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE
Output Current Flow Direction
SOURCE SINK
Height Seated (Max)
1.6mm
Length
7mm
Width
7mm
RoHS Status
ROHS3 Compliant

Description

MC33911BAC Overview
The HTS Code 8542.39.00.01 is a unique code that identifies a specific type of product. This particular product has 1 function, making it simple and efficient. The reflow temperature-max (s) for this product is 40, ensuring that it can withstand high temperatures without malfunctioning. The current supply for this product is 4.5mA, providing enough power for it to function properly. The interface IC type for this product is BUFFER OR INVERTER BASED PERIPHERAL DRIVER, which allows for smooth communication between different components. Additionally, this product has a built-in protection system that includes OVER CURRENT, OVER VOLTAGE, THERMAL, and UNDER VOLTAGE protections. With a length and width of 7mm, this product is compact and easy to integrate into various systems. It is also important to note that this product is ROHS3 compliant, meaning it meets the standards for environmental safety.

MC33911BAC Features
Mainly used in System Basis Chip applications
Operating temperature: -40°C~125°C

MC33911BAC Applications
There are a lot of NXP USA Inc. MC33911BACPower Management applications.

4K Ultra High Definition (UHD) Display
LTE modem
Camera Power Applications
Server Backplane Systems
FPGA
LP2996A: DDR2
Digital Cores
Data Storage
Chromebook
Modules With Remote-Sense Capability

MC33911BAC More Descriptions

System Basis Chip, LIN, 1x 5.0V/60mA LDOs, DC Motor Predriver, QFP 32, Tray
MC33911 Tray Surface Mount SOURCE SINK pmic power management device 7mm 13.5V -40C~125C 4.5mA
Pref DRVR Dual 5.5V to 18V 32-Pin LQFP Tray
SYSTEM BASIS CHIP, -40 TO 125DEG C, LQFP; Product Range:-; IC Case / Package:LQFP; No. of Pins:32Pins; Supply Voltage Min:5.5V; Supply Voltage Max:18V; Protocol Supported:LIN; Supported Standards:LIN 2.0/2.1, SAE J2602-2 RoHS Compliant: Yes
LIN Transceivers SBC LIN2G MEDIUM END

Certification